Global wire-to-board connector sales surpassed a valuation of US$ 4.7 billion in 2022. From 2017 to 2021, demand for wire-to-board connector was rising at 4.1% CAGR. The global wire-to-board connector market size is projected to expand from US$ 4.6 billion in 2021 to US$ 9.0 billion by 2032.
Wire-to-board connector is anticipated to remain a highly preferred technology in the market. A CAGR of around 6.6% over the forecast period 2022 to 2032 has been predicted by Future Market Insights (FMI). This is due to the rising usage of wire-to-board connector in a fast-moving world.
Wire-to-board connector systems meet the rapidly changing needs of the electronics sector by providing a single system with different connectors and voltage configurations. This allows manufacturers to design different models based on a single connector type and footprint pattern.
Wire-to-board connector designs range from miniature to high-performance industrial connectors while meeting the needs of consumers. This simplifies maintenance, manufacturing, and repair-related issues and reduces machine downtime as specifically affected subsystems can be easily replaced.
The wire-to-board connector industry is expected to be driven by increasing usage across the consumer electronics sector as well as applications in connecting peripherals. This is due to the growing application of computer and communication technology around the world.
Growing demand for high-speed connections and transmission bandwidth are also factors driving the growth of the wire-to-board connector industry. A key factor driving this market is the emergence of IoT technology. This is due to the growing demand for high bandwidth, high-speed connectivity, and its applications in several consumer sectors.
The market is projected to witness surging popularity for 2.54mm pitch wire-to-board connector products during the forecast period. This is primarily due to the increased control of HVAC systems in homes where air conditioners and heaters, washing machines, refrigerators, ovens, and countertops are the most common.
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| Attributes | Key Insights |
|---|---|
| Estimated Global Wire-to-board Connector Market Size (2022) | US$ 4.7 billion |
| Projected Market Value (2032) | US$ 9.0 billion |
| Value-based CAGR (2022 to 2032) | 6.6% |
| Historical CAGR (2017 to 2021) | 4.1% |
Global sales of wire-to-board connector increased at around 4.1% CAGR during the historical period from 2017 to 2021. Over the projection period, global wire-to-board connector demand is forecast to increase at 6.6% CAGR. The worldwide market for wire-to-board connector is anticipated to generate an absolute $ opportunity of US$ 4.3 billion through 2032.
Global events, trade disputes, and supply chain disruptions, such as those seen during the pandemic, are impacting the production and distribution of components. This includes wire-to-board connectors, leading to market disruptions. It can lead to uncertainties and limitations.
The rapidly evolving technology landscape requires connector designs that meet the changing needs of electronic devices. Connector manufacturers had to invest in research and development to adapt their products to new design requirements.
Different sectors have diverse requirements for connectors, creating a trend to develop application-specific wire-to-board connectors. These specialty connectors are tailored to the specific needs of sectors such as automotive, medical, aerospace, and consumer electronics.
For instance, automotive electronics and industrial equipment needed connectors that could withstand higher operating temperatures. To meet these requirements, manufacturers have considered using advanced materials.
Compliance with industry standards and regulations is very important in the wire-to-board connector market. Manufacturers focus on obtaining certifications and complying with standards such as RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) to meet environmental and safety requirements.
Alternative connection technologies such as flex circuits, chip-on-board (COB), and wire bonding are preferred over traditional wire-to-board connector in certain sectors and applications. These alternatives may offer certain advantages or cost savings and limit connector market growth in these areas.
Principal Consultant
Growing Popularity of Innovative Technology to Elevate Wire-to-Board Demand in the United States
The United States wire-to-board connector market is forecast to expand at 5.5% CAGR through 2032 in comparison to the 1.2% CAGR registered from 2017 to 2021. Overall wire-to-board connector sales revenue in the country is likely to total around US$ 1.4 billion by 2032.
The United States has a strong and innovative technology sector with a strong focus on research and development. The focus on technological advancements has led to the development and deployment of cutting-edge electronic devices and systems. These systems often require advanced wire-to-board connector connections.
The United States economy includes a range of sectors including automotive, aerospace, telecommunications, healthcare, consumer electronics, and others. Each of these fields relies heavily on electronic devices and circuits, driving demand for wire-to-board connector in a host of applications.
The United States is one of the world's leading markets for electronic products, including smartphones, tablets, computers, and other consumer electronics. These devices often use wire-to-board connector to establish connections between components on the circuit board.
