The global quad-flat-no-lead packaging market is valued at around US$ 62 billion, and is expected to reach a valuation of more than US$ 235 billion by the end of the projection year. During the forecast period (2017 to 2027), the global quad-flat-no-lead packaging market is expected to grow at a high CAGR of 13.1%.
| Attribute | Details |
|---|---|
| Estimated market value of quad-flat-no-lead packaging in 2017 | US$ 62 Billion |
| Projected market value of quad-flat-no-lead packaging by 2026 | US$ 235 Billion |
| CAGR during 2017 to 2026 | 13.1%. |
The quad-flat-no-lead segment has a valuation of approximately US$ 30 billion and is expected to reach a value of more than US$ 95 billion by the end of 2027.
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In the years to follow, it is anticipated that the consumer electronics and automotive sectors would witness high growth. This substantial growth is attributed towards increased adoption of advanced technologies such as wearable devices and electronic automobile accessories.
Wearable devices such as personal medical monitoring devices, wristwatch and others are small electronic devices that re widely being used among customers thus triggering the demand for packages as compact as UQFN or QFN.
Additionally, almost every car manufacturer provides accessories such as keyless locks and unlock systems for car doors. Such devices boost the demand for QFN package. Thus vendors have tremendous opportunities to offer their offerings in these sectors and invest in their product innovation with a view to create more compact and enhanced global quad-flat-no-lead packages.
Quad-flat-no-lead segment in the QFN variant category of the global market is anticipated to account for a high market share in the coming years. In the previous years, this segment contributed largely to the growth of the global market by reflecting high market valuation.
It is expected from this segment to retain its status quo in the coming years. In 2017, this segment reflected a valuation a bit under US$ 30 Bn and is estimated to touch a value of more than US$ 95 Bn by the end of the year of assessment (2027). This segment is projected to grow at a CAGR of 12.4% during the period of forecast.
Principal Consultant
Very thin quad-flat-no-lead segment in the QFN variant category is projected to grow at a high rate and is expected to be the second fastest growing segment. It is expected to register a CAGR of 13.5% throughout the period of assessment. In 2017, this segment was estimated a value a bit over US$ 17 Bn and with this significant growth rate, it is anticipated to reach a valuation of around US$ 63 Bn by the end of the year of forecast.
The very thin quad-flat-no-lead segment is likely to follow the quad- flat-no-leads segment in terms of market value and thus is expected to be the second largest segment in the global quad-flat-no-lead packaging market.
By Type:
By QFN Variants:
By Applications:
By Region:
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The global quad-flat-no-lead packaging market is valued at around US$ 62 billion, and it is expected to reach a valuation of more than US$ 235 billion by the end of 2027.
Amkor Technology, Texas Instruments, ASE Group and UTAC Group are some leading quad-flat-no-lead packaging providers
