[250 Pages Report] The global Wi-Fi semiconductor chipset market is expected to reach US$ 20.1 Billion in 2022. It is projected to surpass US$ 26.3 Billion and exhibit growth at a CAGR of 5.2% from 2022 to 2032. The increasing penetration of the internet and the rising number of public Wi-Fi hotspots across the globe are likely to fuel the demand for Wi-Fi semiconductor chipset in the near future.
| Report Attributes | Details |
|---|---|
| Estimated Base Year Value (2021) | US$ 19.4 Billion |
| Expected Market Value (2022) | US$ 20.1 Billion |
| Anticipated Forecast Value (2032) | US$ 26.3 Billion |
| Projected Growth Rate (2022 to 2032) | 5.2% CAGR |
A Wi-Fi semiconductor chipset is an integral component within internal hardware that is specially designed to enable the device to efficiently communicate with another wireless technology-enabled device. It is often found in a wide range of wireless devices, such as laptops, personal computers, and smartphones.
The rising inclusion of these chipsets in home and industrial automation applications is another major factor that is anticipated to bode well for the market. The increasing demand for relatively low cost chipset configuration, especially 1X1 configuration owing to its usage in generic modems and tablets is likely to drive the Wi-Fi semiconductor chipset market share throughout the forthcoming years.
Besides, the high demand for wireless connectivity from both the private and public sectors is expected to compel manufacturers in focusing on making internet connectivity speedy and more accessible even in remote parts of the world. Governments of various countries are set to invest huge sums in the development of public Wi-Fi with the rising number of smart cities.
Wi-Fi semiconductor chipsets have proved to be beneficial for educational facilities as these help in providing free connections to those who otherwise cannot afford internet at home. Users can gain access to public services and professional educational databases through these connections.
The surging adoption of various wireless connectivity technologies, especially in the automotive sector is expected to propel the sales of Wi-Fi semiconductor chipsets in the upcoming years. The industry is persistently utilizing these chipsets in automotive lighting instrument clusters and audio systems.
The ability of these chipsets to deliver fast target wakeup time, enhanced security, high-speed data transmission, and smart interface handling is also anticipated to drive their demand in the automotive sector. Many chip manufacturers are projected to focus more on the rapid development of strategic collaborations and partnerships to provide automobile companies with application-specific chipsets.
The increasing usage of IEEE 802.11ax (Wi-Fi 6 & Wi-Fi 6E) standard backed by its several advantages, such as improved power efficiency, better data rates, and high capacity is likely to accelerate the market. These benefits are set to encourage consumer electronics OEMs to include chipsets in wearable devices, tablets, and smartphones.
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The rising number of cyber and security threats is a vital factor that may hamper the Wi-Fi semiconductor chipset market share in the evaluation period. The perpetual threat of security risks and data breaches still exist even though the market is currently making sustainable progress.
Advanced hacking systems present in the cyber network are capable of lowering the reliability of internet connectivity. The cases of hacking and data leaks are expected to be more prevalent in future even with the deployment of security measures, such as WPA and WEP.
The shipment of tablets and PCs, on the other hand, is anticipated to decline in the forecast period owing to the falling prices of smartphones and the enhanced performance of phablets, which may obstruct the growth in this market.
The presence of a large number of renowned manufacturers, such as Samsung Electronics Co. Ltd., ZTE Corporation, and Huawei Technologies Co. Ltd. in South Korea and China is expected to spur the demand for Wi-Fi semiconductor chipsets in Asia Pacific. The low-cost manufacturing of these chipsets and the huge pool of consumer electronics manufacturers in China are also projected to contribute to the regional growth.
Government bodies of various developing economies in this region are investing in the upgradation of frequency bands for supporting next generation Wi-Fi. They are partnering up with educational institutions to conduct exhaustive data-intensive research, which is likely to augur well for the market.
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The surging adoption of smartphones in the U.S. and Canada is expected to drive the North America Wi-Fi semiconductor chipset market share in the assessment period. This growth is attributable to the affordable price and increasing advancements in the field of smartphones.
The demand for wireless technology in smartphones is growing at a rapid pace in North America and the usage of chipsets in these phones provide high-speed Wi-Fi or 2G/3G connectivity.
