Newly-released Silicon on Insulator analysis report by Future Market Insights reveals that global sales of Silicon on Insulator in 2021 were held at USD 1.1 Billion. With 14.3% projected growth from 2022 to 2032, the market is expected to reach a valuation of USD 4.9 Billion by the end of the forecast period. Smart Cut Technology is expected to be the highest revenue-generating segment, projected to grow at a CAGR of over 13.5% from 2022 to 2032.
Attributes | Details |
---|---|
Global Silicon on Insulator Size (2022) | USD 1.3 Billion |
Global Silicon on Insulator Size (2032) | USD 4.9 Billion |
Global Silicon on Insulator CAGR (2022 to 2032) | 14.3% |
USA Silicon on Insulator CAGR (2022 to 2032) | 13.6% |
Key Companies Covered | Soitec; Shin-Etsu Chemical; GlobalWafers; SUMCO Corporation; Shanghai Simgui Technology; MagnaChip Semiconductor Corp; Murata Manufacturing Co. Ltd; Tower Semiconductor Ltd; Simgui; STMicroelectronics |
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As per the Global Silicon on Insulator research by Future Market Insights - a market research and competitive intelligence provider, historically, from 2015 to 2021, the value of the Silicon on Insulator increased at around 16.1% CAGR. With an absolute dollar opportunity of USD 3.6 Bilion, the market is projected to reach a valuation of USD 4.9 Billion by 2032.
The key drivers that affect the Silicon on Insulator demand include increasing machine learning (ML) and artificial intelligence (AI) which are being used rapidly in consumer electronics.
Consumer electronics applications for SOI wafers are promising. The consumer electronics sector has been at the forefront of incorporating revolutionary technologies like artificial intelligence and machine learning into several devices in recent years. By integrating artificial intelligence and machine learning into their processes, businesses can explore new growth potential while also enhancing the consumer experience.
Disruptive technologies have permeated all consumer gadgets as a result of these technologies. Voice-enabled gadgets, smart wearables, and smart TVs are overtaking conventional electronics like smartphones, TVs, computers, cameras, and speakers in terms of adoption. Due to the acceptance and use of AI and ML, the consumer electronics sector is rebooting and may experience significant breakthroughs.
The ideal materials for creating devices for AI, ML, and numerous other wireless applications are SOI wafers. Additionally, SOI businesses are utilizing AI and ML to boost production and create wafers of higher quality. AI also imbues electronic objects with intelligence through the machine learning process, enabling them to make decisions based on sensor data in a manner similar to a human brain.
Edge data management, which makes up only a small part of all data processed, will make up about 45% of all data processed by 2030, enabling swifter data transfer and protecting data privacy. The use of edge computing and cloud-based artificial intelligence will keep up this pace. The next generation of semiconductors will be primarily driven by artificial intelligence, which is likely to be included practically in all applications and electrical devices.
The key factors that are propelling Silicon on Insulator demand are the increasing use of SOI wafer-based technology in the automotive sector. For chipmakers in the automotive industry, the growing investments in ADAS and driverless automobiles have created enormous growth prospects. In the worldwide chip market, the automotive industry has had a substantial growth rate.
New features and an increase in the use of sensors, together with recent developments in the automobile industry, are fuelling the SOI market's expansion. For instance, high-speed, low-power, small electrical equipment is needed to operate ADAS and driverless cars. As a result, SOI wafers are used to suffice these needs.
High-voltage and low-voltage components may be combined on a single chip using the SOI wafer, which would save space and money, simplify designs and models, improve performance, save development costs, and shorten the time to market. Additionally, SOI offers new approaches for well-established technologies like IoT, AI, and ML. Additionally, planar semiconductor devices with better body distortion capabilities can be scaled up owing to FD-SOI semiconductor technology. For automotive applications, FD-SOI technology provides maximum energy efficiency, the highest integrated RF performance, and improved integrated circuit dependability.
The factors restraining the market of Silicon on insulators are the effects of floating bodies, self-heating, and reduced breakdown voltage in SOI wafer-based devices.
Despite this, SOI wafer-based circuits and devices are still often used for a wide range of applications due to a number of desirable attributes, including less heating and fast heat removal. In particular, the startup of SOI wafer-based circuits and devices is much more difficult than for other types of transistors. The built-in parasitic device cannot be turned off by altering the gate bias when the parasitic device is turned on.
Devices built on SOI wafers are referred to as floating bodies when the body end is left free-floating rather than attached to the gate. The floating body's purpose is to improve device performance while consuming less power. The toxic effect that is due to the floating body produced by separation from the linear component is the principal parasitic effect in SOI-MOSFETs. The effect is associated with the accumulation of positive charge in the silicon body of the transistor, which is generated by holes that happen after impact ionization. This charge can, for the most part, be cleared without delay because the program used to blacklist the letter hasn't come to contact with the Si film yet.
Additionally, silicon oxide, an excellent thermal insulator, is positioned on top of the active thin silicon body in SOI wafer-based devices. The energy used by the active, thin body during the operation of these devices is difficult to dissipate, which raises its temperature. Devices built on SOI wafers may suffer damage or have their performance decreased as a result of the thin active body's increased temperature. Therefore, the market growth is being constrained by self-heating effects, floating bodies, and reduced breakdown voltage in SOI wafer-based devices.
