The global printed circuit boards market is anticipated at US$ 60.2 billion in 2022. Demand is likely to remain high for printed circuit boards (PCBs) during the assessment period. this is due to the rapid technological advancement and rapidly growing consumer electronics garnering US$ 104.8 billion in 2033, recording a CAGR of 5.1% from 2023 to 2033. The market is likely to secure US$63.5 billion in 2023.
| Data Points | Kay Statistics |
|---|---|
| Printed Circuit Boards (PCBs) Market Size Value in 2023 | US$ 63.5 billion |
| Printed Circuit Boards (PCBs) Market Forecast Value in 2033 | US$ 104.8 billion |
| Global Growth Rate | 5.1% |
| Forecast Period | 2023 to 2033 |
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| Historical CAGR (2018 to 2022) | 6.5% |
|---|---|
| Forecasted CAGR (2023 to 2033) | 5.1% |
The increasing technological advances in the consumer electronics sector, including smartphones, tablets, gaming consoles, and smart home devices, remain a major driving force behind the printed circuit boards(PCBs) market. The increasing demand for compact and high-performance PCBs also contributes to market growth.
The global shift toward renewable energy sources, such as solar and wind power, creates a demand for PCBs in energy generation and conversion systems. PCBs are used in solar inverters, wind turbine control systems, and energy storage systems, contributing to the growth of the PCB market. The printed circuit boards (PCBs) market is projected to show a noteworthy growth of US$ 104.8billion by the end of the forecast period of 2033
Principal Consultant
Rapidly Growing Consumer Electronics Industry to Drive the Growth of the Printed Circuit Boards Market
Increasing use of smartphones, tablets, laptops, gaming consoles, televisions, and smart home devices is expected to drive printed circuit board markets as these products rely heavily on PCBs for their functionality. These devices require PCBs to provide interconnections between electronic components, power distribution, and signal routing.
The growth of consumer electronics extends beyond traditional devices. Increased addition of new product categories such as wearable devices, Internet of Things (IoT) devices, virtual reality (VR) and augmented reality (AR) devices, and smart home devices have gained significant popularity.
These emerging product categories require specialized PCBs to enable their unique functionalities, creating additional opportunities for printed circuit board (PCB) manufacturers. Thus as consumer electronics grows the demand for printed circuit boards is expected to grow in the near future.
The Increasing Technological Innovations Drive the Printed Circuit Boards (PCBs) Market
Technological innovation in the PCB market not only drives the development of new applications but also supports existing industries' evolving needs. More capable printed circuit boards(PCBs) increases as electronic devices become more advanced and the demand for smaller.
The development of advanced materials has a significant impact on PCB performance. Innovations in substrate materials, laminates, and conductive materials enhance signal integrity, thermal management, and reliability.
The manufacturers and technology providers in printed circuit boards invest in research and development (R&D) activities to stay at the forefront of innovation, driving market growth and shaping the future of the printed circuit boards (PCB) industry.
Growing technological advancements in printed circuit board technology enable improved performance, miniaturization, enhanced functionality, and cost-efficiency. This is expected to drive the demand for printed circuit boards in different industry verticals.
Increasing Spending in Aerospace to Boost the Growth of Printed Circuit Boards (PCBs). Market in the United States
North America is expected to dominate the global printed circuit board (PCBs) market during the forecast period. The market is anticipated to expand at a CAGR of 5.1% and is expected to accumulate a market value of US$ 18.7 billion over the forecast period.
North America is a significant market for consumer electronics, automotive electronics, industrial equipment, and aerospace and defense applications. The growing demand for these electronic devices and systems has a direct impact on the demand for printed circuit boards (PCBs).
The proliferation of smartphones, tablets, wearables, and IoT devices has further fuelled the demand for printed circuit boards (PCBs) in the region. The increasing defense spending and aerospace advancements in the region have boosted the demand for printed circuit boards (PCBs) in the region.
Growing Demand from the Automotive Industry in the Region to Boost the Growth of the Market in the United Kingdom
The printed circuit board (PCBs) sales in the United Kingdom are expected to keep rising with a CAGR of 5.0% and are expected to gain a market value of US$ 3.9 billion by the end of 2033.
Presence of well-established automotive industries in countries such as Germany, France, and Italy, Europe being a major automotive manufacturing hub. The increasing demand for PCBs for applications such as vehicle control systems, infotainment systems, and electric vehicle components is likely to drive market growth in the region.
Increased Technological Advances in Manufacturing to Drive the Growth of the Market in China
China’s printed circuit board (PCBs) market is expected to rise at 5.1% CAGR between 2023 to 2033. The market is expected to gain a market value of US$ 24 billion by the end of the forecast period. China accounts for the highest market share in the printed circuit board (PCBs) market.
