The global quad-flat-no-lead packaging market is valued at around US$ 62 billion, and is expected to reach a valuation of more than US$ 235 billion by the end of the projection year. During the forecast period (2017 to 2027), the global quad-flat-no-lead packaging market is expected to grow at a high CAGR of 13.1%.
Attribute | Details |
---|---|
Estimated market value of quad-flat-no-lead packaging in 2017 | US$ 62 Billion |
Projected market value of quad-flat-no-lead packaging by 2026 | US$ 235 Billion |
CAGR during 2017 to 2026 | 13.1%. |
The quad-flat-no-lead segment has a valuation of approximately US$ 30 billion and is expected to reach a value of more than US$ 95 billion by the end of 2027.
Don't pay for what you don't need
Customize your report by selecting specific countries or regions and save 30%!
In the years to follow, it is anticipated that the consumer electronics and automotive sectors would witness high growth. This substantial growth is attributed towards increased adoption of advanced technologies such as wearable devices and electronic automobile accessories.
Wearable devices such as personal medical monitoring devices, wristwatch and others are small electronic devices that re widely being used among customers thus triggering the demand for packages as compact as UQFN or QFN.
Additionally, almost every car manufacturer provides accessories such as keyless locks and unlock systems for car doors. Such devices boost the demand for QFN package. Thus vendors have tremendous opportunities to offer their offerings in these sectors and invest in their product innovation with a view to create more compact and enhanced global quad-flat-no-lead packages.
Quad-flat-no-lead segment in the QFN variant category of the global market is anticipated to account for a high market share in the coming years. In the previous years, this segment contributed largely to the growth of the global market by reflecting high market valuation.
It is expected from this segment to retain its status quo in the coming years. In 2017, this segment reflected a valuation a bit under US$ 30 Bn and is estimated to touch a value of more than US$ 95 Bn by the end of the year of assessment (2027). This segment is projected to grow at a CAGR of 12.4% during the period of forecast.
Very thin quad-flat-no-lead segment in the QFN variant category is projected to grow at a high rate and is expected to be the second fastest growing segment. It is expected to register a CAGR of 13.5% throughout the period of assessment. In 2017, this segment was estimated a value a bit over US$ 17 Bn and with this significant growth rate, it is anticipated to reach a valuation of around US$ 63 Bn by the end of the year of forecast.
The very thin quad-flat-no-lead segment is likely to follow the quad- flat-no-leads segment in terms of market value and thus is expected to be the second largest segment in the global quad-flat-no-lead packaging market.
By Type:
By QFN Variants:
By Applications:
By Region:
Get the data you need at a Fraction of the cost
Personalize your report by choosing insights you need
and save 40%!
The global quad-flat-no-lead packaging market is valued at around US$ 62 billion, and it is expected to reach a valuation of more than US$ 235 billion by the end of 2027.
