[250 Pages Report] Newly-released Silicon on Insulator analysis report by Future Market Insights reveals that global sales of Silicon on Insulator in 2021 were held at US$ 1.1 Billion. With 14.3% projected growth from 2022 to 2032, the market is expected to reach a valuation of US$ 4.9 Billion by the end of the forecast period. Smart Cut Technology is expected to be the highest revenue-generating segment, projected to grow at a CAGR of over 13.5% from 2022 to 2032.
| Attributes | Details |
|---|---|
| Global Silicon on Insulator Size (2022) | US$ 1.3 Billion |
| Global Silicon on Insulator Size (2032) | US$ 4.9 Billion |
| Global Silicon on Insulator CAGR (2022 to 2032) | 14.3% |
| USA Silicon on Insulator CAGR (2022 to 2032) | 13.6% |
| Key Companies Covered |
|
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As per the Global Silicon on Insulator research by Future Market Insights - a market research and competitive intelligence provider, historically, from 2015 to 2021, the value of the Silicon on Insulator increased at around 16.1% CAGR. With an absolute dollar opportunity of US$ 3.6 Bilion, the market is projected to reach a valuation of US$ 4.9 Billion by 2032.
The key drivers that affect the Silicon on Insulator demand include increasing machine learning (ML) and artificial intelligence (AI) which are being used rapidly in consumer electronics.
Consumer electronics applications for SOI wafers are promising. The consumer electronics sector has been at the forefront of incorporating revolutionary technologies like artificial intelligence and machine learning into several devices in recent years. By integrating artificial intelligence and machine learning into their processes, businesses can explore new growth potential while also enhancing the consumer experience.
Disruptive technologies have permeated all consumer gadgets as a result of these technologies. Voice-enabled gadgets, smart wearables, and smart TVs are overtaking conventional electronics like smartphones, TVs, computers, cameras, and speakers in terms of adoption. Due to the acceptance and use of AI and ML, the consumer electronics sector is rebooting and may experience significant breakthroughs.
The ideal materials for creating devices for AI, ML, and numerous other wireless applications are SOI wafers. Additionally, SOI businesses are utilizing AI and ML to boost production and create wafers of higher quality. AI also imbues electronic objects with intelligence through the machine learning process, enabling them to make decisions based on sensor data in a manner similar to a human brain.
Edge data management, which makes up only a small part of all data processed, will make up about 45% of all data processed by 2030, enabling swifter data transfer and protecting data privacy. The use of edge computing and cloud-based artificial intelligence will keep up this pace. The next generation of semiconductors will be primarily driven by artificial intelligence, which is likely to be included practically in all applications and electrical devices.
The key factors that are propelling Silicon on Insulator demand are the increasing use of SOI wafer-based technology in the automotive sector. For chipmakers in the automotive industry, the growing investments in ADAS and driverless automobiles have created enormous growth prospects. In the worldwide chip market, the automotive industry has had a substantial growth rate.
New features and an increase in the use of sensors, together with recent developments in the automobile industry, are fuelling the SOI market's expansion. For instance, high-speed, low-power, small electrical equipment is needed to operate ADAS and driverless cars. As a result, SOI wafers are used to suffice these needs.
High-voltage and low-voltage components may be combined on a single chip using the SOI wafer, which would save space and money, simplify designs and models, improve performance, save development costs, and shorten the time to market. Additionally, SOI offers new approaches for well-established technologies like IoT, AI, and ML. Additionally, planar semiconductor devices with better body distortion capabilities can be scaled up owing to FD-SOI semiconductor technology. For automotive applications, FD-SOI technology provides maximum energy efficiency, the highest integrated RF performance, and improved integrated circuit dependability.
Principal Consultant
The factors restraining the market of Silicon on insulators are the effects of floating bodies, self-heating, and reduced breakdown voltage in SOI wafer-based devices.
Despite this, SOI wafer-based circuits and devices are still often used for a wide range of applications due to a number of desirable attributes, including less heating and fast heat removal. In particular, the startup of SOI wafer-based circuits and devices is much more difficult than for other types of transistors. The built-in parasitic device cannot be turned off by altering the gate bias when the parasitic device is turned on.