The United States is a key player in the global automotive and aerospace sectors, both of which require high-quality, reliable wire-to-board connector for critical applications. These applications include engine control systems, avionics, and in-flight entertainment.
Widespread Upgrades to Telecommunication Infrastructure Bolstering Wire-to-board Connector Sales
Wire-to-board Connector demand in Japan increased at 4.4% CAGR from 2017 to 2021. Over the forecast period, Japan's wire-to-board connector market is set to thrive at 6.9% CAGR, reaching a valuation of US$ 1.4 billion by 2032.
Japan has a large network of manufacturers capable of producing quality wire-to-board connector, from large corporations to small specialty firms. The country's innovation ecosystem is driving the development of new connectivity technologies and solutions.
Japan has an established telecommunications infrastructure and has witnessed a continuous expansion of networks, data centers, and telecommunications technology. This has increased the demand for advanced wire-to-board connector capable of high-speed data transmission.
Japan is also a key market for medical machinery and devices, many of which rely on wire connectors for accurate and reliable connections.
The growth of the Internet of Things (IoT) market and the proliferation of smart devices are increasing the need for small, reliable, and efficient wire-to-board connector in connected devices and wearables.
Japan has regulations and standards that promote product safety, reliability, and environmental responsibility, and promote the use of compliant, high-quality wire-to-board connector.
Favorable Government Policies to Create Growth Prospects for the Wire-to-board Connector Manufacturers
China's wire-to-board connector market registered a CAGR of 6.2% between 2017 and 2021. For the forecast period, wire-to-board connector sales are likely to surge at 8.1% CAGR. This is projected to steer the market past US$ 2.4 billion by 2032.
China's domestic market for electronics and applications is growing rapidly due to its large population and increasing disposable income. This growth has increased the demand for domestic wire-to-board connector.
Government of China has actively promoted the development of the electronics sector and invested in research and development and infrastructure to support the growth of domestic electronics manufacturing.
China has become a global export center for electronics and electronic components, including wire-to-board connector. Several international companies source their components from manufacturers in China because of their cost advantages and production capacity.
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Housing Segment to Lead the Wire-to-Board Style Segment
As per Future Market Insights (FMI), the housing segment is projected to remain highly popular style in wire-to-board connector production. The segment grew at around 3.9% CAGR from 2017 to 2021. Over the projection period, it is anticipated to register a growth rate of 6.2%.
In the context of connectors, "housing" usually refers to the plastic or metal housing that surrounds and protects the connector contacts. Enclosures are essential for maintaining the integrity of electrical connections, protecting them from the environment, and providing a safe and reliable means of connection.
Housing styles and designs vary widely depending on the application, connector type, and specific needs of the electronic device or electrical system. Common package types in the wire-to-board connector industry include:
2.54 mm Segment to Generate Lucrative Revenues Through 2032
The 2.54 mm (0.1 inch) pitch size is a widely used size and has been a standard in the electronics sector for several years. It is commonly used in a variety of applications such as hobby electronics, prototyping boards, and PCB-to-PCB connections in general.
This small pitch size is often used in applications where high-density connections are required. Laptops, tablets, and small appliances. This fine-pitch connector is used in more advanced electronics and smaller devices where space constraints are critical, such as: For instance, smartphones and wearable devices.
The 2.54mm pitch size is commonly used in high-density applications such as modern consumer electronics, medical equipment, and certain industrial equipment. It also finds usage in high-end applications with very high-density requirements. These include high-performance computers, servers, and data centers.
From 2017 to 2021, the 2.54 mm segment grew at a CAGR of 4.0%. Over the forecast period 2022 to 2032, it is projected to progress at 6.4% CAGR and continue remaining the top revenue generation segment.
Leading wire-to-board connector producing companies are focusing on increasing demand capacities to meet the growing demand for advanced technology. Leading manufacturers are also using strategies such as mergers, partnerships, acquisitions, and acquisitions to solidify their positions.