The sales of tablets are also increasing backed by the ongoing expansion of the digital market in the U.S. These are expected to be used more in the country, as compared to laptops. The incorporation of innovative Wi-Fi chipsets in tablets stoked by the high demand from the IT sector is set to push the market.
Some of the key players operating in the global Wi-Fi semiconductor chipset market are Qualcomm Technologies, Inc., Broadcom Inc., MediaTek Inc., Intel Corporation, Texas Instruments Incorporated., Hewlett Packard Enterprise Co., STMicroelectronics N.V., Samsung Electronics Co., Ltd., NXP Semiconductors N.V., On Semiconductor Co., Inc., Skyworks Solutions, Inc., Cisco Systems Inc., Simcom Wireless Solutions Limited, Peraso Technologies, Inc., Cypress Semiconductor Corporation, Dell Technologies, CommScope Holding Co., Quectel, Extreme Networks, and ASUS.
Leading players are focusing on upgrading organizations’ data transfer and bandwidth rate over wireless communication with the ongoing development in the field of IoT technology. Meanwhile, some of the other prominent companies are engaging in acquisitions and new product developments to cater to the increasing consumer demand globally by expanding their existing product portfolios.
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| Report Attributes | Details |
|---|---|
| Growth Rate | CAGR of 5.2% from 2022 to 2032 |
| Base Year for Estimation | 2021 |
| Historical Data | 2015 to 2020 |
| Forecast Period | 2022 to 2032 |
| Quantitative Units | Revenue in US$ Million, Volume in Kilotons and CAGR from 2022 to 2032 |
| Report Coverage | Revenue Forecast, Volume Forecast, Company Ranking, Competitive Landscape, Growth Factors, Trends and Pricing Analysis |
| Segments Covered | MIMO Configuration, Band, IEEE Standard, Vertical, End Use, Region |
| Regions Covered | North America; Latin America; Western Europe; Eastern Europe; APEJ; Japan; Middle East and Africa |
| Key Countries Profiled | USA, Canada, Brazil, Argentina, Germany, UK, France, Spain, Italy, Nordics, BENELUX, Australia & New Zealand, China, India, ASEAN, GCC, South Africa |
| Key Companies Profiled | Qualcomm Technologies, Inc.; Broadcom Inc.; MediaTek Inc.; Intel Corporation; Texas Instruments Incorporated.; Hewlett Packard Enterprise Co.; STMicroelectronics N.V.; Samsung Electronics Co., Ltd.; NXP Semiconductors N.V.; On Semiconductor Co., Inc.; Skyworks Solutions, Inc.; Cisco Systems Inc.; Simcom Wireless Solutions Limited; Peraso Technologies, Inc.; Cypress Semiconductor Corporation; Dell Technologies; CommScope Holding Co.; Quectel; Extreme Networks; ASUS |
| Customization | Available Upon Request |
MIMO Configuration:
Band:
IEEE Standard:
Vertical:
End Use:
Region:
FMI projects the global Wi-Fi semiconductor chipset market to expand at a 5.2% value CAGR by 2032.
Asia Pacific is expected to be the most opportunistic Wi-Fi semiconductor chipset market.
Qualcomm Technologies, Inc., Broadcom Inc., MediaTek Inc., Intel Corporation, Texas Instruments Incorporated., and Hewlett Packard Enterprise Co. are some of the prominent Wi-Fi semiconductor chipset manufacturers.