Devices built on SOI wafers are referred to as floating bodies when the body end is left free-floating rather than attached to the gate. The floating body's purpose is to improve device performance while consuming less power. The toxic effect that is due to the floating body produced by separation from the linear component is the principal parasitic effect in SOI-MOSFETs. The effect is associated with the accumulation of positive charge in the silicon body of the transistor, which is generated by holes that happen after impact ionization. This charge can, for the most part, be cleared without delay because the program used to blacklist the letter hasn't come to contact with the Si film yet.
Additionally, silicon oxide, an excellent thermal insulator, is positioned on top of the active thin silicon body in SOI wafer-based devices. The energy used by the active, thin body during the operation of these devices is difficult to dissipate, which raises its temperature. Devices built on SOI wafers may suffer damage or have their performance decreased as a result of the thin active body's increased temperature. Therefore, the market growth is being constrained by self-heating effects, floating bodies, and reduced breakdown voltage in SOI wafer-based devices.
North America is anticipated to have the largest Silicon on Insulator market throughout the projection period. The growing need for microprocessors and microcontrollers is driving the expansion of the Silicon Insulator industry in North America.
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The USA is expected to account for the highest market of US$ 1.6 Billion by the end of 2032. It is expected to be projected to have an absolute dollar growth of US$ 1.1 Billion. The market for Silicon Insulators in the country is growing as a result of a surge in the number of automated cars sold. Tesla is one of the first adopters of Silicon on Insulator for its EVs.
Smart-cut technology of Silicon on Insulators accounts for the largest revenue. In order to obtain SOI materials, smart cutting technology was initially created. High-quality SOI wafers can now be produced in industrial quantities due to their advanced maturity. Smart cut technology has a number of benefits, including excellent thickness homogeneity and high-quality transferred layers. The Silicon on Insulator market's smart cutting is anticipated to grow as a result of these features.
The most widely utilized application of Silicon in the Insulator market is RF-SOI. The expansion of the RF segment can be connected to the increased need for front-end modules in 5G technology as well as consumer electronic products like smartphones, laptops, and tablets. In 4G LTE-A and 5G smartphones, base stations, and other devices, RF is one of the most important designs.
The interface between the antenna and the RF transceiver that contains RF components is required for analog performance, such as several RF switches (used in both Tx and Rx channels), low-noise amplifiers (LNAs), power amplifiers (PAs), and antenna tuners. The increasing utilization of multiple antenna elements in 5G technology is driving market expansion for the RF FEM devices category as well as rising demand for RF silicon content in the newest smartphones. Companies are creating a portfolio of RF-SOI devices in an effort to take advantage of this demand.
Players in the market are constantly developing improved analytical solutions as well as extending their product offerings. The companies in Silicon on Insulator are focused on their alliances, technology collaborations, and product launch strategies. The Tier 2 Players in the market are targeting to increase their Silicon on Insulator share.
Some of the recent developments in the Silicon on Insulator are:
The global Silicon on Insulator market is worth more than US$ 1.3 Billion at present.
The value of Silicon on Insulator is projected to increase at a CAGR of around 14.3% from 2022 to 2032.
The value of Silicon on Insulator increased at a CAGR of around 16.1% from 2015 to 2021.
The global demand for Silicon on Insulator is being fueled by significant growth in the need for operational efficiency enhancements and process simplification.
The growth of Silicon on Insulator Market in China is projected to expand at a CAGR of around 13.4% from 2022 to 2032.
The growth of the market for Silicon on Insulator in the United States is projected to expand at a CAGR of around 13.6% during 2022 to 2032.
While the market in South Korea is expected to grow at nearly 12.5%, the market in Japan is projected to register a CAGR of nearly 13.1% from 2022 to 2032.
