Wire-to-board Connector Market Outlook (2022 to 2032)

Global wire-to-board connector sales surpassed a valuation of US$ 4.7 billion in 2022. From 2017 to 2021, demand for wire-to-board connector was rising at 4.1% CAGR. The global wire-to-board connector market size is projected to expand from US$ 4.6 billion in 2021 to US$ 9.0 billion by 2032.

Wire-to-board connector is anticipated to remain a highly preferred technology in the market. A CAGR of around 6.6% over the forecast period 2022 to 2032 has been predicted by Future Market Insights (FMI). This is due to the rising usage of wire-to-board connector in a fast-moving world.

Wire-to-board connector systems meet the rapidly changing needs of the electronics sector by providing a single system with different connectors and voltage configurations. This allows manufacturers to design different models based on a single connector type and footprint pattern.

Wire-to-board connector designs range from miniature to high-performance industrial connectors while meeting the needs of consumers. This simplifies maintenance, manufacturing, and repair-related issues and reduces machine downtime as specifically affected subsystems can be easily replaced.

The wire-to-board connector industry is expected to be driven by increasing usage across the consumer electronics sector as well as applications in connecting peripherals. This is due to the growing application of computer and communication technology around the world.

Growing demand for high-speed connections and transmission bandwidth are also factors driving the growth of the wire-to-board connector industry. A key factor driving this market is the emergence of IoT technology. This is due to the growing demand for high bandwidth, high-speed connectivity, and its applications in several consumer sectors.

The market is projected to witness surging popularity for 2.54mm pitch wire-to-board connector products during the forecast period. This is primarily due to the increased control of HVAC systems in homes where air conditioners and heaters, washing machines, refrigerators, ovens, and countertops are the most common.

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What are Some Key Trends in the Market?

  • Miniature connectors with high-density contact arrays are gaining popularity in several industries such as mobile, wearables, and IoT applications.
  • With the growing demand for faster and more reliable data transmission, wire connectors have been developed to support higher data rates and reliable data transmission.
  • As electronic devices consume more power and become highly energy efficient, wire-to-board connector have been developed to meet the increasing power requirements.
  • Connectors in the wire-to-board connector market are expected to meet stringent reliability and durability standards to ensure sustained performance, especially in demanding environments.
  • Automated assembly processes for wire-to-board connector have become more important as electronics become more complex.
  • Designed for easy automated assembly and inspection, wire-to-board connector help reduce production time and costs.
Attributes Key Insights
Estimated Global Wire-to-board Connector Market Size (2022) US$ 4.7 billion
Projected Market Value (2032) US$ 9.0 billion
Value-based CAGR (2022 to 2032) 6.6%
Historical CAGR (2017 to 2021) 4.1%

2017 to 2021 Wire-to-board Connector Sales Analysis Compared to Demand Forecast from 2022 to 2032

Global sales of wire-to-board connector increased at around 4.1% CAGR during the historical period from 2017 to 2021. Over the projection period, global wire-to-board connector demand is forecast to increase at 6.6% CAGR. The worldwide market for wire-to-board connector is anticipated to generate an absolute $ opportunity of US$ 4.3 billion through 2032.

Global events, trade disputes, and supply chain disruptions, such as those seen during the pandemic, are impacting the production and distribution of components. This includes wire-to-board connectors, leading to market disruptions. It can lead to uncertainties and limitations.

The rapidly evolving technology landscape requires connector designs that meet the changing needs of electronic devices. Connector manufacturers had to invest in research and development to adapt their products to new design requirements.

Different sectors have diverse requirements for connectors, creating a trend to develop application-specific wire-to-board connectors. These specialty connectors are tailored to the specific needs of sectors such as automotive, medical, aerospace, and consumer electronics.

For instance, automotive electronics and industrial equipment needed connectors that could withstand higher operating temperatures. To meet these requirements, manufacturers have considered using advanced materials.

Compliance with industry standards and regulations is very important in the wire-to-board connector market. Manufacturers focus on obtaining certifications and complying with standards such as RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) to meet environmental and safety requirements.

Alternative connection technologies such as flex circuits, chip-on-board (COB), and wire bonding are preferred over traditional wire-to-board connector in certain sectors and applications. These alternatives may offer certain advantages or cost savings and limit connector market growth in these areas.

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Sudip Saha

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Which Factors Are Restraining Growth in the Wire-to-board Connector Industry?

