The global high-end performance packaging market size reached USD 3.3 billion in 2022. Total sales of high-end performance packaging will rise at 15.9% CAGR between 2023 and 2033. By the end of 2033, total market valuation will reach around USD 17.0 billion.
The worldwide high-end performance packaging market value is set to reach USD 3.9 billion by 2033. By technology, UHD FO will remain the top revenue-generating category. It will expand at a CAGR of over 15.8% during the assessment period (2023 to 2033).
In recent years, rising need for miniaturized electronic devices with cost-efficient manufacturing has brought high-end performance packaging market into limelight. Besides this, markets fan-out wafer level packaging market is also witnessing robust growth.
High-end performance packaging has become an ideal solution for designing next-generation ICs. These ICs are being utilized in data centers, autonomous vehicles, and consumer electronics.
Adoption of high-end performance packaging enables companies to develop compact, cost-effective, and efficient electronic components and systems. High-end performance packaging technologies provide greater performance in a smaller footprint.
Rapid shift towards system-in-package (SIP) and heterogeneous integration will boost the global market.
Advanced packaging solutions including high-end performance are less expensive, offer reduced latency, and improve system performance. Growing application of high-end performance packaging in high-performance computing and ADAS (advanced driving assistance systems) will create growth prospects for the market.
Asia Pacific will continue its dominance over the global market through 2033. Asia Pacific high-end performance packaging market will reach USD 1.90 billion in 2023. By 2033, Asia Pacific market is set to be valued at USD 8.3 billion by 2033.
Booming semiconductor sector and increasing adoption of advanced packaging technologies will drive Asia Pacific market.
Large presence of leading manufacturers and providers of high-end electronic packaging systems is also influencing sales in the market. China-based companies such as JCET group provide system in package, fan out wafer packaging technologies, and system-on-chip technology.
| Attributes | Key Insights |
|---|---|
| High-End Performance Packaging Market Estimated Value (2023) | USD 3.9 billion |
| Projected Market Value (2033) | USD 17.0 billion |
| Value-based CAGR (2023 to 2033) | 15.9% |
| USA Market CAGR (2023 to 2033) | 15.2% |
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Global sales of high-end performance packaging grew at 19.2% CAGR from 2018 to 2022. At the end of 2022, total market valuation reached USD 3.3 billion.
Between 2023 and 2033, global high-end performance packaging demand will rise at 15.9% CAGR. The worldwide market for high-end performance will create an absolute D opportunity of USD 13.1 billion.
High-end performance packaging in semiconductors plays an important role in protecting the chips from surrounding environment. It also ensures that there is an electrical connection between chip mounts on electrical boards.
The high-end performance packaging technology involves Ultra High Density Fan-Out (UHD FO) packaging technology, High Bandwidth Memory (HBM) packaging, 3DNAND, Co-EMIB, Si interposer packaging, 3D System on chip (SOC), and Foveros.
The applications of Ultra High Density Fan Out (UHD FO) packaging are in cloud computing technology, 5G telecommunication, autonomous cars, and Artificial Intelligence chips.
The High Bandwidth Memory (HBM) is the standard DRAM that helps in achieving 256 GBps bandwidth and reduces power consumption of the semiconductor devices circuitry. This packaging technology helps in lesser power consumption and more clock speed.
The 3D System on Chip integration system allows reduction of the circuit elements and thus makes the electronics circuit thinner and more compact. For instance, the Department of Defense (DOD) uses 3D SOC technology which aids 50X better performance and yields better output results.
Foveros by Intel is one of its kinds of technology that provide 3D stacking solution and helps in power efficiency and cost optimization. The compact structures of semiconductors make them fit in autonomous vehicles’ electronics circuitry. The EMIB and Co-EMIB are used in high performance computing and data center networking.
| Country | United States |
|---|---|
| Projected CAGR (2023 to 2033) | 15.2% |
| Historical CAGR (2018 to 2022) | 15.8% |
| Market Value (2033) | USD 2.8 billion |
| Country | United Kingdom |
|---|---|
| Projected CAGR (2023 to 2033) | 14.2% |
| Historical CAGR (2018 to 2022) | 14.2% |
| Market Value (2033) | USD 452.1 million |
| Country | China |
|---|---|
| Projected CAGR (2023 to 2033) | 17.4% |
| Historical CAGR (2018 to 2022) | 21.5% |
| Market Value (2033) | USD 4.3 billion |
| Country | Japan |
|---|---|
| Projected CAGR (2023 to 2033) | 16.1% |
| Historical CAGR (2018 to 2022) | 19.4% |
| Market Value (2033) | USD 2.7 billion |
| Country | South Korea |
|---|---|
| Projected CAGR (2023 to 2033) | 16.4% |
| Historical CAGR (2018 to 2022) | 20.8% |
| Market Value (2033) | USD 1.0 billion |
High Adoption of Advanced Packaging Technologies Boosting Sales in the United States
The USA high-end performance packaging market is set to expand at 15.2% CAGR through 2033. By 2033, total market size in the United States will reach USD 2.8 billion.
Overall high-end performance packaging demand in the USA will create an absolute D opportunity of USD 2.1 billion by 2033. The USA market grew at 15.8% CAGR from 2018 to 2022.
Growing inclination towards using advanced packaging technologies is driving the United States market. Subsequently, rising popularity of high-performance computing will propel high-end performance packaging demand.
Large presence of high-end performance packaging manufacturers is another factor boosting market development. Several USA-based companies are developing new technologies and putting efforts to advance in packaging technologies.