1. Executive Summary
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Background
3.1. Market Dynamics
3.1.1. Drivers
3.1.2. Restraints
3.1.3. Opportunity
3.1.4. Trends
3.2. Scenario Forecast
3.2.1. Demand in Optimistic Scenario
3.2.2. Demand in Likely Scenario
3.2.3. Demand in Conservative Scenario
3.3. Opportunity Map Analysis
3.4. Investment Feasibility Matrix
3.5. Value Chain Analysis
3.5.1. Profit Margin Analysis
3.5.2. Service Providers
3.6. PESTLE and Porter’s Analysis
3.7. Regulatory Landscape
3.7.1. By Key Regions
3.7.2. By Key Countries
3.8. Regional Parent Market Outlook
4. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast, 2022-2032
4.1. Historical Market Size Value (US$ Mn) Analysis, 2017-2021
4.2. Current and Future Market Size Value (US$ Mn) Projections, 2022-2032
4.2.1. Y-o-Y Growth Trend Analysis
4.2.2. Absolute $ Opportunity Analysis
5. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By IEEE Standard
5.1. Introduction / Key Findings
5.2. Historical Market Size Value (US$ Mn) Analysis By IEEE Standard, 2017-2021
5.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By IEEE Standard, 2022-2032
5.3.1. 802.11 a/b/g/n
5.3.2. 802.11 ac
5.3.3. 802.11 ad
5.3.4. Others
5.4. Y-o-Y Growth Trend Analysis By IEEE Standard, 2017-2021
5.5. Absolute $ Opportunity Analysis By IEEE Standard, 2022-2032
Deep-dive segmentation will be available in the sample on request
6. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Technology
6.1. Introduction / Key Findings
6.2. Historical Market Size Value (US$ Mn) Analysis By Technology, 2017-2021
6.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Technology, 2022-2032
6.3.1. Ultra-low Power Based Chipset
6.3.2. Integrated System-on-Chip Based Chipset
6.4. Y-o-Y Growth Trend Analysis By Technology, 2017-2021
6.5. Absolute $ Opportunity Analysis By Technology, 2022-2032
Deep-dive segmentation will be available in the sample on request
7. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Application
7.1. Introduction / Key Findings
7.2. Historical Market Size Value (US$ Mn) Analysis By Application, 2017-2021
7.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Application, 2022-2032
7.3.1. Consumer Electronics
7.3.2. Medical & Healthcare
7.3.3. Military & Defence
7.3.4. Automation
7.4. Y-o-Y Growth Trend Analysis By Application, 2017-2021
7.5. Absolute $ Opportunity Analysis By Application, 2022-2032
Deep-dive segmentation will be available in the sample on request
8. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Region
8.1. Introduction
8.2. Historical Market Size Value (US$ Mn) Analysis By Region, 2017-2021
8.3. Current Market Size Value (US$ Mn) Analysis and Forecast By Region, 2022-2032
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. East Asia
8.3.5. South Asia & Pacific
8.3.6. MEA
8.4. Market Attractiveness Analysis By Region
9. North America Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country
9.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
9.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
9.2.1. By Country
9.2.1.1. U.S.
9.2.1.2. Canada
9.2.2. By IEEE Standard
9.2.3. By Technology
9.2.4. By Application
9.3. Market Attractiveness Analysis
9.3.1. By Country
9.3.2. By IEEE Standard
9.3.3. By Technology
9.3.4. By Application
9.4. Key Takeaways
10. Latin America Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country
10.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
10.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
10.2.1. By Country
10.2.1.1. Mexico
10.2.1.2. Brazil
10.2.1.3. Rest of Latin America
10.2.2. By IEEE Standard
10.2.3. By Technology
10.2.4. By Application
10.3. Market Attractiveness Analysis
10.3.1. By Country
10.3.2. By IEEE Standard
10.3.3. By Technology