  • In mature sectors such as consumer electronics, the demand for wire-to-board connector may have reached a saturation point.
  • Increasing adoption of wireless technologies such as Bluetooth, Wi-Fi, and NFC in diverse applications challenges the wire-to-board connector industry.
  • As connectors become smaller and more complex, it becomes increasingly difficult to manufacture them cost-effectively without compromising performance and reliability.
  • Customers often demand cost-effective solutions, requiring connector manufacturers to optimize production processes and materials without sacrificing quality.

Country-wise Insights

Is the United States a Prominent Market for Wire-to-board Connector?

Growing Popularity of Innovative Technology to Elevate Wire-to-Board Demand in the United States

The United States wire-to-board connector market is forecast to expand at 5.5% CAGR through 2032 in comparison to the 1.2% CAGR registered from 2017 to 2021. Overall wire-to-board connector sales revenue in the country is likely to total around US$ 1.4 billion by 2032.

The United States has a strong and innovative technology sector with a strong focus on research and development. The focus on technological advancements has led to the development and deployment of cutting-edge electronic devices and systems. These systems often require advanced wire-to-board connector connections.

The United States economy includes a range of sectors including automotive, aerospace, telecommunications, healthcare, consumer electronics, and others. Each of these fields relies heavily on electronic devices and circuits, driving demand for wire-to-board connector in a host of applications.

The United States is one of the world's leading markets for electronic products, including smartphones, tablets, computers, and other consumer electronics. These devices often use wire-to-board connector to establish connections between components on the circuit board.

The United States is a key player in the global automotive and aerospace sectors, both of which require high-quality, reliable wire-to-board connector for critical applications. These applications include engine control systems, avionics, and in-flight entertainment.

Is Japan a Promising Market for Wire-to-board Connector?

Widespread Upgrades to Telecommunication Infrastructure Bolstering Wire-to-board Connector Sales

Wire-to-board Connector demand in Japan increased at 4.4% CAGR from 2017 to 2021. Over the forecast period, Japan's wire-to-board connector market is set to thrive at 6.9% CAGR, reaching a valuation of US$ 1.4 billion by 2032.

Japan has a large network of manufacturers capable of producing quality wire-to-board connector, from large corporations to small specialty firms. The country's innovation ecosystem is driving the development of new connectivity technologies and solutions.

Japan has an established telecommunications infrastructure and has witnessed a continuous expansion of networks, data centers, and telecommunications technology. This has increased the demand for advanced wire-to-board connector capable of high-speed data transmission.

Japan is also a key market for medical machinery and devices, many of which rely on wire connectors for accurate and reliable connections.

The growth of the Internet of Things (IoT) market and the proliferation of smart devices are increasing the need for small, reliable, and efficient wire-to-board connector in connected devices and wearables.

Japan has regulations and standards that promote product safety, reliability, and environmental responsibility, and promote the use of compliant, high-quality wire-to-board connector.

Will China Retain its Dominance Over the Wire-to-board Connector Market?

Favorable Government Policies to Create Growth Prospects for the Wire-to-board Connector Manufacturers

China's wire-to-board connector market registered a CAGR of 6.2% between 2017 and 2021. For the forecast period, wire-to-board connector sales are likely to surge at 8.1% CAGR. This is projected to steer the market past US$ 2.4 billion by 2032.

China's domestic market for electronics and applications is growing rapidly due to its large population and increasing disposable income. This growth has increased the demand for domestic wire-to-board connector.

Government of China has actively promoted the development of the electronics sector and invested in research and development and infrastructure to support the growth of domestic electronics manufacturing.

China has become a global export center for electronics and electronic components, including wire-to-board connector. Several international companies source their components from manufacturers in China because of their cost advantages and production capacity.

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Category-wise Insights

Which is the Highly Popular Style in the Wire-to-board Connector Industry?

Housing Segment to Lead the Wire-to-Board Style Segment

As per Future Market Insights (FMI), the housing segment is projected to remain highly popular style in wire-to-board connector production. The segment grew at around 3.9% CAGR from 2017 to 2021. Over the projection period, it is anticipated to register a growth rate of 6.2%.

In the context of connectors, "housing" usually refers to the plastic or metal housing that surrounds and protects the connector contacts. Enclosures are essential for maintaining the integrity of electrical connections, protecting them from the environment, and providing a safe and reliable means of connection.