North America is anticipated to have the largest Silicon on Insulator market throughout the projection period. The growing need for microprocessors and microcontrollers is driving the expansion of the Silicon Insulator industry in North America.
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The USA is expected to account for the highest market of USD 1.6 Billion by the end of 2032. It is expected to be projected to have an absolute dollar growth of USD 1.1 Billion. The market for Silicon Insulators in the country is growing as a result of a surge in the number of automated cars sold. Tesla is one of the first adopters of Silicon on Insulator for its EVs.
Smart-cut technology of Silicon on Insulators accounts for the largest revenue. In order to obtain SOI materials, smart cutting technology was initially created. High-quality SOI wafers can now be produced in industrial quantities due to their advanced maturity. Smart cut technology has a number of benefits, including excellent thickness homogeneity and high-quality transferred layers. The Silicon on Insulator market's smart cutting is anticipated to grow as a result of these features.
The most widely utilized application of Silicon in the Insulator market is RF-SOI. The expansion of the RF segment can be connected to the increased need for front-end modules in 5G technology as well as consumer electronic products like smartphones, laptops, and tablets. In 4G LTE-A and 5G smartphones, base stations, and other devices, RF is one of the most important designs.
The interface between the antenna and the RF transceiver that contains RF components is required for analog performance, such as several RF switches (used in both Tx and Rx channels), low-noise amplifiers (LNAs), power amplifiers (PAs), and antenna tuners. The increasing utilization of multiple antenna elements in 5G technology is driving market expansion for the RF FEM devices category as well as rising demand for RF silicon content in the newest smartphones. Companies are creating a portfolio of RF-SOI devices in an effort to take advantage of this demand.
Players in the market are constantly developing improved analytical solutions as well as extending their product offerings. The companies in Silicon on Insulator are focused on their alliances, technology collaborations, and product launch strategies. The Tier 2 Players in the market are targeting to increase their Silicon on Insulator share.
Some of the recent developments in the Silicon on Insulator are:
The global Silicon on Insulator market is worth more than USD 1.3 Billion at present.
The value of Silicon on Insulator is projected to increase at a CAGR of around 14.3% from 2022 to 2032.
The value of Silicon on Insulator increased at a CAGR of around 16.1% from 2015 to 2021.
The global demand for Silicon on Insulator is being fueled by significant growth in the need for operational efficiency enhancements and process simplification.
The growth of Silicon on Insulator Market in China is projected to expand at a CAGR of around 13.4% from 2022 to 2032.
The growth of the market for Silicon on Insulator in the United States is projected to expand at a CAGR of around 13.6% during 2022 to 2032.
While the market in South Korea is expected to grow at nearly 12.5%, the market in Japan is projected to register a CAGR of nearly 13.1% from 2022 to 2032.
1. Executive Summary 2. Market Overview 3. Market Risks and Trends Assessment 4. Market Background 5. Key Success Factors 6. Global Market Demand Analysis 2015 to 2021 and Forecast, 2022 to 2032 7. Global Market Value Analysis 2015 to 2021 and Forecast, 2022 to 2032 8. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Thickness 8.1. Thin Film SOI Wafers 8.2. Thick Film SOI Wafers 9. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Wafer Size 9.1. 200 MM and Less than 200 MM 9.2. 300 MM 10. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Wafer Type 10.1. RF-SOI 10.2. FD-SOI 10.3. PD-SOI 10.4. Power-SOI 10.5. Emerging-SOI 11. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Technology 11.1. Smart Cut 11.2. Bonding SOI 11.3. Layer Transfer SOI 12. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Product 12.1. RF FEM Products 12.2. MEMS Devices 12.3. Power Products 12.4. Optical Communication 12.5. Image Sensing 13. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Application 13.1. Consumer Electronics 13.2. Automotive 13.3. Datacom & Telecom 13.4. Industrial 13.5. Military, Defense, and Aerospace 14. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Region 14.1. North America 14.2. Latin America 14.3. Europe 14.4. Asia Pacific 14.5. Middle East and Africa (MEA) 15. North America Market Analysis 2015 to 2021 and Forecast 2022 to 2032 16. Latin America Market Analysis 2015 to 2021 and Forecast 2022 to 2032 17. Europe Market Analysis 2015 to 2021 and Forecast 2022 to 2032 18. Asia Pacific Market Analysis 2015 to 2021 and Forecast 2022 to 2032 19. Middle East and Africa Market Analysis 2015 to 2021 and Forecast 2022 to 2032 20. Key Countries Market Analysis 2015 to 2021 and Forecast 2022 to 2032 21. Market Structure Analysis 22. Competition Analysis 22.1. Soitec 22.2. Shin-Etsu Chemical 22.3. GlobalWafers 22.4. SUMCO Corporation 22.5. Shanghai Simgui Technology 22.6. GlobalFoundries Inc. 22.7. STMicroelectronics 22.8. Tower Semiconductor Ltd. 22.9. NXP Semiconductors N.V. 22.10. Murata Manufacturing 23. Assumptions and Acronyms Used 24. Research Methodology
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