10.3.4. By Application
10.4. Key Takeaways
11. Europe Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country
11.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
11.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
11.2.1. By Country
11.2.1.1. Germany
11.2.1.2. Italy
11.2.1.3. France
11.2.1.4. U.K.
11.2.1.5. Spain
11.2.1.6. BENELUX
11.2.1.7. Russia
11.2.1.8. Rest of Europe
11.2.2. By IEEE Standard
11.2.3. By Technology
11.2.4. By Application
11.3. Market Attractiveness Analysis
11.3.1. By Country
11.3.2. By IEEE Standard
11.3.3. By Technology
11.3.4. By Application
11.4. Key Takeaways
12. East Asia Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country
12.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
12.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
12.2.1. By Country
12.2.1.1. China
12.2.1.2. Japan
12.2.1.3. South Korea
12.2.2. By IEEE Standard
12.2.3. By Technology
12.2.4. By Application
12.3. Market Attractiveness Analysis
12.3.1. By Country
12.3.2. By IEEE Standard
12.3.3. By Technology
12.3.4. By Application
12.4. Key Takeaways
13. South Asia & Pacific Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country
13.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
13.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
13.2.1. By Country
13.2.1.1. India
13.2.1.2. ASEAN
13.2.1.3. Australia and New Zealand
13.2.1.4. Rest of South Asia & Pacific
13.2.2. By IEEE Standard
13.2.3. By Technology
13.2.4. By Application
13.3. Market Attractiveness Analysis
13.3.1. By Country
13.3.2. By IEEE Standard
13.3.3. By Technology
13.3.4. By Application
13.4. Key Takeaways
14. MEA Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country
14.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
14.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
14.2.1. By Country
14.2.1.1. GCC Countries
14.2.1.2. Turkey
14.2.1.3. South Africa
14.2.1.4. Rest of MEA
14.2.2. By IEEE Standard
14.2.3. By Technology
14.2.4. By Application
14.3. Market Attractiveness Analysis
14.3.1. By Country
14.3.2. By IEEE Standard
14.3.3. By Technology
14.3.4. By Application
14.4. Key Takeaways
15. Key Countries Wi-Fi Semiconductor Chipset Market Analysis
15.1. U.S.
15.1.1. Pricing Analysis
15.1.2. Market Share Analysis, 2021
15.1.2.1. By IEEE Standard
15.1.2.2. By Technology
15.1.2.3. By Application
15.2. Canada
15.2.1. Pricing Analysis
15.2.2. Market Share Analysis, 2021
15.2.2.1. By IEEE Standard
15.2.2.2. By Technology
15.2.2.3. By Application
15.3. Mexico
15.3.1. Pricing Analysis
15.3.2. Market Share Analysis, 2021
15.3.2.1. By IEEE Standard
15.3.2.2. By Technology
15.3.2.3. By Application
15.4. Brazil
15.4.1. Pricing Analysis
15.4.2. Market Share Analysis, 2021
15.4.2.1. By IEEE Standard
15.4.2.2. By Technology
15.4.2.3. By Application
15.5. Germany
15.5.1. Pricing Analysis
15.5.2. Market Share Analysis, 2021
15.5.2.1. By IEEE Standard
15.5.2.2. By Technology
15.5.2.3. By Application
15.6. Italy
15.6.1. Pricing Analysis
15.6.2. Market Share Analysis, 2021
15.6.2.1. By IEEE Standard
15.6.2.2. By Technology
15.6.2.3. By Application
15.7. France
15.7.1. Pricing Analysis
15.7.2. Market Share Analysis, 2021
15.7.2.1. By IEEE Standard
15.7.2.2. By Technology
15.7.2.3. By Application
15.8. U.K.
15.8.1. Pricing Analysis
15.8.2. Market Share Analysis, 2021
15.8.2.1. By IEEE Standard
15.8.2.2. By Technology
15.8.2.3. By Application
15.9. Spain
15.9.1. Pricing Analysis
15.9.2. Market Share Analysis, 2021
15.9.2.1. By IEEE Standard
15.9.2.2. By Technology
15.9.2.3. By Application
15.10. BENELUX
15.10.1. Pricing Analysis
15.10.2. Market Share Analysis, 2021
15.10.2.1. By IEEE Standard
15.10.2.2. By Technology
15.10.2.3. By Application
15.11. Russia
15.11.1. Pricing Analysis
15.11.2. Market Share Analysis, 2021