Recent developments:
| Attributes | Details |
|---|---|
| Estimated Market Size (2022) | US$ 4.7 billion |
| Projected Market Value (2032) | US$ 9.0 billion |
| Anticipated Growth Rate (2022 to 2032) | 6.6% CAGR |
| Forecast Period | 2022 to 2032 |
| Historical Data Available for | 2017 to 2021 |
| Industry Analysis | US$ billion for Value and Kilo Tons for Volume |
| Key Countries Covered | The United Kingdom, Japan, China, The United States, South Korea |
| Key Segments Covered | Size, Pitch Size, Application, and Region |
| Key Companies Profiled | Molex Incorporated; Te Connectivity Ltd.; Amphenol Corporation; Samtec Inc; Japan Aviation Electronics Industry, Ltd.; C&K Components, Inc.; Kyocera Corp.; J.S.T. Mfg. Co., Ltd.; HARTING Technology Group; ERNI Group; Phoenix Contact GmbH & Co. KG; Wago Holding GmbH |
| Report Coverage | Market Forecast, Company Share Analysis, Competition Intelligence, DROT Analysis, Market Dynamics and Challenges, and Strategic Growth Initiatives |
The global market size reached US$ 4.6 billion in 2021.
The global wire-to-board connector industry value is set to reach US$ 4.7 billion in 2022.
The global wire-to-board connector industry will exceed a valuation of US$ 9.0 billion by 2032
The worldwide market for wire-to-board connector registered a CAGR of 4.1% over the last 4 years.
Global wire-to-board connector demand is forecast to rise at a CAGR of 6.6% from 2022 to 2032.
1. Executive Summary 1.1. Global Market Outlook 1.2. Demand to side Trends 1.3. Supply to side Trends 1.4. Technology Roadmap Analysis 1.5. Analysis and Recommendations 2. Market Overview 2.1. Market Coverage / Taxonomy 2.2. Market Definition / Scope / Limitations 3. Market Background 3.1. Market Dynamics 3.1.1. Drivers 3.1.2. Restraints 3.1.3. Opportunity 3.1.4. Trends 3.2. Scenario Forecast 3.2.1. Demand in Optimistic Scenario 3.2.2. Demand in Likely Scenario 3.2.3. Demand in Conservative Scenario 3.3. Opportunity Map Analysis 3.4. Product Life Cycle Analysis 3.5. Supply Chain Analysis 3.5.1. Supply Side Participants and their Roles 3.5.1.1. Producers 3.5.1.2. Mid to Level Participants (Traders/ Agents/ Brokers) 3.5.1.3. Wholesalers and Distributors 3.5.2. Value Added and Value Created at Node in the Supply Chain 3.5.3. List of Raw Material Suppliers 3.5.4. List of Existing and Potential Buyer’s 3.6. Investment Feasibility Matrix 3.7. Value Chain Analysis 3.7.1. Profit Margin Analysis 3.7.2. Wholesalers and Distributors 3.7.3. Retailers 3.8. PESTLE and Porter’s Analysis 3.9. Regulatory Landscape 3.9.1. By Key Regions 3.9.2. By Key Countries 3.10. Regional Parent Market Outlook 3.11. Production and Consumption Statistics 3.12. Import and Export Statistics 4. Global Market Analysis 2017 to 2021 and Forecast, 2022 to 2032 4.1. Historical Market Size Value (US$ million) & Volume (Units) Analysis, 2017 to 2021 4.2. Current and Future Market Size Value (US$ million) & Volume (Units) Projections, 2022 to 2032 4.2.1. Y to Y Growth Trend Analysis 4.2.2. Absolute $ Opportunity Analysis 5. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Style 5.1. Introduction / Key Findings 5.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Style, 2017 to 2021 5.3. Current and Future Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Style, 2022 to 2032 5.3.1. Accessory 5.3.2. Header 5.3.3. Housing 5.3.4. Plug 5.3.5. Receptacle 5.3.6. Socket 5.4. Y to Y Growth Trend Analysis By Style, 2017 to 2021 5.5. Absolute $ Opportunity Analysis By Style, 2022 to 2032 6. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Pitch Size 6.1. Introduction / Key Findings 6.