1. Executive Summary | Silicon on Insulator (SOI) Market
1.1. Global Market Outlook
1.2. Summary of Statistics
1.3. Key Market Characteristics & Attributes
1.4. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Risks and Trends Assessment
3.1. Risk Assessment
3.1.1. COVID-19 Crisis and Impact on Demand
3.1.2. COVID-19 Impact Benchmark with Previous Crisis
3.1.3. Impact on Market Value (US$ Million)
3.1.4. Assessment by Key Countries
3.1.5. Assessment by Key Market Segments
3.1.6. Action Points and Recommendation for Suppliers
3.2. Key Trends Impacting the Market
3.3. Formulation and Product Development Trends
4. Market Background
4.1. Market By Country, US$ Million
4.2. Market Opportunity Assessment (US$ Million)
4.2.1. Total Available Market
4.2.2. Serviceable Addressable Market
4.2.3. Serviceable Obtainable Market
4.3. Market Scenario Forecast
4.3.1. Demand in optimistic Scenario
4.3.2. Demand in Likely Scenario
4.3.3. Demand in Conservative Scenario
4.4. Investment Feasibility Analysis
4.4.1. Investment in Established Markets
4.4.1.1. In Short Term
4.4.1.2. In Long Term
4.4.2. Investment in Emerging Markets
4.4.2.1. In Short Term
4.4.2.2. In Long Term
4.5. Forecast Factors - Relevance & Impact
4.5.1. Top Companies Historical Growth
4.5.2. Global Market Growth
4.5.3. Adoption Rate, by Country
4.6. Market Dynamics
4.6.1. Market Driving Factors and Impact Assessment
4.6.2. Prominent Market Challenges and Impact Assessment
4.6.3. Market Opportunities
4.6.4. Prominent Trends in the Global Market & Their Impact Assessment
5. Key Success Factors
5.1. Manufacturers’ Focus on Low Penetration High Growth Markets
5.2. Banking on with Segments High Incremental Opportunity
5.3. Peer Benchmarking
6. Global Market Demand Analysis 2015 to 2021 and Forecast, 2022 to 2032
6.1. Historical Market Analysis, 2015 to 2021
6.2. Current and Future Market Projections, 2022 to 2032
6.3. Y-o-Y Growth Trend Analysis
7. Global Market Value Analysis 2015 to 2021 and Forecast, 2022 to 2032
7.1. Historical Market Value (US$ Million) Analysis, 2015 to 2021
7.2. Current and Future Market Value (US$ Million) Projections, 2022 to 2032
7.2.1. Y-o-Y Growth Trend Analysis
7.2.2. Absolute $ Opportunity Analysis
8. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Thickness
8.1. Introduction / Key Findings
8.2. Historical Market Value (US$ Million) and Analysis By Thickness, 2015 to 2021
8.3. Current and Future Market Value (US$ Million) and Analysis and Forecast By Thickness, 2022 to 2032
8.3.1. Thin Film SOI Wafers
8.3.2. Thick Film SOI Wafers
8.4. Market Attractiveness Analysis By Thickness
9. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Wafer Size
9.1. Introduction / Key Findings
9.2. Historical Market Value (US$ Million) & Volume ( Million Units) and Analysis By Wafer Size, 2015 to 2021
9.3. Current and Future Market Value (US$ Million) & Volume ( Million Units) and Analysis and Forecast By Wafer Size, 2022 to 2032
9.3.1. 200 MM and Less than 200 MM
9.3.2. 300 MM
9.4. Market Attractiveness Analysis By Wafer Size
10. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Wafer Type
10.1. Introduction / Key Findings
10.2. Historical Market Value (US$ Million) and Analysis By Wafer Type, 2015 to 2021
10.3. Current and Future Market Value (US$ Million) and Analysis and Forecast By Wafer Type, 2022 to 2032
10.3.1. RF-SOI
10.3.2. FD-SOI
10.3.3. PD-SOI
10.3.4. Power-SOI
10.3.5. Emerging-SOI
10.4. Market Attractiveness Analysis By Wafer Type
11. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Technology
11.1. Introduction / Key Findings
11.2. Historical Market Value (US$ Million) and Analysis By Technology, 2015 to 2021
11.3. Current and Future Market Value (US$ Million) and Analysis and Forecast By Technology, 2022 to 2032
11.3.1. Smart Cut
11.3.2. Bonding SOI
11.3.3. Layer Transfer SOI
