[250 Pages Report] Newly released Photonic Integrated Circuits (PIC) Market analysis report by Future Market Insights shows that global sales of the Photonic Integrated Circuits (PIC) Market in 2021 was held at US$ 1.1 Billion. With 21.5% projected growth, the market from 2022 to 2032 is expected to reach a valuation of US$ 9.4 Billion. Optical Communications is expected to be the highest revenue-generating category, projected to register a projected CAGR of 21.5% from 2022 to 2032.
| Attributes | Details |
|---|---|
| Global Photonic Integrated Circuit Market Size (2022) | US$ 1.3 Billion |
| Global Photonic Integrated Circuit Market Size (2032) | US$ 9.4 Billion |
| Global Photonic Integrated Circuit Market CAGR (2022 to 2032) | 21.5% |
| USA Photonic Integrated Circuit Market Size (2032) | US$ 2.8 Billion |
| Key Companies Covered | Agilent Technologies; Broadcom; Ciena Corporation; Enablence; II-VI Inc.; Hewlett Packard; Huawei Technologies Co., Ltd.; Infinera Corporation; Intel Corporation; Broadex Technologies Co., Ltd.; Cisco Systems, Inc.; MACOM; Mellanox Technologies; NeoPhotonics Corporation; Oclaro, Inc.; TE Connectivity; Uniphase Inc.; VLC Photonics S.L.; POET Technologies |
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As per the Photonic Integrated Circuits (PIC) Market research by Future Market Insights - a market research and competitive intelligence provider, historically, from 2017 to 2021, the market value of the Photonic Integrated Circuits (PIC) Market increased at around 25.5% CAGR.
The factors driving the growth of the photonic integrated circuit market are the downsizing of gadgets and the increase in the level of integration. This circuit supports high-speed data transfer, making it suitable for a wide range of applications in the industrial, aerospace, communications, utilities, and energy sectors, all of which are the key drivers of the photonic IC industry.
Photonic integrated circuits are in high demand for quantum computing and optical fiber sensing applications. Photonic integrated circuit corporations provide advantages such as simple photonic integrated circuit design with reduced energy consumption, smaller and faster goods, and efficient and eco-friendly products. When compared to traditional ICs, photonic integrated circuits have lower costs due to downsizing, a smaller size due to merging a large number of components and functions on a single chip, and enhanced power efficiency.
Photonics and fiber optics market growth is being accelerated by sophisticated breakthroughs and innovations. The growing need for high-speed and efficient data transmission in data centers presents growth prospects to the market. The rising demand for enhanced communication and processing needs, as well as flexible, downsized, and power-efficient circuits, are factors that will drive the growth of the photonic IC industry.
Communication between the photonic integration industry and potential end consumers might be challenging at times. While telecom has traditionally been the largest market for PICs, and the background for such applications is well understood, this is not always the case when dealing with other photonic integration solutions, such as quantum, sensing, or medical optics, where the technical background and language of customers can vary largely.
The demand for Photonic Integrated Circuits is propelling due to a variety of factors like minimal cost, compact size, increased power optimization, and increased level of integration and functionality.
Photonic integrated circuits (ICs) make equipment design easier. The minimization of difficult production procedures aids in expanding manufacturing capacity and reduction in cost, making it attractive to users. Photonic integrated circuits allow a vast number of components and functionalities to be combined on a single chip. As a consequence, the number of components utilized is reduced, and the component's size is reduced as well.
When compared to photonic ICs, the number of functionalities packed into a single chip in electronic ICs is comparatively minimal. PICs acquire various advantages due to their high degree of integration, including size reduction, easy design, low cost, minimum heat dissipation, and power optimization. When compared to electrical ICs, photonic ICs have greater power efficiency. PICs generate significantly low heat during operation, thus resulting in increased power efficiency.
Principal Consultant
The use of Photonic Integrated Circuits (PIC) in optical communications is becoming more common, with a predicted CAGR of 21.5%. A rise in data traffic owing to increasing internet usage, an increase in the number of data centers, and an increase in the adoption of cloud-based and virtualization services are all driving the industry forward. The COVID-19 pandemic boosted demand for advanced networking equipment, propelling the market ahead during the forecast period.