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Pitch Size, 2017 to 2021 6.3. Current and Future Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Pitch Size, 2022 to 2032 6.3.1. 0.8mm 6.3.2. 1.0mm 6.3.3. 1.25mm 6.3.4. 1.27mm 6.3.5. 2.0mm 6.3.6. 2.5mm 6.3.7. 2.54mm 6.3.8. 3.3mm 6.3.9. 3.96mm 6.3.10. 5.0mm 6.3.11. 7.92mm 6.3.12. 10.16mm 6.4. Y to Y Growth Trend Analysis By Pitch Size, 2017 to 2021 6.5. Absolute $ Opportunity Analysis By Pitch Size, 2022 to 2032 7. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Application 7.1. Introduction / Key Findings 7.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Application, 2017 to 2021 7.3. Current and Future Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Application, 2022 to 2032 7.3.1. Computer and Peripherals 7.3.2. Medical 7.3.3. Industrial and Instrumentation 7.3.4. Data/Telecom 7.3.5. Automotive 7.3.6. Aerospace and Defense 7.3.7. Others 7.4. Y to Y Growth Trend Analysis By Application, 2017 to 2021 7.5. Absolute $ Opportunity Analysis By Application, 2022 to 2032 8. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Region 8.1. Introduction 8.2. Historical Market Size Value (US$ million) & Volume (Units) Analysis By Region, 2017 to 2021 8.3. Current Market Size Value (US$ million) & Volume (Units) Analysis and Forecast By Region, 2022 to 2032 8.3.1. North America 8.3.2. Latin America 8.3.3. Europe 8.3.4. Asia Pacific 8.3.5. Middle East and Africa 8.4. Market Attractiveness Analysis By Region 9. North America Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country 9.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021 9.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032 9.2.1. By Country 9.2.1.1. The United States 9.2.1.2. Canada 9.2.2. By Style 9.2.3. By Pitch Size 9.2.4. By Application 9.3. Market Attractiveness Analysis 9.3.1. By Country 9.3.2. By Style 9.3.3. By Pitch Size 9.3.4. By Application 9.4. Key Takeaways 10. Latin America Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country 10.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021 10.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032 10.2.1. By Country 10.2.1.1. Brazil 10.2.1.2. Mexico 10.2.1.3. Rest of Latin America 10.2.2. By Style 10.2.3. By Pitch Size 10.2.4. By Application 10.3. Market Attractiveness Analysis 10.3.1. By Country 10.3.2. By Style 10.3.3. By Pitch Size 10.3.4. By Application 10.4. Key Takeaways 11. Europe Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country 11.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021 11.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032 11.2.1. By Country 11.2.1.1. Germany 11.2.1.2. The United Kingdom 11.2.1.3. France 11.2.1.4. Spain 11.2.1.5. Italy 11.2.1.6. Rest of Europe 11.2.2. By Style 11.2.3. By Pitch Size 11.2.4. By Application 11.3. Market Attractiveness Analysis 11.3.1. By Country 11.3.2. By Style 11.3.3. By Pitch Size 11.3.4. By Application 11.4. Key Takeaways 12. Asia Pacific Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country 12.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021 12.