For instance, in July 2021, Intel Corporation, the United States-based company announced that it has developed a clear roadmap till 2025 for processes and packaging technology showcasing a series of innovations.
Such advancements in high-end performance packaging sector in the United States are helping the market to thrive rapidly.
Rapid Shift Towards High-Performance Computing Boosting the United Kingdom Market
The United Kingdom high-end performance packaging market is set to reach USD 452.1 million in 2023. Between 2023 and 2033, demand for high-end performance packaging in the country will rise at 14.2% CAGR. Rising popularity of high-performance computing and expansion of IT & telecommunication sector are driving the United Kingdom market.
To meet growing demand, companies are developing new innovative solutions. For instance, in September 2019, ARM, a leading United Kingdom-based electronics manufacturer along with TSMC announced that they have developed industry’s first 7nm ARM-based CoWoS chiplets for high performance computing.
They have demonstrated technologies for developing a system on chip with ARM based technology operating at a 4GHz in a 7 FinFET process. This will aid in the expansion of the market.
Growing Trend of Miniaturization Creating High-End Performance Packaging Demand in China
China’s high-end performance packaging market will progress at 17.4% CAGR through 2033. Total market size in China is slated to reach USD 4.3 billion by 2033.
As per the study, high-end performance packaging demand in China will create an absolute D opportunity of USD 3.5 billion. Increasing penetration of miniaturization supported by surging need for compact electronic devices is driving the market in China.
Similarly, heavy presence of the world’s leading semiconductor and consumer electronics companies will elevate high-end performance packaging demand in China.
Leading China-based high-end performance packaging manufacturers and providers such as JCET Group offer advanced packaging technologies such as wire bond packaging, flip flop packaging, wafer level packaging, system in packages.
JCET’s XDFOI technology supports integration of multiple chips and high bandwidth memory with cost optimization features. This is positively impacting the market expansion.
Principal Consultant
By application the global market for high-end performance packaging is segmented into data center networking, high performance computing, and autonomous vehicles. Among these, high performance computing segment will lead the market.
FMI predicts applications of high-end performance packaging in high performance computing sector to increase at an impressive CAGR of 15.7% during the assessment period. From 2018 to 2022, the target segment grew at 18.5% CAGR.
Growth of the target segment is due to growing usage of high-end performance packaging for designing high energy-efficient systems for high performance computing applications.
In recent years, advanced heterogenous packaging solutions such as high-end performance packaging has made full entrance into high-performance computing sector. They enable users to achieve high speed and high performance by designing compact and energy-efficient systems.
Key high-end performance packaging companies include Intel, TSMC, ASE, Samsung, Amkor, JCET Group, Tongfu, ADI, AMD, and ARM. These leading high-end performance packaging manufacturers are developing advanced packaging solutions.
They are also forming alliances, partnerships, and collaborations. Besides this, they are acquiring other companies to gain a competitive edge in the market.
Recent Developments:
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| Attribute | Details |
|---|---|
| Estimated Market Size (2023) | USD 3.9 billion |
| Projected Market Size (2033) | USD 17 billion |
| Anticipated Growth Rate (2023 to 2033) | 15.9% CAGR |
| Forecast Period | 2023 to 2033 |
| Historical Data Available for | 2018 to 2022 |
| Market Analysis | USD Million for Value and MT for Volume |
| Key Regions Covered | North America; Latin America; Europe; Asia Pacific; and the Middle East & Africa |
| Key Countries Covered | United States, Canada, Brazil, Mexico, Germany, United Kingdom, France, Italy, Spain, Nordic, Russia, Poland, China, India, Thailand, Indonesia, Australia and New Zealand, Japan, GCC countries, North Africa, South Africa, and others. |
| Key Segments Covered | Technology, Application, and Region |
| Key Companies Profiled | Intel; TSMC; ASE; Samsung; Amkor; JCET Group; Tongfu; ADI; AMD; ARM |
| Report Coverage | Market Forecast, Company Share Analysis, Competition Intelligence, Drivers Restraints Opportunity Trends Analysis, Market Dynamics and Challenges, and Strategic Growth Initiatives |
The market is valued at USD 3.9 billion in 2023.
The market is estimated to record a 15.9% CAGR rate through 2033.
From 2018 to 2022, the market expanded at a 19.2% CAGR.
China is likely to expand at a 17.4% CAGR through 2033.
Intel, TSMC, and ASE are the prominent market players.
1. Executive Summary | High-End Performance Packaging Market 2. Market Overview 3. Market Background 4. Global Market Analysis 2018 to 2022 and Forecast, 2023 to 2033 5. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Technology 5.1. UHD FO 5.2. HBM 5.3. 3DS 5.4. Foveros 5.5. 3DNAND 5.6. Co-EMIB 5.7. EMIB 5.8. Si Interposer 5.9. 3D SoC 6. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Application 6.1. Data Center Networking 6.2. High-Performance Computing 6.3. Autonomous Vehicles 7. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Region 7.1. North America 7.2. Latin America 7.3. Europe 7.4. Asia Pacific 7.5. Middle East & Africa 8. North America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 9. Latin America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 10. Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 11. Asia Pacific Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 12. Middle East & Africa Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 13. Key Countries Market Analysis 14. Market Structure Analysis 15. Competition Analysis 15.1. Intel 15.2. TSMC 15.3. ASE 15.4. Samsung 15.5. Amkor 15.6. JCET Group 15.7. Tongfu 15.8. ADI 15.9. AMD 15.10. ARM 16. Assumptions & Acronyms Used 17. Research Methodology
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High-End Performance Packaging Market