Housing styles and designs vary widely depending on the application, connector type, and specific needs of the electronic device or electrical system. Common package types in the wire-to-board connector industry include:

  • Rectangular housing: These are the most common types of connector housings and are widely used in various industries. They come in a variety of sizes and configurations, and the contacts are typically arranged in rows and columns.
  • Shrouded housing: These housings have protective features that help guide and align mating connectors, preventing misalignment and damage during mating.
  • Stackable case: Stackable connectors feature housings that can be stacked on top of each other, providing a space-saving solution for PCB applications where board space is limited.
  • Locks or locking mechanisms: Some connector housings are designed with locking or latching mechanisms that ensure a secure and reliable connection, especially in applications subject to vibration or motion.
  • Waterproof or sealed case: Housings with waterproof or hermetic properties are used in applications where connectors must be protected from moisture, dust, and other environmental factors.

Which Pitch Size of Wire-to-board Connector is Expected to Lead Sales?

2.54 mm Segment to Generate Lucrative Revenues Through 2032

The 2.54 mm (0.1 inch) pitch size is a widely used size and has been a standard in the electronics sector for several years. It is commonly used in a variety of applications such as hobby electronics, prototyping boards, and PCB-to-PCB connections in general.

This small pitch size is often used in applications where high-density connections are required. Laptops, tablets, and small appliances. This fine-pitch connector is used in more advanced electronics and smaller devices where space constraints are critical, such as: For instance, smartphones and wearable devices.

The 2.54mm pitch size is commonly used in high-density applications such as modern consumer electronics, medical equipment, and certain industrial equipment. It also finds usage in high-end applications with very high-density requirements. These include high-performance computers, servers, and data centers.

From 2017 to 2021, the 2.54 mm segment grew at a CAGR of 4.0%. Over the forecast period 2022 to 2032, it is projected to progress at 6.4% CAGR and continue remaining the top revenue generation segment.

Competitive Landscape

Leading wire-to-board connector producing companies are focusing on increasing demand capacities to meet the growing demand for advanced technology. Leading manufacturers are also using strategies such as mergers, partnerships, acquisitions, and acquisitions to solidify their positions.

Recent developments:

  • In September 2019, Molex released MicroTPA 2.00mm wire-to-board connector and wire-to-wire connector systems that provide electrical and mechanical reliability in high-temperature designs to meet the needs of several industries.
  • In September 2019, Measurement Specialtys Inc., a subsidiary of TE Connectivity Ltd., entered into a definitive agreement to acquire Silicon Microstructures Inc. from Elmos Semiconductor AG.

Scope of Report

Attributes Details
Estimated Market Size (2022) US$ 4.7 billion
Projected Market Value (2032) US$ 9.0 billion
Anticipated Growth Rate (2022 to 2032) 6.6% CAGR
Forecast Period 2022 to 2032
Historical Data Available for 2017 to 2021
Industry Analysis US$ billion for Value and Kilo Tons for Volume
Key Countries Covered The United Kingdom, Japan, China, The United States, South Korea
Key Segments Covered Size, Pitch Size, Application, and Region
Key Companies Profiled Molex Incorporated; Te Connectivity Ltd.; Amphenol Corporation; Samtec Inc; Japan Aviation Electronics Industry, Ltd.; C&K Components, Inc.; Kyocera Corp.; J.S.T. Mfg. Co., Ltd.; HARTING Technology Group; ERNI Group; Phoenix Contact GmbH & Co. KG; Wago Holding GmbH
Report Coverage Market Forecast, Company Share Analysis, Competition Intelligence, DROT Analysis, Market Dynamics and Challenges, and Strategic Growth Initiatives

Wire-to-board Connector Market Segmentation

By Style:

  • Accessory
  • Header
  • Housing
  • Plug
  • Receptacle
  • Socket

By Pitch Size:

  • 0.8mm
  • 1.0mm
  • 1.25mm
  • 1.27mm
  • 2.0mm
  • 2.5mm
  • 2.54mm
  • 3.3mm
  • 3.96mm
  • 5.0mm
  • 7.92mm
  • 10.16mm

By Application:

  • Computer and Peripherals
  • Medical
  • Industrial and Instrumentation
  • Data/Telecom
  • Automotive
  • Aerospace and Defense
  • Others

By Region:

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa

Frequently Asked Questions

What was the global wire-to-board connector industry size in 2021?

The global market size reached US$ 4.6 billion in 2021.