Modern data center networks employ optical communication and networking equipment to meet their high bandwidth and extensible needs. Only optical communication technology has demonstrated capabilities of 40 GB/s, and greater across long distances. As a result, an increasing number of data centers throughout the world use interconnects to offer crucial communications connections between several servers, computing, and memory resources.
As more devices are being linked and new apps are developed, the volume of information going across the internet continues to expand. In 2021, IP data traffic is projected to witness 278,108 PB per month. Furthermore, with the growth in the number of smartphone users, internet usage will also grow, consequently leading to demand build-up for the PIC market.
North America is the most lucrative region with double-digit projected growth. In North America, demand for photonic integrated circuits (PIC)-based devices is being driven by data centers and internet applications of fiber optic communication. The growing demand for high-speed data transmission has raised cloud computing data traffic, and the increasing adoption of IoT has resulted in a potential boom in the photonic integrated circuit market in the region.
Mobile, video and cloud-based apps are increasing bandwidth usage, placing strain on service providers. Companies are expected to construct their optical networks around the PIC, propelling the sector ahead.
The requirement for high data transmission has raised cloud computing, and data traffic, and the increasing adoption of the Internet of Things has resulted in a potential boom in the photonic integrated circuit market in the region.
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The United States is expected to have the highest market share of US$ 2.8 Billion by the end of 2032 and account for approximately 30% of the global revenue. Increased demand for smart device integration and a favorable regulatory environment for the development of medium and small enterprises are expected to boost the US market.
Mobile, video and cloud-based applications are driving up bandwidth consumption, which is putting pressure on service providers. According to industry estimates, the number of Amazon Prime subscribers in the United States will exceed 153 Mn in 2022, up from 142.5 Mn in 2020. While this is a small proportion of the end–use market in the U.S., the overall market in the U.S. is significantly larger.
The Hybrid Integration segment is forecasted to grow at the highest CAGR of over 21.5% from 2022 to 2032. Hybrid integration provides a lot of revenue for companies in the photonic integrated circuits (PIC) industry. Most quantum applications require monolithic photonic systems to fulfill rigorous criteria. To circumvent the limitations of monolithic photonic circuits, companies are developing hybrid platforms that incorporate many photonic technologies into a single functional unit.
For product developers, hybrid integration provides yet another benefit. A complicated microsystem can be divided into several separate parts. After that, each unit is allocated to a different process engineer or group. Before integration, each unit may be designed and completely defined individually. To reduce fabrication costs, units of the same kind can be manufactured at the maximum spatial density on a single substrate.
Monolithic manufacturing provides advantages for devices with basic architectures, such as compact layouts and facile encapsulation. However, since several manufacturing procedures and materials are incompatible, microdevices with complicated functions or structures must be built using the hybrid integration of several components from various fabrication processes.
The leading PIC Market players are Agilent Technologies, Broadcom, Ciena Corporation, Enablence, II-VI Inc., Hewlett Packard, Huawei Technologies Co., Ltd., Infinera Corporation, Intel Corporation, Broadex Technologies Co., Ltd., Cisco Systems, Inc., MACOM, Mellanox Technologies, NeoPhotonics Corporation, Oclaro, Inc., TE Connectivity, Uniphase Inc., VLC Photonics S.L. and POET Technologies. To gain a competitive advantage in the industry, these players are investing in product launches, partnerships, mergers and acquisitions, and expansions.
Some of the key recent developments in the Global PIC Market are as follows:
Similarly, recent developments related to companies in Photonic Integrated Circuits (PIC) services have been tracked by the team at Future Market Insights, which are available in the full report.
The global Photonic Integrated Circuits (PIC) Market is worth more than US$ 1.1 Bn at present.
Value of Photonic Integrated Circuits (PIC) Market are projected to increase at a CAGR of around 21.5% during 2022 – 2032.
Value of Photonic Integrated Circuits (PIC) Market increased at a CAGR of around 25.5% during 2017 – 2021.
The Internet of Things (IoT), cloud, streaming video, 5G, and several other innovations are causing the Photonic Integrated Circuit Market to grow enormously in order to meet market demand.
The market for Photonic Integrated Circuits (PIC) Market in US is projected to expand at a CAGR of around 21.1% during 2022 – 2032.