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032 12.2.1. By Country 12.2.1.1. China 12.2.1.2. Japan 12.2.1.3. South Korea 12.2.1.4. Singapore 12.2.1.5. Thailand 12.2.1.6. Indonesia 12.2.1.7. Australia 12.2.1.8. New Zealand 12.2.1.9. Rest of Asia Pacific 12.2.2. By Style 12.2.3. By Pitch Size 12.2.4. By Application 12.3. Market Attractiveness Analysis 12.3.1. By Country 12.3.2. By Style 12.3.3. By Pitch Size 12.3.4. By Application 12.4. Key Takeaways 13. Middle East and Africa Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country 13.1. Historical Market Size Value (US$ million) & Volume (Units) Trend Analysis By Market Taxonomy, 2017 to 2021 13.2. Market Size Value (US$ million) & Volume (Units) Forecast By Market Taxonomy, 2022 to 2032 13.2.1. By Country 13.2.1.1. GCC Countries 13.2.1.2. South Africa 13.2.1.3. Israel 13.2.1.4. Rest of Middle East and Africa 13.2.2. By Style 13.2.3. By Pitch Size 13.2.4. By Application 13.3. Market Attractiveness Analysis 13.3.1. By Country 13.3.2. By Style 13.3.3. By Pitch Size 13.3.4. By Application 13.4. Key Takeaways 14. Key Countries Market Analysis 14.1. The United States 14.1.1. Pricing Analysis 14.1.2. Market Share Analysis, 2021 14.1.2.1. By Style 14.1.2.2. By Pitch Size 14.1.2.3. By Application 14.2. Canada 14.2.1. Pricing Analysis 14.2.2. Market Share Analysis, 2021 14.2.2.1. By Style 14.2.2.2. By Pitch Size 14.2.2.3. By Application 14.3. Brazil 14.3.1. Pricing Analysis 14.3.2. Market Share Analysis, 2021 14.3.2.1. By Style 14.3.2.2. By Pitch Size 14.3.2.3. By Application 14.4. Mexico 14.4.1. Pricing Analysis 14.4.2. Market Share Analysis, 2021 14.4.2.1. By Style 14.4.2.2. By Pitch Size 14.4.2.3. By Application 14.5. Germany 14.5.1. Pricing Analysis 14.5.2. Market Share Analysis, 2021 14.5.2.1. By Style 14.5.2.2. By Pitch Size 14.5.2.3. By Application 14.6. The United Kingdom 14.6.1. Pricing Analysis 14.6.2. Market Share Analysis, 2021 14.6.2.1. By Style 14.6.2.2. By Pitch Size 14.6.2.3. By Application 14.7. France 14.7.1. Pricing Analysis 14.7.2. Market Share Analysis, 2021 14.7.2.1. By Style 14.7.2.2. By Pitch Size 14.7.2.3. By Application 14.8. Spain 14.8.1. Pricing Analysis 14.8.2. Market Share Analysis, 2021 14.8.2.1. By Style 14.8.2.2. By Pitch Size 14.8.2.3. By Application 14.9. Italy 14.9.1. Pricing Analysis 14.9.2. Market Share Analysis, 2021 14.9.2.1. By Style 14.9.2.2. By Pitch Size 14.9.2.3. By Application 14.10. China 14.10.1. Pricing Analysis 14.10.2. Market Share Analysis, 2021 14.10.2.1. By Style 14.10.2.2. By Pitch Size 14.10.2.3. By Application 14.11. Japan 14.11.1. Pricing Analysis 14.11.2. Market Share Analysis, 2021 14.11.2.1. By Style 14.11.2.2. By Pitch Size 14.11.2.3. By Application 14.12. South Korea 14.12.1. Pricing Analysis 14.12.2. Market Share Analysis, 2021 14.12.2.1. By Style 14.12.2.2. By Pitch Size 14.12.2.3. By Application 14.13. Singapore 14.13.1. Pricing Analysis 14.13.2. Market Share Analysis, 2021 14.13.2.1. By Style 14.13.2.2. By Pitch Size 14.13.2.3. By Application 14.14. Thailand 14.14.1. Pricing Analysis 14.14.2. Market Share Analysis, 2021 14.14.2.1. By Style 14.14.2.2. By Pitch Size 14.14.2.3. By Application 14.15. Indonesia 14.15.1. Pricing Analysis 14.15.2. Market Share Analysis, 2021 14.15.2.1. By Style 14.15.2.2. By Pitch Size 14.15.2.3. By Application 14.16. Australia 14.16.1. Pricing Analysis 14.16.2. Market Share Analysis, 2021 14.16.2.1. By Style 14.16.2.2. By Pitch Size 14.16.2.3. By Application 14.17. New Zealand 14.17.1. Pricing Analysis 14.17.2. Market Share Analysis, 2021 14.17.2.1. By Style 14.17.2.2. By Pitch Size 14.17.2.3. By Application 14.18. GCC Countries 14.18.1. Pricing Analysis 14.18.2. Market Share Analysis, 2021 14.18.2.1. By Style 14.18.2.2. By Pitch Size 14.18.2.3. By Application 14.19. South Africa 14.19.1. Pricing Analysis 14.19.2. Market Share Analysis, 2021 14.19.2.1. By Style 14.19.2.2. By Pitch Size 14.19.2.3. By Application 14.20. Israel 14.20.1. Pricing Analysis 14.20.2. Market Share Analysis, 2021 14.20.2.1. By Style 14.20.2.2. By Pitch Size 14.20.2.3. By