The factor supporting the growth of the market in the region include the increasing use of electronic devices and the expansion of small home appliances in the region. Increasing government initiatives to promote advanced manufacturing and technological innovation further boost domestic demand for printed circuit boards (PCBs).
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Multi-Layer Segment to Remain Prominent During the Forecast Period
By type, the printed circuit boards (PCBs) market segment include multi-layer, double-sided, and single-sided. Among all these, the multi-layer segment is expected to dominate the market in the forecast period. The segment is projected to account for a CAGR of 4.9% during the forecast period.
Multilayer printed circuit boards (PCBs) are highly preferred in many applications due to several advantages they offer over single-sided or double-sided PCBs.
Multilayer PCBs provide a higher density of components and interconnections. With multiple layers, designers can effectively route complex and densely packed circuitry, allowing for more functionality in a smaller footprint. This is particularly beneficial for compact electronic devices such as smartphones, tablets, and wearables.
Standard Multilayer Segment Generates High Revenue
Based on the substrate type, the market is segmented into the Standard Multilayer, HighDensity Interconnect (HDI), IC Substrate, Regid 1-2 Sided, Rigid Flex, and others segments. Among all these standard multilayer segments remains the application category is expected to expand with a CAGR of 4.7% throughout the forecast period.
Multilayer PCBs constructed using FR-4 substrates consist of multiple layers of copper traces and insulating layers stacked together. The number of layers can vary based on the complexity of the circuit and design requirements. The insulating layers between copper traces are typically made of prepreg, which is a resin-coated fiberglass material.
Standard multilayer PCBs offer good electrical properties, including low dielectric constant and low loss tangent, which contribute to the high-frequency performance of the PCB. Multilayer printed circuit boards remain the highly preferred category.
New players in the printed circuit board (PCB) market are TTm Technology and among others are adopting various marketing strategies such as new product launches, geographical expansion, mergers and acquisitions, partnerships, and collaboration to identify the interest of potential buyers and create a larger customer base.
For instance:
Prominent players in the Printed Circuit Boards (PCBs) market are Amphenol Corporation; Amperex Technology Ltd.; Apex Microelectronics Company Limited; Autosplice, Inc.; Auter Elektronics Ltd. among others.
Printed circuit boards (PCBs) market players are working on research & development activities for the effective composition of the material that is to be used for manufacturing.
Key players are focusing on improved productivity and quality of their products in order to gain more customer base.
The market players are engaged in expansion strategies like extensive research & development activities, collaborations, and mergers & acquisitions. Some notable developments are as follows:
| Report Attribute | Details |
|---|---|
| Growth Rate | CAGR of 5.1% from 2023 to 2033 |
| Market Value in 2023 | US$ 63.5 billion |
| Market Value in 2033 | US$ 104.8 billion |
| Base Year for Estimation | 2022 |
| Historical Data | 2018 to 2022 |
| Forecast Period | 2023 to 2033 |
| Quantitative Units | Revenue in US$ Billion and CAGR from 2023 to 2033 |
| Report Coverage | Revenue Forecast, Company Ranking, Competitive Landscape, Growth Factors, Trends, and Pricing Analysis |
| Segments Covered |
|
| Regions Covered |
|
| Key Countries Profiled |
|
| Key Companies Profiled |
|
The market was valued at US$ 60.2 billion in 2022.
The increasing technological innovations drive sales.
Increasing miniaturization of electronic devices elevates the demand of the market.
Amphenol Corporation, Amperex Technology Ltd., and Autosplice, Inc. are the key players.
Increasing application in end-use industries offers opportunities to the market.
