[250 Pages Report] The global Wi-Fi semiconductor chipset market is expected to reach USD 20.1 Billion in 2022. It is projected to surpass USD 26.3 Billion and exhibit growth at a CAGR of 5.2% from 2022 to 2032. The increasing penetration of the internet and the rising number of public Wi-Fi hotspots across the globe are likely to fuel the demand for Wi-Fi semiconductor chipset in the near future.
| Report Attributes | Details |
|---|---|
| Estimated Base Year Value (2021) | USD 19.4 Billion |
| Expected Market Value (2022) | USD 20.1 Billion |
| Anticipated Forecast Value (2032) | USD 26.3 Billion |
| Projected Growth Rate (2022 to 2032) | 5.2% CAGR |
A Wi-Fi semiconductor chipset is an integral component within internal hardware that is specially designed to enable the device to efficiently communicate with another wireless technology-enabled device. It is often found in a wide range of wireless devices, such as laptops, personal computers, and smartphones.
The rising inclusion of these chipsets in home and industrial automation applications is another major factor that is anticipated to bode well for the market. The increasing demand for relatively low cost chipset configuration, especially 1X1 configuration owing to its usage in generic modems and tablets is likely to drive the Wi-Fi semiconductor chipset market share throughout the forthcoming years.
Besides, the high demand for wireless connectivity from both the private and public sectors is expected to compel manufacturers in focusing on making internet connectivity speedy and more accessible even in remote parts of the world. Governments of various countries are set to invest huge sums in the development of public Wi-Fi with the rising number of smart cities.
Wi-Fi semiconductor chipsets have proved to be beneficial for educational facilities as these help in providing free connections to those who otherwise cannot afford internet at home. Users can gain access to public services and professional educational databases through these connections.
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The surging adoption of various wireless connectivity technologies, especially in the automotive sector is expected to propel the sales of Wi-Fi semiconductor chipsets in the upcoming years. The industry is persistently utilizing these chipsets in automotive lighting instrument clusters and audio systems.
The ability of these chipsets to deliver fast target wakeup time, enhanced security, high-speed data transmission, and smart interface handling is also anticipated to drive their demand in the automotive sector. Many chip manufacturers are projected to focus more on the rapid development of strategic collaborations and partnerships to provide automobile companies with application-specific chipsets.
The increasing usage of IEEE 802.11ax (Wi-Fi 6 & Wi-Fi 6E) standard backed by its several advantages, such as improved power efficiency, better data rates, and high capacity is likely to accelerate the market. These benefits are set to encourage consumer electronics OEMs to include chipsets in wearable devices, tablets, and smartphones.
The rising number of cyber and security threats is a vital factor that may hamper the Wi-Fi semiconductor chipset market share in the evaluation period. The perpetual threat of security risks and data breaches still exist even though the market is currently making sustainable progress.
Advanced hacking systems present in the cyber network are capable of lowering the reliability of internet connectivity. The cases of hacking and data leaks are expected to be more prevalent in future even with the deployment of security measures, such as WPA and WEP.
The shipment of tablets and PCs, on the other hand, is anticipated to decline in the forecast period owing to the falling prices of smartphones and the enhanced performance of phablets, which may obstruct the growth in this market.
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The presence of a large number of renowned manufacturers, such as Samsung Electronics Co. Ltd., ZTE Corporation, and Huawei Technologies Co. Ltd. in South Korea and China is expected to spur the demand for Wi-Fi semiconductor chipsets in Asia Pacific. The low-cost manufacturing of these chipsets and the huge pool of consumer electronics manufacturers in China are also projected to contribute to the regional growth.
Government bodies of various developing economies in this region are investing in the upgradation of frequency bands for supporting next generation Wi-Fi. They are partnering up with educational institutions to conduct exhaustive data-intensive research, which is likely to augur well for the market.
The surging adoption of smartphones in the U.S. and Canada is expected to drive the North America Wi-Fi semiconductor chipset market share in the assessment period. This growth is attributable to the affordable price and increasing advancements in the field of smartphones.
The demand for wireless technology in smartphones is growing at a rapid pace in North America and the usage of chipsets in these phones provide high-speed Wi-Fi or 2G/3G connectivity.
The sales of tablets are also increasing backed by the ongoing expansion of the digital market in the U.S. These are expected to be used more in the country, as compared to laptops. The incorporation of innovative Wi-Fi chipsets in tablets stoked by the high demand from the IT sector is set to push the market.