11.4. Market Attractiveness Analysis By Technology
12. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Product
12.1. Introduction / Key Findings
12.2. Historical Market Value (US$ Million) and Analysis By Product, 2015 to 2021
12.3. Current and Future Market Value (US$ Million) and Analysis and Forecast By Product, 2022 to 2032
12.3.1. RF FEM Products
12.3.2. MEMS Devices
12.3.3. Power Products
12.3.4. Optical Communication
12.3.5. Image Sensing
12.4. Market Attractiveness Analysis By Product
13. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Application
13.1. Introduction
13.2. Historical Market Value (US$ Million) and Analysis By Application, 2015 to 2021
13.3. Current Market Size (US$ Million) & Analysis and Forecast By Application, 2022 to 2032
13.3.1. Consumer Electronics
13.3.2. Automotive
13.3.3. Datacom & Telecom
13.3.4. Industrial
13.3.5. Military, Defense, and Aerospace
13.4. Market Attractiveness Analysis By Application
14. Global Market Analysis 2015 to 2021 and Forecast 2022 to 2032, By Region
14.1. Introduction
14.2. Historical Market Value (US$ Million) and Analysis By Region, 2015 to 2021
14.3. Current Market Size (US$ Million) & Analysis and Forecast By Region, 2022 to 2032
14.3.1. North America
14.3.2. Latin America
14.3.3. Europe
14.3.4. Asia Pacific
14.3.5. Middle East and Africa (MEA)
14.4. Market Attractiveness Analysis By Region
15. North America Market Analysis 2015 to 2021 and Forecast 2022 to 2032
15.1. Introduction
15.2. Pricing Analysis
15.3. Historical Market Value (US$ Million) and Trend Analysis By Market Taxonomy, 2015 to 2021
15.4. Market Value (US$ Million) & Forecast By Market Taxonomy, 2022 to 2032
15.4.1. By Country
15.4.1.1. United States of America
15.4.1.2. Canada
15.4.2. By Wafer Type
15.4.3. By Thickness
15.4.4. By Wafer Size
15.4.5. By Technology
15.4.6. By Product
15.4.7. By Application
15.5. Market Attractiveness Analysis
15.5.1. By Country
15.5.2. By Wafer Type
15.5.3. By Thickness
15.5.4. By Wafer Size
15.5.5. By Technology
15.5.6. By Product
15.5.7. By Application
16. Latin America Market Analysis 2015 to 2021 and Forecast 2022 to 2032
16.1. Introduction
16.2. Pricing Analysis
16.3. Historical Market Value (US$ Million) and Trend Analysis By Market Taxonomy, 2015 to 2021
16.4. Market Value (US$ Million) & Forecast By Market Taxonomy, 2022 to 2032
16.4.1. By Country
16.4.1.1. Brazil
16.4.1.2. Mexico
16.4.1.3. Rest of Latin America
16.4.2. By Wafer Type
16.4.3. By Thickness
16.4.4. By Wafer Size
16.4.5. By Technology
16.4.6. By Product
16.4.7. By Application
16.5. Market Attractiveness Analysis
16.5.1. By Country
16.5.2. By Wafer Type
16.5.3. By Thickness
16.5.4. By Wafer Size
16.5.5. By Technology
16.5.6. By Product
16.5.7. By Application
17. Europe Market Analysis 2015 to 2021 and Forecast 2022 to 2032
17.1. Introduction
17.2. Pricing Analysis
17.3. Historical Market Value (US$ Million) and Trend Analysis By Market Taxonomy, 2015 to 2021
17.4. Market Value (US$ Million) & Forecast By Market Taxonomy, 2022 to 2032
17.4.1. By Country
17.4.1.1. Germany
17.4.1.2. France
17.4.1.3. United Kingdom
17.4.1.4. Italy
17.4.1.5. Benelux
17.4.1.6. Russia
17.4.1.7. Rest of Europe
17.4.2. By Wafer Type
17.4.3. By Thickness
17.4.4. By Wafer Size
17.4.5. By Technology
17.4.6. By Product
17.4.7. By Application
17.5. Market Attractiveness Analysis
17.5.1. By Country
17.5.2. By Wafer Type
17.5.3. By Thickness
17.5.4. By Wafer Size
17.5.5. By Technology
17.5.6. By Product
17.5.7. By Application
18. Asia Pacific Market Analysis 2015 to 2021 and Forecast 2022 to 2032
18.1. Introduction
18.2. Pricing Analysis
18.3. Historical Market Value (US$ Million) and Trend Analysis By Market Taxonomy, 2015 to 2021
18.4. Market Value (US$ Million) & Forecast By Market Taxonomy, 2022 to 2032
18.4.1. By Country
18.4.1.1. China
18.4.1.2. Japan
18.4.1.3. South Korea