1. Executive Summary
1.1. Market Overview
1.2. Market Analysis
1.3. FMI Recommendations
2. Market Introduction
2.1. Market Taxonomy
2.2. Market Definition
2.3. Quad Flat No-Leads Packaging – Solution Overview
3. Market View Point
3.1. Macro-Economic Factors
3.2. Opportunity Analysis
3.3. Patents Overview
4. Global Market Analysis 2012–2016 and Forecast 2017–2027
4.1. Market Size and Y-o-Y Growth
4.2. Absolute $ Opportunity
4.3. Value Chain
4.4. Key Regulations
4.5. Global Trends
5. North America Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
5.1. Introduction
5.2. Regional Market Dynamics
5.2.1. Drivers
5.2.2. Restraints
5.3. Market Size (US$ Mn) By Country, 2012-2016
5.3.1. U.S.
5.3.2. Canada
5.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027
5.4.1. U.S.
5.4.2. Canada
5.5. Market Value Share & BPS Analysis, By Country
5.6. Market Size (US$ Mn) and Forecast, By Type
5.6.1. Air-cavity QFNs
5.6.2. Plastic-moulded QFNs
5.7. Market Size (US$ Mn) and Forecast, By QFN Variants
5.7.1. Very thin quad flat no-lead (VQFN)
5.7.2. Ultrathin quad flat no-lead (UQFN)
5.7.3. Quad flat no-lead (QFN)
5.7.4. Others
5.8. Market Size (US$ Mn) and Forecast, By Applications
5.8.1. Radio Frequency (RF)
5.8.2. Wearable Devices
5.8.3. Portable devices
5.8.4. Others
5.9. Drivers and Restraints: Impact Analysis
5.10. Market Attractiveness Analysis
5.10.1. By Country
5.10.2. By Type
5.10.3. By QFN Variant
5.10.4. By Application
5.11. Key Representative Market Participants - Market Presence (Intensity Map)
6. Western Europe Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
6.1. Introduction
6.2. Regional Market Dynamics
6.2.1. Drivers
6.2.2. Restraints
6.3. Market Size (US$ Mn) By Country, 2012-2016
6.3.1. Germany
6.3.2. France
6.3.3. U.K.
6.3.4. Spain
6.3.5. Italy
6.3.6. BENELUX
6.3.7. Nordic
6.3.8. Rest of Western Europe
6.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027
6.4.1. Germany
6.4.2. France
6.4.3. U.K.
6.4.4. Spain
6.4.5. Italy
6.4.6. BENELUX
6.4.7. Nordic
6.4.8. Rest of Western Europe
6.5. Market Value Share & BPS Analysis, By Country
6.6. Market Size (US$ Mn) and Forecast, By Type
6.6.1. Air-cavity QFNs
6.6.2. Plastic-moulded QFNs
6.7. Market Size (US$ Mn) and Forecast, By QFN Variants
6.7.1. Very thin quad flat no-lead (VQFN)
6.7.2. Ultrathin quad flat no-lead (UQFN)
6.7.3. Quad flat no-lead (QFN)
6.7.4. Others
6.8. Market Size (US$ Mn) and Forecast, By Applications
6.8.1. Radio Frequency (RF)
6.8.2. Wearable Devices
6.8.3. Portable devices
6.8.4. Others
6.9. Drivers and Restraints: Impact Analysis
6.10. Market Attractiveness Analysis
6.10.1. By Country
6.10.2. By Type
6.10.3. By QFN Variant
6.10.4. By Application
6.11. Key Representative Market Participants - Market Presence (Intensity Map)
7. Eastern Europe Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
7.1. Introduction
7.2. Regional Market Dynamics
7.2.1. Drivers
7.2.2. Restraints
7.3. Market Size (US$ Mn) By Country, 2012-2016
7.3.1. Russia
7.3.2. Poland
7.3.3. Rest of Eastern Europe
7.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027
7.4.1. Russia
7.4.2. Poland
7.4.3. Rest of Eastern Europe
7.5. Market Value Share & BPS Analysis, By Country
7.6. Market Size (US$ Mn) and Forecast, By Type
7.6.1. Air-cavity QFNs
7.6.2. Plastic-moulded QFNs
7.7. Market Size (US$ Mn) and Forecast, By QFN Variants
7.7.1. Very thin quad flat no-lead (VQFN)
7.7.2. Ultrathin quad flat no-lead (UQFN)
7.7.3. Quad flat no-lead (QFN)
7.7.4. Others