What is the current value of the global industry for wire-to-board?

The global wire-to-board connector industry value is set to reach US$ 4.7 billion in 2022.

What is the expected valuation of the worldwide wire-to-board connector industry in 2032?

The global wire-to-board connector industry will exceed a valuation of US$ 9.0 billion by 2032

What value CAGR did the market exhibit over the last 4 years?

The worldwide market for wire-to-board connector registered a CAGR of 4.1% over the last 4 years.

At what rate will global demand for wire-to-board connector increase from 2022 to 2032?

Global wire-to-board connector demand is forecast to rise at a CAGR of 6.6% from 2022 to 2032.

Table of Content

1. Executive Summary

    1.1. Global Market Outlook

    1.2. Demand to side Trends

    1.3. Supply to side Trends

    1.4. Technology Roadmap Analysis

    1.5. Analysis and Recommendations

2. Market Overview

    2.1. Market Coverage / Taxonomy

    2.2. Market Definition / Scope / Limitations

3. Market Background

    3.1. Market Dynamics

        3.1.1. Drivers

        3.1.2. Restraints

        3.1.3. Opportunity

        3.1.4. Trends

    3.2. Scenario Forecast

        3.2.1. Demand in Optimistic Scenario

        3.2.2. Demand in Likely Scenario

        3.2.3. Demand in Conservative Scenario

    3.3. Opportunity Map Analysis

    3.4. Product Life Cycle Analysis

    3.5. Supply Chain Analysis

        3.5.1. Supply Side Participants and their Roles

            3.5.1.1. Producers

            3.5.1.2. Mid to Level Participants (Traders/ Agents/ Brokers)

            3.5.1.3. Wholesalers and Distributors

        3.5.2. Value Added and Value Created at Node in the Supply Chain

        3.5.3. List of Raw Material Suppliers

        3.5.4. List of Existing and Potential Buyer’s

    3.6. Investment Feasibility Matrix

    3.7. Value Chain Analysis

        3.7.1. Profit Margin Analysis

        3.7.2. Wholesalers and Distributors

        3.7.3. Retailers

    3.8. PESTLE and Porter’s Analysis

    3.9. Regulatory Landscape

        3.9.1. By Key Regions

        3.9.2. By Key Countries

    3.10. Regional Parent Market Outlook

    3.11. Production and Consumption Statistics

    3.12. Import and Export Statistics

4. Global Market Analysis 2017 to 2021 and Forecast, 2022 to 2032

    4.1. Historical Market Size Value (US$ million) & Volume (Units) Analysis, 2017 to 2021

    4.2. Current and Future Market Size Value (US$ million) & Volume (Units) Projections, 2022 to 2032

        4.2.1. Y to Y Growth Trend Analysis

        4.2.2. Absolute $ Opportunity Analysis

5. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Style

    5.1. Introduction / Key Findings

    5.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Style, 2017 to 2021

    5.3. Current and Future Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Style, 2022 to 2032

        5.3.1. Accessory

        5.3.2. Header

        5.3.3. Housing

        5.3.4. Plug

        5.3.5. Receptacle

        5.3.6. Socket

    5.4. Y to Y Growth Trend Analysis By Style, 2017 to 2021

    5.5. Absolute $ Opportunity Analysis By Style, 2022 to 2032

6. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Pitch Size

    6.1. Introduction / Key Findings

    6.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Pitch Size, 2017 to 2021

    6.3. Current and Future Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Pitch Size, 2022 to 2032

        6.3.1. 0.8mm

        6.3.2. 1.0mm

        6.3.3. 1.25mm

        6.3.4. 1.27mm

        6.3.5. 2.0mm

        6.3.6. 2.5mm

        6.3.7. 2.54mm

        6.3.8. 3.3mm

        6.3.9. 3.96mm

        6.3.10. 5.0mm

        6.3.11. 7.92mm

        6.3.12. 10.16mm

    6.4. Y to Y Growth Trend Analysis By Pitch Size, 2017 to 2021

    6.5. Absolute $ Opportunity Analysis By Pitch Size, 2022 to 2032

7. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Application

    7.1. Introduction / Key Findings

    7.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Application, 2017 to 2021

    7.3. Current and Future Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Application, 2022 to 2032

        7.3.1. Computer and Peripherals

        7.3.2. Medical

        7.3.3. Industrial and Instrumentation

        7.3.4. Data/Telecom

        7.3.5. Automotive

        7.3.6. Aerospace and Defense

        7.3.7. Others

    7.4. Y to Y Growth Trend Analysis By Application, 2017 to 2021