Amkor Technology, Texas Instruments, ASE Group and UTAC Group are some leading quad-flat-no-lead packaging providers
1. Executive Summary 1.1. Market Overview 1.2. Market Analysis 1.3. FMI Recommendations 2. Market Introduction 2.1. Market Taxonomy 2.2. Market Definition 2.3. Quad Flat No-Leads Packaging – Solution Overview 3. Market View Point 3.1. Macro-Economic Factors 3.2. Opportunity Analysis 3.3. Patents Overview 4. Global Market Analysis 2012–2016 and Forecast 2017–2027 4.1. Market Size and Y-o-Y Growth 4.2. Absolute $ Opportunity 4.3. Value Chain 4.4. Key Regulations 4.5. Global Trends 5. North America Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 5.1. Introduction 5.2. Regional Market Dynamics 5.2.1. Drivers 5.2.2. Restraints 5.3. Market Size (US$ Mn) By Country, 2012-2016 5.3.1. U.S. 5.3.2. Canada 5.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027 5.4.1. U.S. 5.4.2. Canada 5.5. Market Value Share & BPS Analysis, By Country 5.6. Market Size (US$ Mn) and Forecast, By Type 5.6.1. Air-cavity QFNs 5.6.2. Plastic-moulded QFNs 5.7. Market Size (US$ Mn) and Forecast, By QFN Variants 5.7.1. Very thin quad flat no-lead (VQFN) 5.7.2. Ultrathin quad flat no-lead (UQFN) 5.7.3. Quad flat no-lead (QFN) 5.7.4. Others 5.8. Market Size (US$ Mn) and Forecast, By Applications 5.8.1. Radio Frequency (RF) 5.8.2. Wearable Devices 5.8.3. Portable devices 5.8.4. Others 5.9. Drivers and Restraints: Impact Analysis 5.10. Market Attractiveness Analysis 5.10.1. By Country 5.10.2. By Type 5.10.3. By QFN Variant 5.10.4. By Application 5.11. Key Representative Market Participants - Market Presence (Intensity Map) 6. Western Europe Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 6.1. Introduction 6.2. Regional Market Dynamics 6.2.1. Drivers 6.2.2. Restraints 6.3. Market Size (US$ Mn) By Country, 2012-2016 6.3.1. Germany 6.3.2. France 6.3.3. U.K. 6.3.4. Spain 6.3.5. Italy 6.3.6. BENELUX 6.3.7. Nordic 6.3.8. Rest of Western Europe 6.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027 6.4.1. Germany 6.4.2. France 6.4.3. U.K. 6.4.4. Spain 6.4.5. Italy 6.4.6. BENELUX 6.4.7. Nordic 6.4.8. Rest of Western Europe 6.5. Market Value Share & BPS Analysis, By Country 6.6. Market Size (US$ Mn) and Forecast, By Type 6.6.1. Air-cavity QFNs 6.6.2. Plastic-moulded QFNs 6.7. Market Size (US$ Mn) and Forecast, By QFN Variants 6.7.1. Very thin quad flat no-lead (VQFN) 6.7.2. Ultrathin quad flat no-lead (UQFN) 6.7.3. Quad flat no-lead (QFN) 6.7.4. Others 6.8. Market Size (US$ Mn) and Forecast, By Applications 6.8.1. Radio Frequency (RF) 6.8.2. Wearable Devices 6.8.3. Portable devices 6.8.4. Others 6.9. Drivers and Restraints: Impact Analysis 6.10. Market Attractiveness Analysis 6.10.1. By Country 6.10.2. By Type 6.10.3. By QFN Variant 6.10.4. By Application 6.11. Key Representative Market Participants - Market Presence (Intensity Map) 7. Eastern Europe Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 7.1. Introduction 7.2. Regional Market Dynamics 7.2.1. Drivers 7.2.2. Restraints 7.3. Market Size (US$ Mn) By Country, 2012-2016 7.3.1. Russia 7.3.2. Poland 7.3.3. Rest of Eastern Europe 7.