7.8. Market Size (US$ Mn) and Forecast, By Applications
7.8.1. Radio Frequency (RF)
7.8.2. Wearable Devices
7.8.3. Portable devices
7.8.4. Others
7.9. Drivers and Restraints: Impact Analysis
7.10. Market Attractiveness Analysis
7.10.1. By Country
7.10.2. By Type
7.10.3. By QFN Variant
7.10.4. By Application
7.11. Key Representative Market Participants - Market Presence (Intensity Map)
8. Latin America Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
8.1. Introduction
8.2. Regional Market Dynamics
8.2.1. Drivers
8.2.2. Restraints
8.3. Market Size (US$ Mn) By Country, 2012-2016
8.3.1. Brazil
8.3.2. Mexico
8.3.3. Rest of Latin America
8.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027
8.4.1. Brazil
8.4.2. Mexico
8.4.3. Rest of Latin America
8.5. Market Value Share & BPS Analysis, By Country
8.6. Market Size (US$ Mn) and Forecast, By Type
8.6.1. Air-cavity QFNs
8.6.2. Plastic-moulded QFNs
8.7. Market Size (US$ Mn) and Forecast, By QFN Variants
8.7.1. Very thin quad flat no-lead (VQFN)
8.7.2. Ultrathin quad flat no-lead (UQFN)
8.7.3. Quad flat no-lead (QFN)
8.7.4. Others
8.8. Market Size (US$ Mn) and Forecast, By Applications
8.8.1. Radio Frequency (RF)
8.8.2. Wearable Devices
8.8.3. Portable devices
8.8.4. Others
8.9. Drivers and Restraints: Impact Analysis
8.10. Market Attractiveness Analysis
8.10.1. By Country
8.10.2. By Type
8.10.3. By QFN Variant
8.10.4. By Application
8.11. Key Representative Market Participants - Market Presence (Intensity Map)
9. Asia Pacific Excluding Japan (APEJ) Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
9.1. Introduction
9.2. Regional Market Dynamics
9.2.1. Drivers
9.2.2. Restraints
9.3. Market Size (US$ Mn) By Country, 2012-2016
9.3.1. China
9.3.2. India
9.3.3. Australia and New Zealand
9.3.4. ASEAN
9.3.5. Rest of APEJ
9.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027
9.4.1. China
9.4.2. India
9.4.3. Australia and New Zealand
9.4.4. ASEAN
9.4.5. Rest of APEJ
9.5. Market Value Share & BPS Analysis, By Country
9.6. Market Size (US$ Mn) and Forecast, By Type
9.6.1. Air-cavity QFNs
9.6.2. Plastic-moulded QFNs
9.7. Market Size (US$ Mn) and Forecast, By QFN Variants
9.7.1. Very thin quad flat no-lead (VQFN)
9.7.2. Ultrathin quad flat no-lead (UQFN)
9.7.3. Quad flat no-lead (QFN)
9.7.4. Others
9.8. Market Size (US$ Mn) and Forecast, By Applications
9.8.1. Radio Frequency (RF)
9.8.2. Wearable Devices
9.8.3. Portable devices
9.8.4. Others
9.9. Drivers and Restraints: Impact Analysis
9.10. Market Attractiveness Analysis
9.10.1. By Country
9.10.2. By Type
9.10.3. By QFN Variant
9.10.4. By Application
9.11. Key Representative Market Participants - Market Presence (Intensity Map)
10. Japan Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
10.1. Introduction
10.2. Regional Market Dynamics
10.2.1. Drivers
10.2.2. Restraints
10.3. Market Size (US$ Mn) and Forecast, By Type
10.3.1. Air-cavity QFNs
10.3.2. Plastic-moulded QFNs
10.4. Market Size (US$ Mn) and Forecast, By QFN Variants
10.4.1. Very thin quad flat no-lead (VQFN)
10.4.2. Ultrathin quad flat no-lead (UQFN)
10.4.3. Quad flat no-lead (QFN)
10.4.4. Others
10.5. Market Size (US$ Mn) and Forecast, By Applications
10.5.1. Radio Frequency (RF)
10.5.2. Wearable Devices
10.5.3. Portable devices
10.5.4. Others
10.6. Drivers and Restraints: Impact Analysis
10.7. Market Attractiveness Analysis
10.7.1. By Type
10.7.2. By QFN Variant
10.7.3. By Application
10.8. Key Representative Market Participants - Market Presence (Intensity Map)