18.4.1.4. Rest of Asia Pacific
18.4.2. By Wafer Type
18.4.3. By Thickness
18.4.4. By Wafer Size
18.4.5. By Technology
18.4.6. By Product
18.4.7. By Application
18.5. Market Attractiveness Analysis
18.5.1. By Country
18.5.2. By Wafer Type
18.5.3. By Thickness
18.5.4. By Wafer Size
18.5.5. By Technology
18.5.6. By Product
18.5.7. By Application
19. Middle East and Africa Market Analysis 2015 to 2021 and Forecast 2022 to 2032
19.1. Introduction
19.2. Pricing Analysis
19.3. Historical Market Value (US$ Million) and Trend Analysis By Market Taxonomy, 2015 to 2021
19.4. Market Value (US$ Million) & Forecast By Market Taxonomy, 2022 to 2032
19.4.1. By Country
19.4.1.1. GCC Countries
19.4.1.2. South Africa
19.4.1.3. Turkey
19.4.1.4. Rest of Middle East and Africa
19.4.2. By Wafer Type
19.4.3. By Thickness
19.4.4. By Wafer Size
19.4.5. By Technology
19.4.6. By Product
19.4.7. By Application
19.5. Market Attractiveness Analysis
19.5.1. By Country
19.5.2. By Wafer Type
19.5.3. By Thickness
19.5.4. By Wafer Size
19.5.5. By Technology
19.5.6. By Product
19.5.7. By Application
20. Key Countries Market Analysis 2015 to 2021 and Forecast 2022 to 2032
20.1. Introduction
20.1.1. Market Value Proportion Analysis, By Key Countries
20.1.2. Global Vs. Country Growth Comparison
20.2. US Market Analysis
20.2.1. Value Proportion Analysis by Market Taxonomy
20.2.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.2.2.1. By Wafer Type
20.2.2.2. By Thickness
20.2.2.3. By Wafer Size
20.2.2.4. By Technology
20.2.2.5. By Product
20.2.2.6. By Application
20.3. Canada Market Analysis
20.3.1. Value Proportion Analysis by Market Taxonomy
20.3.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.3.2.1. By Wafer Type
20.3.2.2. By Thickness
20.3.2.3. By Wafer Size
20.3.2.4. By Technology
20.3.2.5. By Product
20.3.2.6. By Application
20.4. Mexico Market Analysis
20.4.1. Value Proportion Analysis by Market Taxonomy
20.4.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.4.2.1. By Wafer Type
20.4.2.2. By Thickness
20.4.2.3. By Wafer Size
20.4.2.4. By Technology
20.4.2.5. By Product
20.4.2.6. By Application
20.5. Brazil Market Analysis
20.5.1. Value Proportion Analysis by Market Taxonomy
20.5.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.5.2.1. By Wafer Type
20.5.2.2. By Thickness
20.5.2.3. By Wafer Size
20.5.2.4. By Technology
20.5.2.5. By Product
20.5.2.6. By Application
20.6. Germany Market Analysis
20.6.1. Value Proportion Analysis by Market Taxonomy
20.6.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.6.2.1. By Wafer Type
20.6.2.2. By Thickness
20.6.2.3. By Wafer Size
20.6.2.4. By Technology
20.6.2.5. By Product
20.6.2.6. By Application
20.7. France Market Analysis
20.7.1. Value Proportion Analysis by Market Taxonomy
20.7.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.7.2.1. By Wafer Type
20.7.2.2. By Thickness
20.7.2.3. By Wafer Size
20.7.2.4. By Technology
20.7.2.5. By Product
20.7.2.6. By Application
20.8. Italy Market Analysis
20.8.1. Value Proportion Analysis by Market Taxonomy
20.8.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.8.2.1. By Wafer Type
20.8.2.2. By Thickness
20.8.2.3. By Wafer Size
20.8.2.4. By Technology
20.8.2.5. By Product
20.8.2.6. By Application
20.9. Russia Market Analysis
20.9.1. Value Proportion Analysis by Market Taxonomy
20.9.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.9.2.1. By Wafer Type
20.9.2.2. By Thickness
20.9.2.3. By Wafer Size
20.9.2.4. By Technology
20.9.2.5. By Product
20.9.2.6. By Application
20.10. UK Market Analysis
20.10.1. Value Proportion Analysis by Market Taxonomy
20.10.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.10.2.1. By Wafer Type
20.10.2.2. By Thickness
20.10.2.3. By Wafer Size
20.10.2.4. By Technology
20.10.2.5. By Product
20.10.2.6. By Application
20.11. Benelux Market Analysis
20.11.1. Value Proportion Analysis by Market Taxonomy