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027 7.4.1. Russia 7.4.2. Poland 7.4.3. Rest of Eastern Europe 7.5. Market Value Share & BPS Analysis, By Country 7.6. Market Size (US$ Mn) and Forecast, By Type 7.6.1. Air-cavity QFNs 7.6.2. Plastic-moulded QFNs 7.7. Market Size (US$ Mn) and Forecast, By QFN Variants 7.7.1. Very thin quad flat no-lead (VQFN) 7.7.2. Ultrathin quad flat no-lead (UQFN) 7.7.3. Quad flat no-lead (QFN) 7.7.4. Others 7.8. Market Size (US$ Mn) and Forecast, By Applications 7.8.1. Radio Frequency (RF) 7.8.2. Wearable Devices 7.8.3. Portable devices 7.8.4. Others 7.9. Drivers and Restraints: Impact Analysis 7.10. Market Attractiveness Analysis 7.10.1. By Country 7.10.2. By Type 7.10.3. By QFN Variant 7.10.4. By Application 7.11. Key Representative Market Participants - Market Presence (Intensity Map) 8. Latin America Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 8.1. Introduction 8.2. Regional Market Dynamics 8.2.1. Drivers 8.2.2. Restraints 8.3. Market Size (US$ Mn) By Country, 2012-2016 8.3.1. Brazil 8.3.2. Mexico 8.3.3. Rest of Latin America 8.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027 8.4.1. Brazil 8.4.2. Mexico 8.4.3. Rest of Latin America 8.5. Market Value Share & BPS Analysis, By Country 8.6. Market Size (US$ Mn) and Forecast, By Type 8.6.1. Air-cavity QFNs 8.6.2. Plastic-moulded QFNs 8.7. Market Size (US$ Mn) and Forecast, By QFN Variants 8.7.1. Very thin quad flat no-lead (VQFN) 8.7.2. Ultrathin quad flat no-lead (UQFN) 8.7.3. Quad flat no-lead (QFN) 8.7.4. Others 8.8. Market Size (US$ Mn) and Forecast, By Applications 8.8.1. Radio Frequency (RF) 8.8.2. Wearable Devices 8.8.3. Portable devices 8.8.4. Others 8.9. Drivers and Restraints: Impact Analysis 8.10. Market Attractiveness Analysis 8.10.1. By Country 8.10.2. By Type 8.10.3. By QFN Variant 8.10.4. By Application 8.11. Key Representative Market Participants - Market Presence (Intensity Map) 9. Asia Pacific Excluding Japan (APEJ) Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 9.1. Introduction 9.2. Regional Market Dynamics 9.2.1. Drivers 9.2.2. Restraints 9.3. Market Size (US$ Mn) By Country, 2012-2016 9.3.1. China 9.3.2. India 9.3.3. Australia and New Zealand 9.3.4. ASEAN 9.3.5. Rest of APEJ 9.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027 9.4.1. China 9.4.2. India 9.4.3. Australia and New Zealand 9.4.4. ASEAN 9.4.5. Rest of APEJ 9.5. Market Value Share & BPS Analysis, By Country 9.6. Market Size (US$ Mn) and Forecast, By Type 9.6.1. Air-cavity QFNs 9.6.2. Plastic-moulded QFNs 9.7. Market Size (US$ Mn) and Forecast, By QFN Variants 9.7.1. Very thin quad flat no-lead (VQFN) 9.7.2. Ultrathin quad flat no-lead (UQFN) 9.7.3. Quad flat no-lead (QFN) 9.7.4. Others 9.8. Market Size (US$ Mn) and Forecast, By Applications 9.8.1. Radio Frequency (RF) 9.8.2. Wearable Devices 9.8.3. Portable devices 9.8.4. Others 9.9. Drivers and Restraints: Impact Analysis 9.10. Market Attractiveness Analysis 9.10.1. By Country 9.10.2. By Type 9.10.3. By QFN Variant 9.10.4. By Application 9.11. Key Representative Market Participants - Market Presence (Intensity Map) 10. Japan Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 10.1. Introduction 10.2. Regional Market Dynamics 10.2.1. Drivers 10.2.2. Restraints 10.3. Market Size (US$ Mn) and Forecast, By Type 10.3.1. Air-cavity QFNs 10.3.2. Plastic-moulded QFNs 10.4. Market Size (US$ Mn) and Forecast, By QFN Variants 10.4.1. Very thin quad flat no-lead (VQFN) 10.4.2. Ultrathin quad flat no-lead (UQFN) 10.4.3. Quad flat no-lead (QFN) 10.4.4. Others 10.5. Market Size (US$ Mn) and Forecast, By Applications 10.5.1. Radio Frequency (RF) 10.5.2. Wearable Devices 10.5.3. Portable devices 10.5.4. Others 10.6. Drivers and Restraints: Impact Analysis 10.7. Market Attractiveness Analysis 10.7.1. By Type 10.7.2. By QFN Variant 10.7.3. By Application 10.8. Key Representative Market Participants - Market Presence (Intensity Map) 11. Middle East and Africa Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 11.1. Introduction 11.2. Regional Market Dynamics 11.2.1. Drivers 11.2.2. Restraints 11.3. Market Size (US$ Mn) By Country, 2012-2016 11.3.1. GCC Countries 11.3.2. Turkey 11.3.3. Northern Africa 11.3.4. South Africa 11.3.5. Rest of MEA 11.