    7.5. Absolute $ Opportunity Analysis By Application, 2022 to 2032

8. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Region

    8.1. Introduction

    8.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Region, 2017 to 2021

    8.3. Current Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Region, 2022 to 2032

        8.3.1. North America

        8.3.2. Latin America

        8.3.3. Europe

        8.3.4. Asia Pacific

        8.3.5. Middle East and Africa

    8.4. Market Attractiveness Analysis By Region

9. North America Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country

    9.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021

    9.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032

        9.2.1. By Country

            9.2.1.1. The United States

            9.2.1.2. Canada

        9.2.2. By Style

        9.2.3. By Pitch Size

        9.2.4. By Application

    9.3. Market Attractiveness Analysis

        9.3.1. By Country

        9.3.2. By Style

        9.3.3. By Pitch Size

        9.3.4. By Application

    9.4. Key Takeaways

10. Latin America Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country

    10.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021

    10.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032

        10.2.1. By Country

            10.2.1.1. Brazil

            10.2.1.2. Mexico

            10.2.1.3. Rest of Latin America

        10.2.2. By Style

        10.2.3. By Pitch Size

        10.2.4. By Application

    10.3. Market Attractiveness Analysis

        10.3.1. By Country

        10.3.2. By Style

        10.3.3. By Pitch Size

        10.3.4. By Application

    10.4. Key Takeaways

11. Europe Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country

    11.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021

    11.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032

        11.2.1. By Country

            11.2.1.1. Germany

            11.2.1.2. The United Kingdom

            11.2.1.3. France

            11.2.1.4. Spain

            11.2.1.5. Italy

            11.2.1.6. Rest of Europe

        11.2.2. By Style

        11.2.3. By Pitch Size

        11.2.4. By Application

    11.3. Market Attractiveness Analysis

        11.3.1. By Country

        11.3.2. By Style

        11.3.3. By Pitch Size

        11.3.4. By Application

    11.4. Key Takeaways

12. Asia Pacific Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country

    12.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021

    12.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032

        12.2.1. By Country

            12.2.1.1. China

            12.2.1.2. Japan

            12.2.1.3. South Korea

            12.2.1.4. Singapore

            12.2.1.5. Thailand

            12.2.1.6. Indonesia

            12.2.1.7. Australia

            12.2.1.8. New Zealand

            12.2.1.9. Rest of Asia Pacific

        12.2.2. By Style

        12.2.3. By Pitch Size

        12.2.4. By Application

    12.3. Market Attractiveness Analysis

        12.3.1. By Country

        12.3.2. By Style

        12.3.3. By Pitch Size

        12.3.4. By Application

    12.4. Key Takeaways

13. Middle East and Africa Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country

    13.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021

    13.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032

        13.2.1. By Country

            13.2.1.1. GCC Countries

            13.2.1.2. South Africa

            13.2.1.3. Israel

            13.2.1.4. Rest of Middle East and Africa

        13.2.2. By Style

        13.2.3. By Pitch Size

        13.2.4. By Application

    13.3. Market Attractiveness Analysis

        13.3.1. By Country

        13.3.2. By Style

        13.3.3. By Pitch Size

        13.3.4. By Application

    13.4. Key Takeaways

14. Key Countries Market Analysis

    14.1. The United States

        14.1.1. Pricing Analysis

        14.1.2. Market Share Analysis, 2021

            14.1.2.1. By Style

            14.1.2.2. By Pitch Size

            14.1.2.3. By Application

    14.2. Canada

        14.2.1. Pricing Analysis

        14.2.2. Market Share Analysis, 2021

            14.2.2.1. By Style

            14.2.2.2. By Pitch Size

            14.2.2.3. By Application

    14.3. Brazil

        14.3.1. Pricing Analysis