11. Middle East and Africa Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
11.1. Introduction
11.2. Regional Market Dynamics
11.2.1. Drivers
11.2.2. Restraints
11.3. Market Size (US$ Mn) By Country, 2012-2016
11.3.1. GCC Countries
11.3.2. Turkey
11.3.3. Northern Africa
11.3.4. South Africa
11.3.5. Rest of MEA
11.4. Market Size (US$ Mn) and Forecast, By Country, 2017-2027
11.4.1. GCC Countries
11.4.2. Turkey
11.4.3. Northern Africa
11.4.4. South Africa
11.4.5. Rest of MEA
11.5. Market Value Share & BPS Analysis, By Country
11.6. Market Size (US$ Mn) and Forecast, By Type
11.6.1. Air-cavity QFNs
11.6.2. Plastic-moulded QFNs
11.7. Market Size (US$ Mn) and Forecast, By QFN Variants
11.7.1. Very thin quad flat no-lead (VQFN)
11.7.2. Ultrathin quad flat no-lead (UQFN)
11.7.3. Quad flat no-lead (QFN)
11.7.4. Others
11.8. Market Size (US$ Mn) and Forecast, By Applications
11.8.1. Radio Frequency (RF)
11.8.2. Wearable Devices
11.8.3. Portable devices
11.8.4. Others
11.9. Drivers and Restraints: Impact Analysis
11.10. Market Attractiveness Analysis
11.10.1. By Country
11.10.2. By Type
11.10.3. By QFN Variant
11.10.4. By Application
11.11. Key Representative Market Participants - Market Presence (Intensity Map)
12. Forecast Factors: Relevance and Impact
13. Competition Landscape
13.1. Market Structure
13.2. Competition Intensity Mapping, By Market Taxonomy
13.3. Competition Dashboard
13.4. Company Profiles (Details – Overview, Financials, Strategy, Recent Developments)
13.4.1. Prominent Players
13.4.1.1. Amkor Technology
13.4.1.2. Texas Instruments
13.4.1.3. STATS ChipPAC Pte. Ltd
13.4.1.4. Microchip Technology Inc.
13.4.1.5. ASE Group
13.4.1.6. NXP Semiconductor
13.4.1.7. Fujitsu Ltd.
13.4.1.8. Toshiba Corporation
13.4.1.9. UTAC Group
13.4.1.10. Linear Technology Corporation
13.4.2. Other Players
13.4.2.1. Henkel AG & Co.
13.4.2.2. Broadcom Limited
14. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027
14.1. Introduction
14.2. Market Size (US$ Mn) and Forecast, By Region
14.2.1. North America
14.2.2. Western Europe
14.2.3. Eastern Europe
14.2.4. Latin America
14.2.5. Asia Pacific Excluding Japan
14.2.6. Japan
14.2.7. Middle East and Africa
14.3. Market Value Share & BPS Analysis, By, Region
14.4. Market Attractiveness Analysis, By Region
15. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027, By Type
15.1. Introduction
15.2. Market Size (US$ Mn) and Forecast, By Type
15.2.1. Air-cavity QFNs
15.2.2. Plastic-moulded QFNs
15.3. Market Value Share & BPS Analysis, By, Type
15.4. Market Attractiveness Analysis, By Type
16. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027, By QFN Variants
16.1. Introduction
16.2. Market Size (US$ Mn) and Forecast, By QFN Variants
16.2.1. Very thin quad flat no-lead (VQFN)
16.2.2. Ultrathin quad flat no-lead (UQFN)
16.2.3. Quad flat no-lead (QFN)
16.2.4. Others
16.3. Market Value Share & BPS Analysis, By, QFN Variants
16.4. Market Attractiveness Analysis, By QFN Variants
17. Global Quad Flat No-Leads Packaging Market Analysis 2012–2016 and Forecast 2017–2027, By Application
17.1. Introduction
17.2. Market Size (US$ Mn) and Forecast, By Application
17.2.1. Radio Frequency (RF)
17.2.2. Wearable Devices
17.2.3. Portable devices
17.2.4. Others
17.3. Market Value Share & BPS Analysis, By, Application
17.4. Market Attractiveness Analysis, By Application
18. Assumptions & Acronyms Used
19. Research Methodology
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