1. Executive Summary
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Background
3.1. Market Dynamics
3.1.1. Drivers
3.1.2. Restraints
3.1.3. Opportunity
3.1.4. Trends
3.2. Scenario Forecast
3.2.1. Demand in Optimistic Scenario
3.2.2. Demand in Likely Scenario
3.2.3. Demand in Conservative Scenario
3.3. Opportunity Map Analysis
3.4. Product Life Cycle Analysis
3.5. Supply Chain Analysis
3.5.1. Supply Side Participants and Their Roles
3.5.1.1. Producers
3.5.1.2. Mid-Level Participants (Traders/ Agents/ Brokers)
3.5.1.3. Wholesalers and Distributors
3.5.2. Value Added and Value Created at Node in the Supply Chain
3.5.3. List of Raw Material Suppliers
3.5.4. List of Existing and Potential Buyers
3.6. Investment Feasibility Matrix
3.7. Value Chain Analysis
3.7.1. Profit Margin Analysis
3.7.2. Wholesalers and Distributors
3.7.3. Retailers
3.8. PESTLE and Porter’s Analysis
3.9. Regulatory Landscape
3.9.1. By Key Regions
3.9.2. By Key Countries
3.10. Regional Parent Market Outlook
3.11. Production and Consumption Statistics
3.12. Import and Export Statistics
4. Global Market Analysis 2018 to 2022 and Forecast, 2023 to 2033
4.1. Historical Market Size Value (US$ Million) & Volume (Units) Analysis, 2018 to 2022
4.2. Current and Future Market Size Value (US$ Million) & Volume (Units) Projections, 2023 to 2033
4.2.1. Y-o-Y Growth Trend Analysis
4.2.2. Absolute $ Opportunity Analysis
5. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Type
5.1. Introduction / Key Findings
5.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By Type, 2018 to 2022
5.3. Current and Future Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By Type, 2023 to 2033
5.3.1. Multi-Layer
5.3.2. Double-Sided
5.3.3. Single-Sided
5.4. Y-o-Y Growth Trend Analysis By Type, 2018 to 2022
5.5. Absolute $ Opportunity Analysis By Type, 2023 to 2033
6. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Substrate Type
6.1. Introduction / Key Findings
6.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By Substrate Type, 2018 to 2022