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Some of the key players operating in the global Wi-Fi semiconductor chipset market are Qualcomm Technologies, Inc., Broadcom Inc., MediaTek Inc., Intel Corporation, Texas Instruments Incorporated., Hewlett Packard Enterprise Co., STMicroelectronics N.V., Samsung Electronics Co., Ltd., NXP Semiconductors N.V., On Semiconductor Co., Inc., Skyworks Solutions, Inc., Cisco Systems Inc., Simcom Wireless Solutions Limited, Peraso Technologies, Inc., Cypress Semiconductor Corporation, Dell Technologies, CommScope Holding Co., Quectel, Extreme Networks, and ASUS.
Leading players are focusing on upgrading organizations’ data transfer and bandwidth rate over wireless communication with the ongoing development in the field of IoT technology. Meanwhile, some of the other prominent companies are engaging in acquisitions and new product developments to cater to the increasing consumer demand globally by expanding their existing product portfolios.
| Report Attributes | Details |
|---|---|
| Growth Rate | CAGR of 5.2% from 2022 to 2032 |
| Base Year for Estimation | 2021 |
| Historical Data | 2015 to 2020 |
| Forecast Period | 2022 to 2032 |
| Quantitative Units | Revenue in USD Million, Volume in Kilotons and CAGR from 2022 to 2032 |
| Report Coverage | Revenue Forecast, Volume Forecast, Company Ranking, Competitive Landscape, Growth Factors, Trends and Pricing Analysis |
| Segments Covered | MIMO Configuration, Band, IEEE Standard, Vertical, End Use, Region |
| Regions Covered | North America; Latin America; Western Europe; Eastern Europe; APEJ; Japan; Middle East and Africa |
| Key Countries Profiled | USA, Canada, Brazil, Argentina, Germany, UK, France, Spain, Italy, Nordics, BENELUX, Australia & New Zealand, China, India, ASEAN, GCC, South Africa |
| Key Companies Profiled | Qualcomm Technologies, Inc.; Broadcom Inc.; MediaTek Inc.; Intel Corporation; Texas Instruments Incorporated.; Hewlett Packard Enterprise Co.; STMicroelectronics N.V.; Samsung Electronics Co., Ltd.; NXP Semiconductors N.V.; On Semiconductor Co., Inc.; Skyworks Solutions, Inc.; Cisco Systems Inc.; Simcom Wireless Solutions Limited; Peraso Technologies, Inc.; Cypress Semiconductor Corporation; Dell Technologies; CommScope Holding Co.; Quectel; Extreme Networks; ASUS |
| Customization | Available Upon Request |
FMI projects the global Wi-Fi semiconductor chipset market to expand at a 5.2% value CAGR by 2032.
Asia Pacific is expected to be the most opportunistic Wi-Fi semiconductor chipset market.
Qualcomm Technologies, Inc., Broadcom Inc., MediaTek Inc., Intel Corporation, Texas Instruments Incorporated., and Hewlett Packard Enterprise Co. are some of the prominent Wi-Fi semiconductor chipset manufacturers.
1. Executive Summary 2. Market Overview 3. Market Background 4. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast, 2022-2032 5. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Type 5.1. 802.11 a/b/g/n 5.2. 802.11 ac 5.3. 802.11 ad 5.4. Others 6. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Technology 6.1. Ultra-low Power Based Chipset 6.2. Integrated System-on-Chip Based Chipset 7. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Application 7.1. Consumer Electronics 7.2. Medical & Healthcare 7.3. Military & Defence 7.4. Automation 8. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Region 8.1. North America 8.2. Latin America 8.3. Europe 8.4. East Asia 8.5. South Asia & Pacific 8.6. MEA 9. North America Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 10. Latin America Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 11. Europe Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 12. East Asia Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 13. South Asia & Pacific Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 14. MEA Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 15. Key Countries Wi-Fi Semiconductor Chipset Market Analysis 16. Market Structure Analysis 17. Competition Analysis 17.1. Telit 17.2. Microchip Technology 17.3. Intel Corp 17.4. Marvell Technology Group Ltd 17.5. Qualcomm Incorporated 17.6. Texas Instruments Incorporated 17.7. Broadcom Corporation 18. Assumptions & Acronyms Used 19. Research Methodology
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Wi-Fi Semiconductor Chipset Market
