The global quad-flat-no-lead packaging market is valued at around USD 62 billion, and is expected to reach a valuation of more than USD 235 billion by the end of the projection year. During the forecast period (2017 to 2027), the global quad-flat-no-lead packaging market is expected to grow at a high CAGR of 13.1%.
| Attribute | Details |
|---|---|
| Estimated market value of quad-flat-no-lead packaging in 2017 | USD 62 Billion |
| Projected market value of quad-flat-no-lead packaging by 2026 | USD 235 Billion |
| CAGR during 2017 to 2026 | 13.1%. |
The quad-flat-no-lead segment has a valuation of approximately USD 30 billion and is expected to reach a value of more than USD 95 billion by the end of 2027.
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In the years to follow, it is anticipated that the consumer electronics and automotive sectors would witness high growth. This substantial growth is attributed towards increased adoption of advanced technologies such as wearable devices and electronic automobile accessories.
Wearable devices such as personal medical monitoring devices, wristwatch and others are small electronic devices that re widely being used among customers thus triggering the demand for packages as compact as UQFN or QFN.
Additionally, almost every car manufacturer provides accessories such as keyless locks and unlock systems for car doors. Such devices boost the demand for QFN package. Thus vendors have tremendous opportunities to offer their offerings in these sectors and invest in their product innovation with a view to create more compact and enhanced global quad-flat-no-lead packages.
Quad-flat-no-lead segment in the QFN variant category of the global market is anticipated to account for a high market share in the coming years. In the previous years, this segment contributed largely to the growth of the global market by reflecting high market valuation.
It is expected from this segment to retain its status quo in the coming years. In 2017, this segment reflected a valuation a bit under USD 30 Billion and is estimated to touch a value of more than USD 95 Billion by the end of the year of assessment (2027). This segment is projected to grow at a CAGR of 12.4% during the period of forecast.
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Very thin quad-flat-no-lead segment in the QFN variant category is projected to grow at a high rate and is expected to be the second fastest growing segment. It is expected to register a CAGR of 13.5% throughout the period of assessment. In 2017, this segment was estimated a value a bit over USD 17 Billion and with this significant growth rate, it is anticipated to reach a valuation of around USD 63 Billion by the end of the year of forecast.
The very thin quad-flat-no-lead segment is likely to follow the quad- flat-no-leads segment in terms of market value and thus is expected to be the second largest segment in the global quad-flat-no-lead packaging market.
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The global quad-flat-no-lead packaging market is valued at around USD 62 billion, and it is expected to reach a valuation of more than USD 235 billion by the end of 2027.
Amkor Technology, Texas Instruments, ASE Group and UTAC Group are some leading quad-flat-no-lead packaging providers
1. Executive Summary 2. Market Introduction 3. Market View Point 4. Global Market Analysis 2012 to 2016 and Forecast 2017 to 2027 5. North America Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 6. Western Europe Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 7. Eastern Europe Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 8. Latin America Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 9. Asia Pacific Excluding Japan (APEJ) Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 10. Japan Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 11. Middle East and Africa Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 12. Forecast Factors: Relevance and Impact 13. Competition Landscape 13.1. Prominent Players 13.1.1. Amkor Technology 13.1.2. Texas Instruments 13.1.3. STATS ChipPAC Pte. Ltd 13.1.4. Microchip Technology Inc. 13.1.5. ASE Group 13.1.6. NXP Semiconductor 13.1.7. Fujitsu Ltd. 13.1.8. Toshiba Corporation 13.1.9. UTAC Group 13.1.10. Linear Technology Corporation 13.2. Other Players 13.2.1. Henkel AG & Co. 13.2.2. Broadcom Limited 14. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027 15. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027, By Type 15.1. Air-cavity QFNs 15.2. Plastic-moulded QFNs 16. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027, By QFN Variants 16.1. Very thin quad flat no-lead (VQFN) 16.2. Ultrathin quad flat no-lead (UQFN) 16.3. Quad flat no-lead (QFN) 16.4. Others 17. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027, By Application 17.1. Radio Frequency (RF) 17.2. Wearable Devices 17.3. Portable devices 17.4. Others 18. Assumptions & Acronyms Used 19. Research Methodology
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Quad-Flat-No-Lead Packaging Market