6.3. Current and Future Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By Substrate Type, 2023 to 2033
6.3.1. Standard Multilayer
6.3.2. High-Density Interconnect (HDI)
6.3.3. IC Substrate
6.3.4. Rigid 1-2 Sided
6.3.5. Rigid-Flex
6.3.6. Others
6.4. Y-o-Y Growth Trend Analysis By Substrate Type, 2018 to 2022
6.5. Absolute $ Opportunity Analysis By Substrate Type, 2023 to 2033
7. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By End-Use
7.1. Introduction / Key Findings
7.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By End-Use, 2018 to 2022
7.3. Current and Future Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By End-Use, 2023 to 2033
7.3.1. Computer & Peripherals,
7.3.2. Communications
7.3.3. Consumer Electronics
7.3.4. Industrial Electronics
7.3.5. Automotive
7.3.6. Aerospace & Defense
7.3.7. Others
7.4. Y-o-Y Growth Trend Analysis By End-Use, 2018 to 2022
7.5. Absolute $ Opportunity Analysis By End-Use, 2023 to 2033
8. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Region
8.1. Introduction
8.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By Region, 2018 to 2022
8.3. Current Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By Region, 2023 to 2033
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. MEA
8.4. Market Attractiveness Analysis By Region
9. North America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
9.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2018 to 2022
9.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2023 to 2033
9.2.1. By Country
9.2.1.1. USA
9.2.1.2. Canada
9.2.2. By Type
9.2.3. By Substrate Type
9.2.4. By End-Use
9.3. Market Attractiveness Analysis
9.3.1. By Country
9.3.2. By Type
9.3.3. By Substrate Type
9.3.4. By End-Use
9.4. Key Takeaways
10. Latin America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
10.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2018 to 2022
10.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2023 to 2033
10.2.1. By Country
10.2.1.1. Brazil
10.2.1.2. Mexico
10.2.1.3. Rest of Latin America
10.2.2. By Type
10.2.3. By Substrate Type
10.2.4. By End-Use
10.3. Market Attractiveness Analysis
10.3.1. By Country
10.3.2. By Type
10.3.3. By Substrate Type
10.3.4. By End-Use
10.4. Key Takeaways
11. Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
11.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2018 to 2022
11.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2023 to 2033
11.2.1. By Country
11.2.1.1. Germany
11.2.1.2. UK
11.2.1.3. France
11.2.1.4. Spain
11.2.1.5. Italy
11.2.1.6. Rest of Europe
11.2.2. By Type
11.2.3. By Substrate Type
11.2.4. By End-Use
11.3. Market Attractiveness Analysis
11.3.1. By Country
11.3.2. By Type
11.3.3. By Substrate Type
11.3.4. By End-Use
11.4. Key Takeaways
12. Asia Pacific Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
12.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2018 to 2022
12.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2023 to 2033
12.2.1. By Country
12.2.1.1. China
12.2.1.2. Japan
12.2.1.3. South Korea
12.2.1.4. Singapore
12.2.1.5. Thailand
12.2.1.6. Indonesia
12.2.1.7. Australia
12.2.1.8. New Zealand
12.2.1.9. Rest of Asia Pacific
12.2.2. By Type
12.2.3. By Substrate Type
12.2.4. By End-Use
12.3. Market Attractiveness Analysis
12.3.1. By Country
12.3.2. By Type
12.3.3. By Substrate Type
12.3.4. By End-Use
12.4. Key Takeaways
13. MEA Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
13.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2018 to 2022
13.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2023 to 2033
13.2.1. By Country
13.2.1.1. GCC Countries
13.2.1.2. South Africa
13.2.1.3. Israel
13.2.1.4. Rest of MEA
13.2.2. By Type
13.2.3. By Substrate Type
13.2.4. By End-Use
13.3. Market Attractiveness Analysis
13.3.1. By Country
13.3.2. By Type
13.3.3. By Substrate Type
13.3.4. By End-Use
13.4. Key Takeaways
14. Key Countries Market Analysis
14.1. USA
14.1.1. Pricing Analysis
14.1.2. Market Share Analysis, 2022
14.1.2.1. By Type
14.1.2.2. By Substrate Type
14.1.2.3. By End-Use
14.2. Canada
14.2.1. Pricing Analysis
14.2.2. Market Share Analysis, 2022
14.2.2.1. By Type
14.2.2.2. By Substrate Type
14.2.2.3. By End-Use
14.3. Brazil
14.3.1. Pricing Analysis
14.3.2. Market Share Analysis, 2022
14.3.2.1. By Type
14.3.2.2. By Substrate Type
14.3.2.3. By End-Use
14.4. Mexico
14.4.1. Pricing Analysis
14.4.2. Market Share Analysis, 2022
14.4.2.1. By Type
14.4.2.2. By Substrate Type
14.4.2.3. By End-Use
14.5. Germany
14.5.1. Pricing Analysis
14.5.2. Market Share Analysis, 2022
14.5.2.1. By Type
14.5.2.2. By Substrate Type
14.5.2.3. By End-Use
14.6. UK
14.6.1. Pricing Analysis
14.6.2. Market Share Analysis, 2022
14.6.2.1. By Type
14.6.2.2. By Substrate Type
14.6.2.3. By End-Use
14.7. France
14.7.1. Pricing Analysis
14.7.2. Market Share Analysis, 2022
14.7.2.1. By Type
14.7.2.2. By Substrate Type
14.7.2.3. By End-Use
14.8. Spain
14.8.1. Pricing Analysis
14.8.2. Market Share Analysis, 2022
