The global electronics adhesives market size is expected to be valued at US$ 5.1 billion in 2023. Advancements in 5G technology, bolsters the overall scope for electronics adhesives market, which is projected to grow at a CAGR of 9.0% between 2023 and 2033, totaling around US$ 12.1 billion by 2033.
Data Points | Key Statistics |
---|---|
Electronics Adhesives Market Value 2023 | US$ 5.1 billion |
Electronics Adhesives Market Projected Value (2033) | US$ 12.1 billion |
Electronics Adhesives Market CAGR (2023 to 2033) | 9.0% |
The emergence of smart manufacturing and Industry 4.0 concepts is revolutionizing the electronics manufacturing industry, leading to increased demand for adhesives that can support efficient and automated assembly processes. Smart manufacturing refers to the use of advanced technologies such as Internet of Things (IoT), artificial intelligence, robotics, and data analytics to optimize manufacturing operations and enhance productivity.
Industry 4.0, on the other hand, represents the fourth industrial revolution characterized by the integration of digital technologies into industrial processes, enabling real-time data exchange, automation, and smart decision-making. The implementation of smart manufacturing and Industry 4.0 principles in electronics production is transforming traditional assembly methods and driving the need for innovative adhesives.
One of the key requirements of smart manufacturing is the ability to achieve faster production cycles and higher throughput. Adhesives with quick cure times are crucial in meeting these demands. Fast-curing adhesives enable rapid bonding and fixation of components, reducing assembly time and increasing production efficiency. Manufacturers are increasingly adopting adhesives that offer rapid curing properties, allowing for faster handling, inspection, and packaging of electronic devices.
Another important aspect of smart manufacturing is the integration of automated assembly systems. Adhesives compatible with automated production lines are essential to ensure smooth and seamless operations. The adhesives should possess properties that enable precise and consistent dispensing, such as low viscosity for accurate application, controlled flow, and the ability to bond various substrates and components. Adhesives with high dispensing accuracy facilitate automated dispensing processes, reducing the risk of errors, improving product quality, and enhancing production speed.
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The global demand for electronics adhesives is projected to increase at a CAGR of 6.5% during the forecast period between 2018 and 2022, reaching a total of US$ 12.1 billion in 2033.
According to Future Market Insights, a market research and competitive intelligence provider, the electronics adhesives market was valued at US$ 4.7 billion in 2022.
The increasing demand for wearable devices is a significant factor driving the growth of the electronics adhesives market. Wearable devices have gained immense popularity in recent years due to their ability to integrate technology into everyday accessories, providing convenience, connectivity, and enhanced functionalities to users.
Wearable devices encompass a wide range of products, including smartwatches, fitness trackers, health monitors, smart clothing, and AR glasses. The devices often consist of small, intricate electronic components that need to be securely bonded and protected. Electronics adhesives play a vital role in ensuring the durability, reliability, and performance of these devices.
One of the key requirements for wearable devices is the ability to withstand the challenges of daily use and exposure to environmental factors. Electronics adhesives provide essential protection by bonding and encapsulating the sensitive components, safeguarding them from moisture, dust, and mechanical stress. The adhesives create a barrier that prevents the ingress of water, dirt, and other contaminants, preserving the functionality and longevity of the wearable device.
Wearable devices are designed to be compact, lightweight, and comfortable for users to wear throughout the day. This places specific demands on the adhesives used in their assembly. The adhesives must be able to provide strong bonding while being thin and flexible, ensuring a comfortable fit and seamless integration into the wearable device. Adhesives with low-profile characteristics are preferred to maintain the sleek and compact design of wearable devices.
Miniaturization of Electronic Devices is Likely to be Beneficial for Market Growth
The miniaturization of electronic devices is a significant trend in the electronics industry that is driving the demand for advanced electronics adhesives. Electronic manufacturers are continuously striving to reduce the size and weight of their products while maintaining optimal performance, as consumers demand smaller and more compact devices with increased functionality.
Advanced electronics adhesives used for miniaturized devices are formulated with specific characteristics to meet the requirements of microelectronic applications. The adhesives offer excellent bond strength, precise control over application, and the ability to bond sensitive components without causing damage or affecting their performance. They also provide reliable protection against environmental factors, such as moisture, temperature variations, and mechanical stresses.
The miniaturized electronic devices require adhesives that can withstand the thermal challenges associated with compact designs. Heat dissipation becomes a critical factor, as components are placed in close proximity to each other. Electronics adhesives with enhanced thermal conductivity properties help transfer heat away from sensitive components, ensuring efficient thermal management and preventing overheating issues.
Miniaturization often involves the use of flexible and bendable substrates, such as flexible circuits or wearable electronics. Electronics adhesives with flexibility and elasticity are needed to accommodate the bending and flexing of these substrates without compromising the integrity of the bond. The adhesives should exhibit excellent adhesion to different materials, including plastics, metals, and flexible substrates, ensuring robust bonding even in dynamic conditions.
Increased Adoption of Flexible Electronics to Fuel the Market Growth
The increased adoption of flexible electronics is a significant trend in the electronics industry that is anticipated to accelerate the demand for specialized adhesives. Flexible electronics refer to electronic devices and circuits that are designed to be bendable, stretchable, and conformable to various surfaces. The technology offers numerous benefits such as lightweight design, space efficiency, and the ability to integrate electronics into unconventional shapes and materials.
Flexible displays, sensors, and printed circuit boards are some of the key applications of flexible electronics. Flexible displays, for instance, are being used in smartphones, wearable devices, e-readers, and signage, allowing for curved or foldable screens. Flexible sensors are used in applications such as healthcare monitoring, smart textiles, and automotive systems. Printed circuit boards (PCBs) in flexible form enable the development of thin and lightweight electronic devices.
The adoption of flexible electronics requires adhesives that can bond components to flexible substrates and provide strong, reliable, and durable adhesion. The adhesives must have the ability to withstand repeated bending, stretching, and twisting without compromising the performance or integrity of the electronic device. They should exhibit excellent adhesion to a variety of materials, including flexible substrates such as polyimide or polyethylene terephthalate (PET) films.
Specialized flexible electronics adhesives are formulated to meet these requirements. They offer flexibility, elasticity, and high bond strength to ensure robust adhesion in dynamic and bending conditions. The adhesives provide the necessary mechanical stability to withstand the stresses associated with repeated flexing, while maintaining electrical conductivity and signal integrity.
Increasing Electronics Manufacturing to Boost Market Demand
Future Market Insights has projected China to remain a lucrative regional market throughout the forecast period. China is expected to attain a CAGR of 8.5% during the analysis period. One of the key factors supporting growth in the country. China is the leading country in the production of electronic devices and circuits growth prospects will be very promising over the coming years.
Attributing to factors such as increasing electronics manufacturing, as well as rising demand for smartphones and consumer electronics, China remains one of the largest markets for electronics adhesives in the world, which invariably makes it a lucrative sector for manufacturers.
Investments in Aerospace & Defense Activities to Boost Market Demand
India is expected to generate a total absolute $ opportunity of US$ 537.5 Mn by the end of the forecast period. The demand for electronics adhesives can largely be attributed to the mobiles and telecommunications sector. The country’s automotive industry is expanding at a high pace, which generates a requirement for relevant raw material supplies. The country is expected to witness a CAGR of 8.2% during the forecast period.
India is the second-largest country by population, which will generate significant opportunities for market players. The Indian players are investing in aerospace and defense activities, which is also creating robust development opportunities for electronic devices and circuit manufacturers.
Increasing Integration of Electronic Systems to Boost Market Demand
The United States is anticipated to hold more than 80% of the market share in North America. The United States has one of the most advanced defense systems in the world owing to investments into research and development (R&D) for advanced technologies, which creates an outstanding demand for electronic devices and circuits which in turn promote the sales of electronics adhesives in the country.
The automotive industry in the country is witnessing a rapid transformation with the increasing integration of electronic systems in vehicles. Advanced features such as infotainment systems, autonomous driving technologies, and electrification require robust electronics adhesives that can withstand harsh automotive environments and provide secure bonding and protection for electronic components.
The United States is witnessing significant growth in the renewable energy sector, particularly in solar and wind power generation. The manufacturing and installation of solar panels, wind turbines, and energy storage systems require electronics adhesives for various applications, including bonding, sealing, and encapsulation of components. The expansion of the renewable energy industry is expected to drive the demand for electronics adhesives. The country is expected to witness a CAGR of 8.1% during the forecast period.
Increasing Demand for Electric Vehicles to Boost Market Prospects
Germany is one of the global leaders in terms of manufacturing activities and infrastructure. The country is expected to grow at CAGR of 7.2% during the forecast period. Germany has strong presence of automotive manufacturers and suppliers. The country caters to the demand for the automotive industry from a number of countries.
Electronics adhesives are used in many automotive systems including collision avoidance systems, engine status displays, power electronic modules, anti-theft systems, and LED packaging. Positive prospects for electric vehicles are boosting the sales of electronics adhesives during the forecast period.
Increasing Demand for Electronics Miniaturization to Boost Market Prospects
Japan is the second largest market for electronics adhesives after China in the East Asia region and has an estimated market value of US$ 628.6 Mn in 2022. Japan is well known for its technological advancement, research and development, and manufacturing activities.
Japan is one of the global leaders for industrial automation and robotics, which creates significant demand for electronic devices and circuits in the country. The growing trend of miniaturization of existing electronic products will also prove beneficial. The country is expected to witness a CAGR of 8.0% during the forecast period.
Greater Consumer Interest to Boost Growth
Polyurethane holds about 50% of the global electronics adhesives market share. Electronics adhesives are segmented on the basis of material type in polyurethane, acrylics, silicones, and epoxy.
Polyurethane is gaining greater consumer interest due to its advantages such as thermal resistance, and longer life cycle. Driven by these characteristics, polyurethane is expected to be the fastest growing segment of electronics adhesives with an 8.5% CAGR.
Growth in Mobiles & Telecommunications to Boost the Market Demand
The automotive sector dominates the global electronics adhesives market, with it accounting for 18.8% market share. The growth can be attributed to the high demand for electronic devices and circuits in new and upcoming automobile vehicles across the globe.
In the past few years, the mobiles and telecommunications sector has also witnessed substantial growth due to increasing demand. Desktop and networks manufacturers seen significant growth owing to industrialization. The segment is expected to hold a CAGR of 8.6% during the forecast period.
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Electronics adhesives market startup players are adopting various marketing strategies such as new product launches, geographical expansion, merger and acquisitions, partnerships and collaboration to create a larger customer base. For instance,
Key players in the electronics adhesives market are strongly focusing on profit generation from their existing product portfolios along while exploring potential new applications. The players are emphasizing on increasing their electronics adhesives production capacities, to cater to the demand from numerous end use industries. Prominent players are also pushing for geographical expansion to decrease the dependency on imported electronics adhesives.
Some of the leading companies operating in the market are:
Recent Developments
Attribute | Details |
---|---|
Forecast Period | 2023 to 2033 |
Historical Data Available for | 2018 to 2022 |
Market Analysis | USD Billion for Value and Kilotons for Volume |
Key Regions Covered | North America; Latin America; Europe; East Asia; South Asia; Oceania; and the Middle East & Africa |
Key Countries Covered | USA, Canada, Germany, UK, France, Italy, Spain, Russia, China, Japan, South Korea, India, ASEAN, Oceania, Turkey, Northern Africa, and South Africa |
Key Segments Covered | Type, Application, End Use, and Region. |
Key Companies Profiled | 3M; Dymax Corporation; DOW Chemical Company; Henkel AG & Co. KGaA; H.B. Fuller Company (Royal Adhesives & Sealants LLC); Evonik Industries AG; Sika AG; Bostik AG; ThreeBond; Shin Etsu Silicones; