Quad-Flat-No-Lead Packaging Market Overview

The global quad-flat-no-lead packaging market is valued at around USD 62 billion, and is expected to reach a valuation of more than USD 235 billion by the end of the projection year. During the forecast period (2017 to 2027), the global quad-flat-no-lead packaging market is expected to grow at a high CAGR of 13.1%.

Attribute Details
Estimated market value of quad-flat-no-lead packaging in 2017 USD 62 Billion
Projected market value of quad-flat-no-lead packaging by 2027 USD 235 Billion
CAGR during 2017 to 2027 13.1%.

The quad-flat-no-lead segment has a valuation of approximately USD 30 billion and is expected to reach a value of more than USD 95 billion by the end of 2027.

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Rising demand for QFN package in compact devices expected to be a lucrative growth opportunity in the coming years

In the years to follow, it is anticipated that the consumer electronics and automotive sectors would witness high growth. This substantial growth is attributed towards increased adoption of advanced technologies such as wearable devices and electronic automobile accessories.

Wearable devices such as personal medical monitoring devices, wristwatch and others are small electronic devices that re widely being used among customers thus triggering the demand for packages as compact as UQFN or QFN.

Additionally, almost every car manufacturer provides accessories such as keyless locks and unlock systems for car doors. Such devices boost the demand for QFN package. Thus vendors have tremendous opportunities to offer their offerings in these sectors and invest in their product innovation with a view to create more compact and enhanced global quad-flat-no-lead packages.

Quad-Flat-No-Lead package to account for high market share in the global market

Quad-flat-no-lead segment in the QFN variant category of the global market is anticipated to account for a high market share in the coming years. In the previous years, this segment contributed largely to the growth of the global market by reflecting high market valuation.

It is expected from this segment to retain its status quo in the coming years. In 2017, this segment reflected a valuation a bit under USD 30 Billion and is estimated to touch a value of more than USD 95 Billion by the end of the year of assessment (2027). This segment is projected to grow at a CAGR of 12.4% during the period of forecast.

VQFN (Very Thin Quad-Flat-No-Lead) segment to grow significantly in the years to follow

Very thin quad-flat-no-lead segment in the QFN variant category is projected to grow at a high rate and is expected to be the second fastest growing segment. It is expected to register a CAGR of 13.5% throughout the period of assessment. In 2017, this segment was estimated a value a bit over USD 17 Billion and with this significant growth rate, it is anticipated to reach a valuation of around USD 63 Billion by the end of the year of forecast.

The very thin quad-flat-no-lead segment is likely to follow the quad- flat-no-leads segment in terms of market value and thus is expected to be the second largest segment in the global quad-flat-no-lead packaging market.

Frequently Asked Questions

What is the outlook of global quad-flat-no-lead packaging market?

The global quad-flat-no-lead packaging market is valued at around USD 62 billion, and it is expected to reach a valuation of more than USD 235 billion by the end of 2027.

Which prominent players are active in the global quad-flat-no-lead packaging industry?

Amkor Technology, Texas Instruments, ASE Group and UTAC Group are some leading quad-flat-no-lead packaging providers

Table of Content
  • 1. Executive Summary
  • 2. Market Introduction
  • 3. Market View Point
  • 4. Global Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 5. North America Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 6. Western Europe Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 7. Eastern Europe Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 8. Latin America Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 9. Asia Pacific Excluding Japan (APEJ) Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 10. Japan Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 11. Middle East and Africa Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 12. Forecast Factors: Relevance and Impact
  • 13. Competition Landscape
    • 13.1. Prominent Players
      • 13.1.1. Amkor Technology
      • 13.1.2. Texas Instruments
      • 13.1.3. STATS ChipPAC Pte. Ltd
      • 13.1.4. Microchip Technology Inc.
      • 13.1.5. ASE Group
      • 13.1.6. NXP Semiconductor
      • 13.1.7. Fujitsu Ltd.
      • 13.1.8. Toshiba Corporation
      • 13.1.9. UTAC Group
      • 13.1.10. Linear Technology Corporation
    • 13.2. Other Players
      • 13.2.1. Henkel AG & Co.
      • 13.2.2. Broadcom Limited
  • 14. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027
  • 15. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027, By Type
    • 15.1. Air-cavity QFNs
    • 15.2. Plastic-moulded QFNs
  • 16. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027, By QFN Variants
    • 16.1. Very thin quad flat no-lead (VQFN)
    • 16.2. Ultrathin quad flat no-lead (UQFN)
    • 16.3. Quad flat no-lead (QFN)
    • 16.4. Others
  • 17. Global Quad Flat No-Leads Packaging Market Analysis 2012 to 2016 and Forecast 2017 to 2027, By Application
    • 17.1. Radio Frequency (RF)
    • 17.2. Wearable Devices
    • 17.3. Portable devices
    • 17.4. Others
  • 18. Assumptions & Acronyms Used
  • 19. Research Methodology

Market Segmentation

By Type:

  • Air-Cavity QFNs
  • Plastic-moulded QFNs

By QFN Variants:

  • Very thin quad flat no-lead (VQFN)
  • Ultrathin quad flat no-lead (UQFN)
  • Quad flat no-lead (QFN)
  • Others

By Applications:

  • Radio Frequency Devices
  • Wearable Devices
  • Portable Devices
  • Others

By Region:

  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • APEJ
  • Japan
  • MEA

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