15.11.2.1. By IEEE Standard
15.11.2.2. By Technology
15.11.2.3. By Application
15.12. China
15.12.1. Pricing Analysis
15.12.2. Market Share Analysis, 2021
15.12.2.1. By IEEE Standard
15.12.2.2. By Technology
15.12.2.3. By Application
15.13. Japan
15.13.1. Pricing Analysis
15.13.2. Market Share Analysis, 2021
15.13.2.1. By IEEE Standard
15.13.2.2. By Technology
15.13.2.3. By Application
15.14. South Korea
15.14.1. Pricing Analysis
15.14.2. Market Share Analysis, 2021
15.14.2.1. By IEEE Standard
15.14.2.2. By Technology
15.14.2.3. By Application
15.15. India
15.15.1. Pricing Analysis
15.15.2. Market Share Analysis, 2021
15.15.2.1. By IEEE Standard
15.15.2.2. By Technology
15.15.2.3. By Application
15.16. ASEAN
15.16.1. Pricing Analysis
15.16.2. Market Share Analysis, 2021
15.16.2.1. By IEEE Standard
15.16.2.2. By Technology
15.16.2.3. By Application
15.17. Australia and New Zealand
15.17.1. Pricing Analysis
15.17.2. Market Share Analysis, 2021
15.17.2.1. By IEEE Standard
15.17.2.2. By Technology
15.17.2.3. By Application
15.18. GCC Countries
15.18.1. Pricing Analysis
15.18.2. Market Share Analysis, 2021
15.18.2.1. By IEEE Standard
15.18.2.2. By Technology
15.18.2.3. By Application
15.19. Turkey
15.19.1. Pricing Analysis
15.19.2. Market Share Analysis, 2021
15.19.2.1. By IEEE Standard
15.19.2.2. By Technology
15.19.2.3. By Application
15.20. South Africa
15.20.1. Pricing Analysis
15.20.2. Market Share Analysis, 2021
15.20.2.1. By IEEE Standard
15.20.2.2. By Technology
15.20.2.3. By Application
16. Market Structure Analysis
16.1. Competition Dashboard
16.2. Competition Benchmarking
16.3. Market Share Analysis of Top Players
16.3.1. By Regional
16.3.2. By IEEE Standard
16.3.3. By Technology
16.3.4. By Application
17. Competition Analysis
17.1. Competition Deep Dive
17.1.1. Telit
17.1.1.1. Overview
17.1.1.2. Product Portfolio
17.1.1.3. Profitability by Market Segments
17.1.1.4. Sales Footprint
17.1.1.5. Strategy Overview
17.1.1.5.1. Marketing Strategy
17.1.1.5.2. Product Strategy
17.1.1.5.3. Channel Strategy
17.1.2. Microchip Technology
17.1.2.1. Overview
17.1.2.2. Product Portfolio
17.1.2.3. Profitability by Market Segments
17.1.2.4. Sales Footprint
17.1.2.5. Strategy Overview
17.1.2.5.1. Marketing Strategy
17.1.2.5.2. Product Strategy
17.1.2.5.3. Channel Strategy
17.1.3. Intel Corp
17.1.3.1. Overview
17.1.3.2. Product Portfolio
17.1.3.3. Profitability by Market Segments
17.1.3.4. Sales Footprint
17.1.3.5. Strategy Overview
17.1.3.5.1. Marketing Strategy
17.1.3.5.2. Product Strategy
17.1.3.5.3. Channel Strategy
17.1.4. Marvell Technology Group Ltd
17.1.4.1. Overview
17.1.4.2. Product Portfolio
17.1.4.3. Profitability by Market Segments
17.1.4.4. Sales Footprint
17.1.4.5. Strategy Overview
17.1.4.5.1. Marketing Strategy
17.1.4.5.2. Product Strategy
17.1.4.5.3. Channel Strategy
17.1.5. Qualcomm Incorporated
17.1.5.1. Overview
17.1.5.2. Product Portfolio
17.1.5.3. Profitability by Market Segments
17.1.5.4. Sales Footprint
17.1.5.5. Strategy Overview
17.1.5.5.1. Marketing Strategy
17.1.5.5.2. Product Strategy
17.1.5.5.3. Channel Strategy
17.1.6. Texas Instruments Incorporated
17.1.6.1. Overview
17.1.6.2. Product Portfolio
17.1.6.3. Profitability by Market Segments
17.1.6.4. Sales Footprint
17.1.6.5. Strategy Overview
17.1.6.5.1. Marketing Strategy
17.1.6.5.2. Product Strategy
17.1.6.5.3. Channel Strategy
17.1.7. Broadcom Corporation
17.1.7.1. Overview
17.1.7.2. Product Portfolio
17.1.7.3. Profitability by Market Segments
17.1.7.4. Sales Footprint
17.1.7.5. Strategy Overview
17.1.7.5.1. Marketing Strategy
17.1.7.5.2. Product Strategy
17.1.7.5.3. Channel Strategy
18. Assumptions & Acronyms Used
19. Research Methodology
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Wi-Fi Semiconductor Chipset Market