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027 11.4.1. GCC Countries 11.4.2. Turkey 11.4.3. Northern Africa 11.4.4. South Africa 11.4.5. Rest of MEA 11.5. Market Value Share & BPS Analysis, By Country 11.6. Market Size (US$ Mn) and Forecast, By Type 11.6.1. Air-cavity QFNs 11.6.2. Plastic-moulded QFNs 11.7. Market Size (US$ Mn) and Forecast, By QFN Variants 11.7.1. Very thin quad flat no-lead (VQFN) 11.7.2. Ultrathin quad flat no-lead (UQFN) 11.7.3. Quad flat no-lead (QFN) 11.7.4. Others 11.8. Market Size (US$ Mn) and Forecast, By Applications 11.8.1. Radio Frequency (RF) 11.8.2. Wearable Devices 11.8.3. Portable devices 11.8.4. Others 11.9. Drivers and Restraints: Impact Analysis 11.10. Market Attractiveness Analysis 11.10.1. By Country 11.10.2. By Type 11.10.3. By QFN Variant 11.10.4. By Application 11.11. Key Representative Market Participants - Market Presence (Intensity Map) 12. Forecast Factors: Relevance and Impact 13. Competition Landscape 13.1. Market Structure 13.2. Competition Intensity Mapping, By Market Taxonomy 13.3. Competition Dashboard 13.4. Company Profiles (Details – Overview, Financials, Strategy, Recent Developments) 13.4.1. Prominent Players 13.4.1.1. Amkor Technology 13.4.1.2. Texas Instruments 13.4.1.3. STATS ChipPAC Pte. Ltd 13.4.1.4. Microchip Technology Inc. 13.4.1.5. ASE Group 13.4.1.6. NXP Semiconductor 13.4.1.7. Fujitsu Ltd. 13.4.1.8. Toshiba Corporation 13.4.1.9. UTAC Group 13.4.1.10. Linear Technology Corporation 13.4.2. Other Players 13.4.2.1. Henkel AG & Co. 13.4.2.2. Broadcom Limited 14. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027 14.1. Introduction 14.2. Market Size (US$ Mn) and Forecast, By Region 14.2.1. North America 14.2.2. Western Europe 14.2.3. Eastern Europe 14.2.4. Latin America 14.2.5. Asia Pacific Excluding Japan 14.2.6. Japan 14.2.7. Middle East and Africa 14.3. Market Value Share & BPS Analysis, By, Region 14.4. Market Attractiveness Analysis, By Region 15. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027, By Type 15.1. Introduction 15.2. Market Size (US$ Mn) and Forecast, By Type 15.2.1. Air-cavity QFNs 15.2.2. Plastic-moulded QFNs 15.3. Market Value Share & BPS Analysis, By, Type 15.4. Market Attractiveness Analysis, By Type 16. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027, By QFN Variants 16.1. Introduction 16.2. Market Size (US$ Mn) and Forecast, By QFN Variants 16.2.1. Very thin quad flat no-lead (VQFN) 16.2.2. Ultrathin quad flat no-lead (UQFN) 16.2.3. Quad flat no-lead (QFN) 16.2.4. Others 16.3. Market Value Share & BPS Analysis, By, QFN Variants 16.4. Market Attractiveness Analysis, By QFN Variants 17. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027, By Application 17.1. Introduction 17.2. Market Size (US$ Mn) and Forecast, By Application 17.2.1. Radio Frequency (RF) 17.2.2. Wearable Devices 17.2.3. Portable devices 17.2.4. Others 17.3. Market Value Share & BPS Analysis, By, Application 17.4. Market Attractiveness Analysis, By Application 18. Assumptions & Acronyms Used 19. Research Methodology
Explore Technology Insights
View Reports