1. Executive Summary
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Background
3.1. Market Dynamics
3.1.1. Drivers
3.1.2. Restraints
3.1.3. Opportunity
3.1.4. Trends
3.2. Scenario Forecast
3.2.1. Demand in Optimistic Scenario
3.2.2. Demand in Likely Scenario
3.2.3. Demand in Conservative Scenario
3.3. Opportunity Map Analysis
3.4. Investment Feasibility Matrix
3.5. PESTLE and Porter’s Analysis
3.6. Regulatory Landscape
3.6.1. By Key Regions
3.6.2. By Key Countries
4. Global Market Analysis 2017-2021 and Forecast, 2022-2032
4.1. Historical Market Size Value (US$ Mn) Analysis, 2017-2021
4.2. Current and Future Market Size Value (US$ Mn) Projections, 2022-2032
4.2.1. Y-o-Y Growth Trend Analysis
4.2.2. Absolute $ Opportunity Analysis
5. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Integration Type
5.1. Introduction / Key Findings
5.2. Historical Market Size Value (US$ Mn) Analysis By Integration Type, 2017-2021
5.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Integration Type, 2022-2032
5.3.1. Monolithic Integration
5.3.2. Hybrid Integration
5.3.3. Module Integration
5.4. Y-o-Y Growth Trend Analysis By Integration Type, 2017-2021
5.5. Absolute $ Opportunity Analysis By Integration Type, 2022-2032
6. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Application
6.1. Introduction / Key Findings
6.2. Historical Market Size Value (US$ Mn) Analysis By Application, 2017-2021
6.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Application, 2022-2032
6.3.1. Optical Communications
6.3.2. Sensing
6.3.3. Bio-photonics
6.3.4. Optical Signal Processing
6.4. Y-o-Y Growth Trend Analysis By Application, 2017-2021
6.5. Absolute $ Opportunity Analysis By Application, 2022-2032
7. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Raw Material
7.1. Introduction / Key Findings
7.2. Historical Market Size Value (US$ Mn) Analysis By Raw Material, 2017-2021
7.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Raw Material, 2022-2032
7.3.1. Indium Phosphide
7.3.2. Galium Arsenide
7.3.3. Lithium Niobate
7.3.4. Silicone
7.3.5. Silica-on-Insulator
7.3.6. Others
7.4. Y-o-Y Growth Trend Analysis By Raw Material, 2017-2021
7.5. Absolute $ Opportunity Analysis By Raw Material, 2022-2032
8. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Component
8.1. Introduction / Key Findings
8.2. Historical Market Size Value (US$ Mn) Analysis By Component, 2017-2021
8.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Component, 2022-2032
8.3.1. Lasers
8.3.2. Modulators
8.3.3. Detectors
8.3.4. Attenuators
8.3.5. MUX/ DEMUX
8.3.6. Optical Amplifiers
8.4. Y-o-Y Growth Trend Analysis By Component, 2017-2021
8.5. Absolute $ Opportunity Analysis By Component, 2022-2032
9. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Region
9.1. Introduction
9.2. Historical Market Size Value (US$ Mn) Analysis By Region, 2017-2021
9.3. Current Market Size Value (US$ Mn) Analysis and Forecast By Region, 2022-2032
9.3.1. North America
9.3.2. Latin America
9.3.3. Europe
9.3.4. Asia Pacific
9.3.5. MEA
9.4. Market Attractiveness Analysis By Region
10. North America Market Analysis 2017-2021 and Forecast 2022-2032, By Country
10.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
10.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
10.2.1. By Country
10.2.1.1. U.S.
10.2.1.2. Canada
10.2.2. By Integration Type
10.2.3. By Application
10.2.4. By Raw Material
10.2.5. By Component
10.3. Market Attractiveness Analysis
10.3.1. By Country
10.3.2. By Integration Type
10.3.3. By Application
10.3.4. By Raw Material
10.3.5. By Component
10.4. Key Takeaways
11. Latin America Market Analysis 2017-2021 and Forecast 2022-2032, By Country
11.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
11.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
11.2.1. By Country
11.2.1.1. Brazil
11.2.1.2. Mexico
11.2.1.3. Rest of Latin America
11.2.2. By Integration Type
11.2.3. By Application
11.2.4. By Raw Material
11.2.5. By Component
11.3. Market Attractiveness Analysis
11.3.1. By Country
11.3.2. By Integration Type
11.3.3. By Application
11.3.4. By Raw Material
11.3.5. By Component
11.4. Key Takeaways
12. Europe Market Analysis 2017-2021 and Forecast 2022-2032, By Country
12.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
12.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
12.2.1. By Country
12.2.1.1. Germany
12.2.1.2. Italy
12.2.1.3. France
12.2.1.4. U.K.
12.2.1.5. Spain
12.2.1.6. Russia
12.2.1.7. BENELUX
12.2.1.8. Rest of Europe
12.2.2. By Integration Type
12.2.3. By Application
12.2.4. By Raw Material
12.2.5. By Component
12.3. Market Attractiveness Analysis
12.3.1. By Country
12.3.2. By Integration Type
12.3.3. By Application
12.3.4. By Raw Material
12.3.5. By Component
12.4. Key Takeaways
13. Asia Pacific Market Analysis 2017-2021 and Forecast 2022-2032, By Country
13.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
13.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
13.2.1. By Country
13.2.1.1. China
13.2.1.2. Japan
13.2.1.3. South Korea
13.2.1.4. India
13.2.1.5. Rest of Asia Pacific
13.2.2. By Integration Type
13.2.3. By Application
13.2.4. By Raw Material
13.2.5. By Component
13.3. Market Attractiveness Analysis
13.3.1. By Country
13.3.2. By Integration Type
13.3.3. By Application
13.3.4. By Raw Material
13.3.5. By Component
13.4. Key Takeaways
14. MEA Market Analysis 2017-2021 and Forecast 2022-2032, By Country
14.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
14.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
14.2.1. By Country
14.2.1.1. GCC
14.2.1.2. Rest of MEA
14.2.2. By Integration Type
14.2.3. By Application
14.2.4. By Raw Material
14.2.5. By Component
14.3. Market Attractiveness Analysis
14.3.1. By Country
14.3.2. By Integration Type
14.3.3. By Application
14.3.4. By Raw Material
14.3.5. By Component
14.4. Key Takeaways
15. Key Countries Market Analysis
15.1. U.S.
15.1.1. Pricing Analysis
15.1.2. Market Share Analysis, 2021
15.1.2.1. By Integration Type
15.1.2.2. By Application
15.1.2.3. By Raw Material
15.1.2.4. By Component
15.2. Canada
15.2.1. Pricing Analysis
15.2.2. Market Share Analysis, 2021
15.2.2.1. By Integration Type
15.2.2.2. By Application
15.2.2.3. By Raw Material
15.2.2.4. By Component
15.3. Brazil
15.3.1. Pricing Analysis
15.3.2. Market Share Analysis, 2021
15.3.2.1. By Integration Type
15.3.2.2. By Application
15.3.2.3. By Raw Material
15.3.2.4. By Component
15.4. Mexico
15.4.1. Pricing Analysis
15.4.2. Market Share Analysis, 2021
15.4.2.1. By Integration Type
15.4.2.2. By Application
15.4.2.3. By Raw Material
15.4.2.4. By Component
15.5. Argentina
15.5.1. Pricing Analysis
15.5.2. Market Share Analysis, 2021
15.5.2.1. By Integration Type
15.5.2.2. By Application
15.5.2.3. By Raw Material
15.5.2.4. By Component
15.6. Germany
15.6.1. Pricing Analysis