Application 15. Market Structure Analysis 15.1. Competition Dashboard 15.2. Competition Benchmarking 15.3. Market Share Analysis of Top Players 15.3.1. By Regional 15.3.2. By Style 15.3.3. By Pitch Size 15.3.4. By Application 16. Competition Analysis 16.1. Competition Deep Dive 16.1.1. Molex Incorporated 16.1.1.1. Overview 16.1.1.2. Product Portfolio 16.1.1.3. Profitability by Market Segments 16.1.1.4. Sales Footprint 16.1.1.5. Strategy Overview 16.1.1.5.1. Marketing Strategy 16.1.1.5.2. Product Strategy 16.1.1.5.3. Channel Strategy 16.1.2. Te Connectivity Ltd. 16.1.2.1. Overview 16.1.2.2. Product Portfolio 16.1.2.3. Profitability by Market Segments 16.1.2.4. Sales Footprint 16.1.2.5. Strategy Overview 16.1.2.5.1. Marketing Strategy 16.1.2.5.2. Product Strategy 16.1.2.5.3. Channel Strategy 16.1.3. Amphenol Corporation 16.1.3.1. Overview 16.1.3.2. Product Portfolio 16.1.3.3. Profitability by Market Segments 16.1.3.4. Sales Footprint 16.1.3.5. Strategy Overview 16.1.3.5.1. Marketing Strategy 16.1.3.5.2. Product Strategy 16.1.3.5.3. Channel Strategy 16.1.4. Samtec Inc 16.1.4.1. Overview 16.1.4.2. Product Portfolio 16.1.4.3. Profitability by Market Segments 16.1.4.4. Sales Footprint 16.1.4.5. Strategy Overview 16.1.4.5.1. Marketing Strategy 16.1.4.5.2. Product Strategy 16.1.4.5.3. Channel Strategy 16.1.5. Japan Aviation Electronics Industry, Ltd. 16.1.5.1. Overview 16.1.5.2. Product Portfolio 16.1.5.3. Profitability by Market Segments 16.1.5.4. Sales Footprint 16.1.5.5. Strategy Overview 16.1.5.5.1. Marketing Strategy 16.1.5.5.2. Product Strategy 16.1.5.5.3. Channel Strategy 16.1.6. C&K Components, Inc. 16.1.6.1. Overview 16.1.6.2. Product Portfolio 16.1.6.3. Profitability by Market Segments 16.1.6.4. Sales Footprint 16.1.6.5. Strategy Overview 16.1.6.5.1. Marketing Strategy 16.1.6.5.2. Product Strategy 16.1.6.5.3. Channel Strategy 16.1.7. Kyocera Corp. 16.1.7.1. Overview 16.1.7.2. Product Portfolio 16.1.7.3. Profitability by Market Segments 16.1.7.4. Sales Footprint 16.1.7.5. Strategy Overview 16.1.7.5.1. Marketing Strategy 16.1.7.5.2. Product Strategy 16.1.7.5.3. Channel Strategy 16.1.8. J.S.T. Mfg. Co., Ltd. 16.1.8.1. Overview 16.1.8.2. Product Portfolio 16.1.8.3. Profitability by Market Segments 16.1.8.4. Sales Footprint 16.1.8.5. Strategy Overview 16.1.8.5.1. Marketing Strategy 16.1.8.5.2. Product Strategy 16.1.8.5.3. Channel Strategy 16.1.9. HARTING Technology Group 16.1.9.1. Overview 16.1.9.2. Product Portfolio 16.1.9.3. Profitability by Market Segments 16.1.9.4. Sales Footprint 16.1.9.5. Strategy Overview 16.1.9.5.1. Marketing Strategy 16.1.9.5.2. Product Strategy 16.1.9.5.3. Channel Strategy 16.1.10. ERNI Group 16.1.10.1. Overview 16.1.10.2. Product Portfolio 16.1.10.3. Profitability by Market Segments 16.1.10.4. Sales Footprint 16.1.10.5. Strategy Overview 16.1.10.5.1. Marketing Strategy 16.1.10.5.2. Product Strategy 16.1.10.5.3. Channel Strategy 16.1.11. Phoenix Contact GmbH & Co. KG 16.1.11.1. Overview 16.1.11.2. Product Portfolio 16.1.11.3. Profitability by Market Segments 16.1.11.4. Sales Footprint 16.1.11.5. Strategy Overview 16.1.11.5.1. Marketing Strategy 16.1.11.5.2. Product Strategy 16.1.11.5.3. Channel Strategy 16.1.12. Wago Holding GmbH 16.1.12.1. Overview 16.1.12.2. Product Portfolio 16.1.12.3. Profitability by Market Segments 16.1.12.4. Sales Footprint 16.1.12.5. Strategy Overview 16.1.12.5.1. Marketing Strategy 16.1.12.5.2. Product Strategy 16.1.12.5.3. Channel Strategy 17. Assumptions & Acronyms Used 18. Research Methodology
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Wire-to-board Connector Market