        14.3.2. Market Share Analysis, 2021

            14.3.2.1. By Style

            14.3.2.2. By Pitch Size

            14.3.2.3. By Application

    14.4. Mexico

        14.4.1. Pricing Analysis

        14.4.2. Market Share Analysis, 2021

            14.4.2.1. By Style

            14.4.2.2. By Pitch Size

            14.4.2.3. By Application

    14.5. Germany

        14.5.1. Pricing Analysis

        14.5.2. Market Share Analysis, 2021

            14.5.2.1. By Style

            14.5.2.2. By Pitch Size

            14.5.2.3. By Application

    14.6. The United Kingdom

        14.6.1. Pricing Analysis

        14.6.2. Market Share Analysis, 2021

            14.6.2.1. By Style

            14.6.2.2. By Pitch Size

            14.6.2.3. By Application

    14.7. France

        14.7.1. Pricing Analysis

        14.7.2. Market Share Analysis, 2021

            14.7.2.1. By Style

            14.7.2.2. By Pitch Size

            14.7.2.3. By Application

    14.8. Spain

        14.8.1. Pricing Analysis

        14.8.2. Market Share Analysis, 2021

            14.8.2.1. By Style

            14.8.2.2. By Pitch Size

            14.8.2.3. By Application

    14.9. Italy

        14.9.1. Pricing Analysis

        14.9.2. Market Share Analysis, 2021

            14.9.2.1. By Style

            14.9.2.2. By Pitch Size

            14.9.2.3. By Application

    14.10. China

        14.10.1. Pricing Analysis

        14.10.2. Market Share Analysis, 2021

            14.10.2.1. By Style

            14.10.2.2. By Pitch Size

            14.10.2.3. By Application

    14.11. Japan

        14.11.1. Pricing Analysis

        14.11.2. Market Share Analysis, 2021

            14.11.2.1. By Style

            14.11.2.2. By Pitch Size

            14.11.2.3. By Application

    14.12. South Korea

        14.12.1. Pricing Analysis

        14.12.2. Market Share Analysis, 2021

            14.12.2.1. By Style

            14.12.2.2. By Pitch Size

            14.12.2.3. By Application

    14.13. Singapore

        14.13.1. Pricing Analysis

        14.13.2. Market Share Analysis, 2021

            14.13.2.1. By Style

            14.13.2.2. By Pitch Size

            14.13.2.3. By Application

    14.14. Thailand

        14.14.1. Pricing Analysis

        14.14.2. Market Share Analysis, 2021

            14.14.2.1. By Style

            14.14.2.2. By Pitch Size

            14.14.2.3. By Application

    14.15. Indonesia

        14.15.1. Pricing Analysis

        14.15.2. Market Share Analysis, 2021

            14.15.2.1. By Style

            14.15.2.2. By Pitch Size

            14.15.2.3. By Application

    14.16. Australia

        14.16.1. Pricing Analysis

        14.16.2. Market Share Analysis, 2021

            14.16.2.1. By Style

            14.16.2.2. By Pitch Size

            14.16.2.3. By Application

    14.17. New Zealand

        14.17.1. Pricing Analysis

        14.17.2. Market Share Analysis, 2021

            14.17.2.1. By Style

            14.17.2.2. By Pitch Size

            14.17.2.3. By Application

    14.18. GCC Countries

        14.18.1. Pricing Analysis

        14.18.2. Market Share Analysis, 2021

            14.18.2.1. By Style

            14.18.2.2. By Pitch Size

            14.18.2.3. By Application

    14.19. South Africa

        14.19.1. Pricing Analysis

        14.19.2. Market Share Analysis, 2021

            14.19.2.1. By Style

            14.19.2.2. By Pitch Size

            14.19.2.3. By Application

    14.20. Israel

        14.20.1. Pricing Analysis

        14.20.2. Market Share Analysis, 2021

            14.20.2.1. By Style

            14.20.2.2. By Pitch Size

            14.20.2.3. By Application

15. Market Structure Analysis

    15.1. Competition Dashboard

    15.2. Competition Benchmarking

    15.3. Market Share Analysis of Top Players

        15.3.1. By Regional

        15.3.2. By Style

        15.3.3. By Pitch Size

        15.3.4. By Application

16. Competition Analysis

    16.1. Competition Deep Dive

        16.1.1. Molex Incorporated

            16.1.1.1. Overview

            16.1.1.2. Product Portfolio

            16.1.1.3. Profitability by Market Segments

            16.1.1.4. Sales Footprint

            16.1.1.5. Strategy Overview

                16.1.1.5.1. Marketing Strategy

                16.1.1.5.2. Product Strategy

                16.1.1.5.3. Channel Strategy

        16.1.2. Te Connectivity Ltd.