15.6.2. Market Share Analysis, 2021
15.6.2.1. By Integration Type
15.6.2.2. By Application
15.6.2.3. By Raw Material
15.6.2.4. By Component
15.7. Italy
15.7.1. Pricing Analysis
15.7.2. Market Share Analysis, 2021
15.7.2.1. By Integration Type
15.7.2.2. By Application
15.7.2.3. By Raw Material
15.7.2.4. By Component
15.8. France
15.8.1. Pricing Analysis
15.8.2. Market Share Analysis, 2021
15.8.2.1. By Integration Type
15.8.2.2. By Application
15.8.2.3. By Raw Material
15.8.2.4. By Component
15.9. U.K.
15.9.1. Pricing Analysis
15.9.2. Market Share Analysis, 2021
15.9.2.1. By Integration Type
15.9.2.2. By Application
15.9.2.3. By Raw Material
15.9.2.4. By Component
15.10. Spain
15.10.1. Pricing Analysis
15.10.2. Market Share Analysis, 2021
15.10.2.1. By Integration Type
15.10.2.2. By Application
15.10.2.3. By Raw Material
15.10.2.4. By Component
15.11. Russia
15.11.1. Pricing Analysis
15.11.2. Market Share Analysis, 2021
15.11.2.1. By Integration Type
15.11.2.2. By Application
15.11.2.3. By Raw Material
15.11.2.4. By Component
15.12. BENELUX
15.12.1. Pricing Analysis
15.12.2. Market Share Analysis, 2021
15.12.2.1. By Integration Type
15.12.2.2. By Application
15.12.2.3. By Raw Material
15.12.2.4. By Component
15.13. China
15.13.1. Pricing Analysis
15.13.2. Market Share Analysis, 2021
15.13.2.1. By Integration Type
15.13.2.2. By Application
15.13.2.3. By Raw Material
15.13.2.4. By Component
15.14. Japan
15.14.1. Pricing Analysis
15.14.2. Market Share Analysis, 2021
15.14.2.1. By Integration Type
15.14.2.2. By Application
15.14.2.3. By Raw Material
15.14.2.4. By Component
15.15. South Korea
15.15.1. Pricing Analysis
15.15.2. Market Share Analysis, 2021
15.15.2.1. By Integration Type
15.15.2.2. By Application
15.15.2.3. By Raw Material
15.15.2.4. By Component
15.16. India
15.16.1. Pricing Analysis
15.16.2. Market Share Analysis, 2021
15.16.2.1. By Integration Type
15.16.2.2. By Application
15.16.2.3. By Raw Material
15.16.2.4. By Component
15.17. GCC Countries
15.17.1. Pricing Analysis
15.17.2. Market Share Analysis, 2021
15.17.2.1. By Integration Type
15.17.2.2. By Application
15.17.2.3. By Raw Material
15.17.2.4. By Component
16. Market Structure Analysis
16.1. Competition Dashboard
16.2. Competition Benchmarking
16.3. Market Share Analysis of Top Players
16.3.1. By Regional
16.3.2. By Integration Type
16.3.3. By Application
16.3.4. By Raw Material
16.3.5. By Component
17. Competition Analysis
17.1. Competition Deep Dive
17.1.1. Agilent Technologies
17.1.1.1. Overview
17.1.1.2. Product Portfolio
17.1.1.3. Profitability by Market Segment
17.1.1.4. Sales Footprint
17.1.1.5. Strategy Overview
17.1.1.5.1. Marketing Strategy
17.1.1.5.2. Product Strategy
17.1.2. Broadcom
17.1.2.1. Overview
17.1.2.2. Product Portfolio
17.1.2.3. Profitability by Market Segment
17.1.2.4. Sales Footprint
17.1.2.5. Strategy Overview
17.1.2.5.1. Marketing Strategy
17.1.2.5.2. Product Strategy
17.1.3. Ciena Corporation
17.1.3.1. Overview
17.1.3.2. Product Portfolio
17.1.3.3. Profitability by Market Segment
17.1.3.4. Sales Footprint
17.1.3.5. Strategy Overview
17.1.3.5.1. Marketing Strategy
17.1.3.5.2. Product Strategy
17.1.4. Enablence
17.1.4.1. Overview
17.1.4.2. Product Portfolio
17.1.4.3. Profitability by Market Segment
17.1.4.4. Sales Footprint
17.1.4.5. Strategy Overview
17.1.4.5.1. Marketing Strategy
17.1.4.5.2. Product Strategy
17.1.5. II-VI Inc.
17.1.5.1. Overview