20.11.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.11.2.1. By Wafer Type
20.11.2.2. By Thickness
20.11.2.3. By Wafer Size
20.11.2.4. By Technology
20.11.2.5. By Product
20.11.2.6. By Application
20.12. China Market Analysis
20.12.1. Value Proportion Analysis by Market Taxonomy
20.12.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.12.2.1. By Wafer Type
20.12.2.2. By Thickness
20.12.2.3. By Wafer Size
20.12.2.4. By Technology
20.12.2.5. By Product
20.12.2.6. By Application
20.13. Japan Market Analysis
20.13.1. Value Proportion Analysis by Market Taxonomy
20.13.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.13.2.1. By Wafer Type
20.13.2.2. By Thickness
20.13.2.3. By Wafer Size
20.13.2.4. By Technology
20.13.2.5. By Product
20.13.2.6. By Application
20.14. South Korea Market Analysis
20.14.1. Value Proportion Analysis by Market Taxonomy
20.14.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.14.2.1. By Wafer Type
20.14.2.2. By Thickness
20.14.2.3. By Wafer Size
20.14.2.4. By Technology
20.14.2.5. By Product
20.14.2.6. By Application
20.15. GCC Countries Market Analysis
20.15.1. Value Proportion Analysis by Market Taxonomy
20.15.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.15.2.1. By Wafer Type
20.15.2.2. By Thickness
20.15.2.3. By Wafer Size
20.15.2.4. By Technology
20.15.2.5. By Product
20.15.2.6. By Application
20.16. South Africa Market Analysis
20.16.1. Value Proportion Analysis by Market Taxonomy
20.16.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.16.2.1. By Wafer Type
20.16.2.2. By Thickness
20.16.2.3. By Wafer Size
20.16.2.4. By Technology
20.16.2.5. By Product
20.16.2.6. By Application
20.17. Turkey Market Analysis
20.17.1. Value Proportion Analysis by Market Taxonomy
20.17.2. Value & Analysis and Forecast by Market Taxonomy, 2015 to 2032
20.17.2.1. By Wafer Type
20.17.2.2. By Thickness
20.17.2.3. By Wafer Size
20.17.2.4. By Technology
20.17.2.5. By Product
20.17.2.6. By Application
20.17.3. Competition Landscape and Player Concentration in the Country
21. Market Structure Analysis
21.1. Market Analysis by Tier of Companies
21.2. Market Concentration
21.3. Market Share Analysis of Top Players
21.4. Market Presence Analysis
21.4.1. By Regional Footprint of Players
21.4.2. Product Footprint by Players
22. Competition Analysis
22.1. Competition Dashboard
22.2. Competition Benchmarking
22.3. Competition Deep Dive
22.3.1. Soitec
22.3.1.1. Overview
22.3.1.2. Product Portfolio
22.3.1.3. Sales Footprint
22.3.1.4. Strategy Overview
22.3.2. Shin-Etsu Chemical
22.3.2.1. Overview
22.3.2.2. Product Portfolio
22.3.2.3. Sales Footprint
22.3.2.4. Strategy Overview
22.3.3. GlobalWafers
22.3.3.1. Overview
22.3.3.2. Product Portfolio
22.3.3.3. Sales Footprint
22.3.3.4. Strategy Overview
22.3.4. SUMCO Corporation
22.3.4.1. Overview
22.3.4.2. Product Portfolio
22.3.4.3. Sales Footprint
22.3.4.4. Strategy Overview
22.3.5. Shanghai Simgui Technology
22.3.5.1. Overview
22.3.5.2. Product Portfolio
22.3.5.3. Sales Footprint
22.3.5.4. Strategy Overview
22.3.6. GlobalFoundries Inc.
22.3.6.1. Overview
22.3.6.2. Product Portfolio
22.3.6.3. Sales Footprint
22.3.6.4. Strategy Overview
22.3.7. STMicroelectronics
22.3.7.1. Overview
22.3.7.2. Product Portfolio
22.3.7.3. Sales Footprint
22.3.7.4. Strategy Overview
22.3.8. Tower Semiconductor Ltd.
22.3.8.1. Overview
22.3.8.2. Product Portfolio
22.3.8.3. Sales Footprint
22.3.8.4. Strategy Overview
22.3.9. NXP Semiconductors N.V.
22.3.9.1. Overview
22.3.9.2. Product Portfolio
22.3.9.3. Sales Footprint
22.3.9.4. Strategy Overview
22.3.10. Murata Manufacturing
22.3.10.1. Overview
22.3.10.2. Product Portfolio
22.3.10.3. Sales Footprint
22.3.10.4. Strategy Overview
23. Assumptions and Acronyms Used
24. Research Methodology
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Silicon on Insulator (SOI) Market