14.8.2.1. By Type
14.8.2.2. By Substrate Type
14.8.2.3. By End-Use
14.9. Italy
14.9.1. Pricing Analysis
14.9.2. Market Share Analysis, 2022
14.9.2.1. By Type
14.9.2.2. By Substrate Type
14.9.2.3. By End-Use
14.10. China
14.10.1. Pricing Analysis
14.10.2. Market Share Analysis, 2022
14.10.2.1. By Type
14.10.2.2. By Substrate Type
14.10.2.3. By End-Use
14.11. Japan
14.11.1. Pricing Analysis
14.11.2. Market Share Analysis, 2022
14.11.2.1. By Type
14.11.2.2. By Substrate Type
14.11.2.3. By End-Use
14.12. South Korea
14.12.1. Pricing Analysis
14.12.2. Market Share Analysis, 2022
14.12.2.1. By Type
14.12.2.2. By Substrate Type
14.12.2.3. By End-Use
14.13. Singapore
14.13.1. Pricing Analysis
14.13.2. Market Share Analysis, 2022
14.13.2.1. By Type
14.13.2.2. By Substrate Type
14.13.2.3. By End-Use
14.14. Thailand
14.14.1. Pricing Analysis
14.14.2. Market Share Analysis, 2022
14.14.2.1. By Type
14.14.2.2. By Substrate Type
14.14.2.3. By End-Use
14.15. Indonesia
14.15.1. Pricing Analysis
14.15.2. Market Share Analysis, 2022
14.15.2.1. By Type
14.15.2.2. By Substrate Type
14.15.2.3. By End-Use
14.16. Australia
14.16.1. Pricing Analysis
14.16.2. Market Share Analysis, 2022
14.16.2.1. By Type
14.16.2.2. By Substrate Type
14.16.2.3. By End-Use
14.17. New Zealand
14.17.1. Pricing Analysis
14.17.2. Market Share Analysis, 2022
14.17.2.1. By Type
14.17.2.2. By Substrate Type
14.17.2.3. By End-Use
14.18. GCC Countries
14.18.1. Pricing Analysis
14.18.2. Market Share Analysis, 2022
14.18.2.1. By Type
14.18.2.2. By Substrate Type
14.18.2.3. By End-Use
14.19. South Africa
14.19.1. Pricing Analysis
14.19.2. Market Share Analysis, 2022
14.19.2.1. By Type
14.19.2.2. By Substrate Type
14.19.2.3. By End-Use
14.20. Israel
14.20.1. Pricing Analysis
14.20.2. Market Share Analysis, 2022
14.20.2.1. By Type
14.20.2.2. By Substrate Type
14.20.2.3. By End-Use
15. Market Structure Analysis
15.1. Competition Dashboard
15.2. Competition Benchmarking
15.3. Market Share Analysis of Top Players
15.3.1. By Regional
15.3.2. By Type
15.3.3. By Substrate Type
15.3.4. By End-Use
16. Competition Analysis
16.1. Competition Deep Dive
16.1.1. Amphenol Corporation
16.1.1.1. Overview
16.1.1.2. Product Portfolio
16.1.1.3. Profitability by Market Segments
16.1.1.4. Sales Footprint
16.1.1.5. Strategy Overview
16.1.1.5.1. Marketing Strategy
16.1.1.5.2. Product Strategy
16.1.1.5.3. Channel Strategy
16.1.2. Amperex Technology Ltd.
16.1.2.1. Overview
16.1.2.2. Product Portfolio
16.1.2.3. Profitability by Market Segments
16.1.2.4. Sales Footprint
16.1.2.5. Strategy Overview
16.1.2.5.1. Marketing Strategy
16.1.2.5.2. Product Strategy
16.1.2.5.3. Channel Strategy
16.1.3. Apex Microelectronics Company Limited
16.1.3.1. Overview
16.1.3.2. Product Portfolio
16.1.3.3. Profitability by Market Segments
16.1.3.4. Sales Footprint
16.1.3.5. Strategy Overview
16.1.3.5.1. Marketing Strategy
16.1.3.5.2. Product Strategy
16.1.3.5.3. Channel Strategy
16.1.4. Autosplice, Inc.
16.1.4.1. Overview
16.1.4.2. Product Portfolio
16.1.4.3. Profitability by Market Segments
16.1.4.4. Sales Footprint
16.1.4.5. Strategy Overview
16.1.4.5.1. Marketing Strategy
16.1.4.5.2. Product Strategy
16.1.4.5.3. Channel Strategy
16.1.5. Auter Elektronics Ltd.
16.1.5.1. Overview
16.1.5.2. Product Portfolio
16.1.5.3. Profitability by Market Segments
16.1.5.4. Sales Footprint
16.1.5.5. Strategy Overview
16.1.5.5.1. Marketing Strategy
16.1.5.5.2. Product Strategy
16.1.5.5.3. Channel Strategy
16.1.6. Advance Circuit Technology, Inc.
16.1.6.1. Overview
16.1.6.2. Product Portfolio
16.1.6.3. Profitability by Market Segments
16.1.6.4. Sales Footprint
16.1.6.5. Strategy Overview
16.1.6.5.1. Marketing Strategy
16.1.6.5.2. Product Strategy
16.1.6.5.3. Channel Strategy
16.1.7. Altron, Inc.
16.1.7.1. Overview
16.1.7.2. Product Portfolio
16.1.7.3. Profitability by Market Segments
16.1.7.4. Sales Footprint
16.1.7.5. Strategy Overview
16.1.7.5.1. Marketing Strategy
16.1.7.5.2. Product Strategy
16.1.7.5.3. Channel Strategy
16.1.8. Applied Magnetics Corporation
16.1.8.1. Overview
16.1.8.2. Product Portfolio
16.1.8.3. Profitability by Market Segments
16.1.8.4. Sales Footprint
16.1.8.5. Strategy Overview
16.1.8.5.1. Marketing Strategy
16.1.8.5.2. Product Strategy
16.1.8.5.3. Channel Strategy
16.1.9. Atrenne Integrated Solutions, Inc.
16.1.9.1. Overview
16.1.9.2. Product Portfolio
16.1.9.3. Profitability by Market Segments
16.1.9.4. Sales Footprint
16.1.9.5. Strategy Overview
16.1.9.5.1. Marketing Strategy
16.1.9.5.2. Product Strategy
16.1.9.5.3. Channel Strategy
16.1.10. Arbell Electronics Inc
16.1.10.1. Overview
16.1.10.2. Product Portfolio
16.1.10.3. Profitability by Market Segments
16.1.10.4. Sales Footprint
16.1.10.5. Strategy Overview
16.1.10.5.1. Marketing Strategy
16.1.10.5.2. Product Strategy
16.1.10.5.3. Channel Strategy
17. Assumptions & Acronyms Used
18. Research Methodology
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Printed Circuit Boards (PCB) Market