17.1.5.2. Product Portfolio
17.1.5.3. Profitability by Market Segment
17.1.5.4. Sales Footprint
17.1.5.5. Strategy Overview
17.1.5.5.1. Marketing Strategy
17.1.5.5.2. Product Strategy
17.1.6. Hewlett Packard
17.1.6.1. Overview
17.1.6.2. Product Portfolio
17.1.6.3. Profitability by Market Segment
17.1.6.4. Sales Footprint
17.1.6.5. Strategy Overview
17.1.6.5.1. Marketing Strategy
17.1.6.5.2. Product Strategy
17.1.7. Huawei Technologies Co. Ltd.
17.1.7.1. Overview
17.1.7.2. Product Portfolio
17.1.7.3. Profitability by Market Segment
17.1.7.4. Sales Footprint
17.1.7.5. Strategy Overview
17.1.7.5.1. Marketing Strategy
17.1.7.5.2. Product Strategy
17.1.8. Infinera Corporation
17.1.8.1. Overview
17.1.8.2. Product Portfolio
17.1.8.3. Profitability by Market Segment
17.1.8.4. Sales Footprint
17.1.8.5. Strategy Overview
17.1.8.5.1. Marketing Strategy
17.1.8.5.2. Product Strategy
17.1.9. Intel Corporation
17.1.9.1. Overview
17.1.9.2. Product Portfolio
17.1.9.3. Profitability by Market Segment
17.1.9.4. Sales Footprint
17.1.9.5. Strategy Overview
17.1.9.5.1. Marketing Strategy
17.1.9.5.2. Product Strategy
17.1.10. Broadex Technologies Co. Ltd.
17.1.10.1. Overview
17.1.10.2. Product Portfolio
17.1.10.3. Profitability by Market Segment
17.1.10.4. Sales Footprint
17.1.10.5. Strategy Overview
17.1.10.5.1. Marketing Strategy
17.1.10.5.2. Product Strategy
17.1.11. Cisco Systems, Inc.
17.1.11.1. Overview
17.1.11.2. Product Portfolio
17.1.11.3. Profitability by Market Segment
17.1.11.4. Sales Footprint
17.1.11.5. Strategy Overview
17.1.11.5.1. Marketing Strategy
17.1.11.5.2. Product Strategy
17.1.12. MACOM
17.1.12.1. Overview
17.1.12.2. Product Portfolio
17.1.12.3. Profitability by Market Segment
17.1.12.4. Sales Footprint
17.1.12.5. Strategy Overview
17.1.12.5.1. Marketing Strategy
17.1.12.5.2. Product Strategy
17.1.13. Mellanox Technologies
17.1.13.1. Overview
17.1.13.2. Product Portfolio
17.1.13.3. Profitability by Market Segment
17.1.13.4. Sales Footprint
17.1.13.5. Strategy Overview
17.1.13.5.1. Marketing Strategy
17.1.13.5.2. Product Strategy
17.1.14. Neophotonics Corporation
17.1.14.1. Overview
17.1.14.2. Product Portfolio
17.1.14.3. Profitability by Market Segment
17.1.14.4. Sales Footprint
17.1.14.5. Strategy Overview
17.1.14.5.1. Marketing Strategy
17.1.14.5.2. Product Strategy
17.1.15. Oclaro, Inc.
17.1.15.1. Overview
17.1.15.2. Product Portfolio
17.1.15.3. Profitability by Market Segment
17.1.15.4. Sales Footprint
17.1.15.5. Strategy Overview
17.1.15.5.1. Marketing Strategy
17.1.15.5.2. Product Strategy
17.1.16. TE Connectivity
17.1.16.1. Overview
17.1.16.2. Product Portfolio
17.1.16.3. Profitability by Market Segment
17.1.16.4. Sales Footprint
17.1.16.5. Strategy Overview
17.1.16.5.1. Marketing Strategy
17.1.16.5.2. Product Strategy
17.1.17. VLC Photonics S.L.
17.1.17.1. Overview
17.1.17.2. Product Portfolio
17.1.17.3. Profitability by Market Segment
17.1.17.4. Sales Footprint
17.1.17.5. Strategy Overview
17.1.17.5.1. Marketing Strategy
17.1.17.5.2. Product Strategy
17.1.18. POET Technologies
17.1.18.1. Overview
17.1.18.2. Product Portfolio
17.1.18.3. Profitability by Market Segment
17.1.18.4. Sales Footprint
17.1.18.5. Strategy Overview
17.1.18.5.1. Marketing Strategy
17.1.18.5.2. Product Strategy
18. Assumptions & Acronyms Used
19. Research Methodology
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Photonic Integrated Circuit Market