            16.1.2.1. Overview

            16.1.2.2. Product Portfolio

            16.1.2.3. Profitability by Market Segments

            16.1.2.4. Sales Footprint

            16.1.2.5. Strategy Overview

                16.1.2.5.1. Marketing Strategy

                16.1.2.5.2. Product Strategy

                16.1.2.5.3. Channel Strategy

        16.1.3. Amphenol Corporation

            16.1.3.1. Overview

            16.1.3.2. Product Portfolio

            16.1.3.3. Profitability by Market Segments

            16.1.3.4. Sales Footprint

            16.1.3.5. Strategy Overview

                16.1.3.5.1. Marketing Strategy

                16.1.3.5.2. Product Strategy

                16.1.3.5.3. Channel Strategy

        16.1.4. Samtec Inc

            16.1.4.1. Overview

            16.1.4.2. Product Portfolio

            16.1.4.3. Profitability by Market Segments

            16.1.4.4. Sales Footprint

            16.1.4.5. Strategy Overview

                16.1.4.5.1. Marketing Strategy

                16.1.4.5.2. Product Strategy

                16.1.4.5.3. Channel Strategy

        16.1.5. Japan Aviation Electronics Industry, Ltd.

            16.1.5.1. Overview

            16.1.5.2. Product Portfolio

            16.1.5.3. Profitability by Market Segments

            16.1.5.4. Sales Footprint

            16.1.5.5. Strategy Overview

                16.1.5.5.1. Marketing Strategy

                16.1.5.5.2. Product Strategy

                16.1.5.5.3. Channel Strategy

        16.1.6. C&K Components, Inc.

            16.1.6.1. Overview

            16.1.6.2. Product Portfolio

            16.1.6.3. Profitability by Market Segments

            16.1.6.4. Sales Footprint

            16.1.6.5. Strategy Overview

                16.1.6.5.1. Marketing Strategy

                16.1.6.5.2. Product Strategy

                16.1.6.5.3. Channel Strategy

        16.1.7. Kyocera Corp.

            16.1.7.1. Overview

            16.1.7.2. Product Portfolio

            16.1.7.3. Profitability by Market Segments

            16.1.7.4. Sales Footprint

            16.1.7.5. Strategy Overview

                16.1.7.5.1. Marketing Strategy

                16.1.7.5.2. Product Strategy

                16.1.7.5.3. Channel Strategy

        16.1.8. J.S.T. Mfg. Co., Ltd.

            16.1.8.1. Overview

            16.1.8.2. Product Portfolio

            16.1.8.3. Profitability by Market Segments

            16.1.8.4. Sales Footprint

            16.1.8.5. Strategy Overview

                16.1.8.5.1. Marketing Strategy

                16.1.8.5.2. Product Strategy

                16.1.8.5.3. Channel Strategy

        16.1.9. HARTING Technology Group

            16.1.9.1. Overview

            16.1.9.2. Product Portfolio

            16.1.9.3. Profitability by Market Segments

            16.1.9.4. Sales Footprint

            16.1.9.5. Strategy Overview

                16.1.9.5.1. Marketing Strategy

                16.1.9.5.2. Product Strategy

                16.1.9.5.3. Channel Strategy

        16.1.10. ERNI Group

            16.1.10.1. Overview

            16.1.10.2. Product Portfolio

            16.1.10.3. Profitability by Market Segments

            16.1.10.4. Sales Footprint

            16.1.10.5. Strategy Overview

                16.1.10.5.1. Marketing Strategy

                16.1.10.5.2. Product Strategy

                16.1.10.5.3. Channel Strategy

        16.1.11. Phoenix Contact GmbH & Co. KG

            16.1.11.1. Overview

            16.1.11.2. Product Portfolio

            16.1.11.3. Profitability by Market Segments

            16.1.11.4. Sales Footprint

            16.1.11.5. Strategy Overview

                16.1.11.5.1. Marketing Strategy

                16.1.11.5.2. Product Strategy

                16.1.11.5.3. Channel Strategy

        16.1.12. Wago Holding GmbH

            16.1.12.1. Overview

            16.1.12.2. Product Portfolio

            16.1.12.3. Profitability by Market Segments

            16.1.12.4. Sales Footprint

            16.1.12.5. Strategy Overview

                16.1.12.5.1. Marketing Strategy

                16.1.12.5.2. Product Strategy

                16.1.12.5.3. Channel Strategy

17. Assumptions & Acronyms Used

18. Research Methodology

Recommendations

Technology

Wireless Charging Market

April 2023

REP-GB-66

306 pages

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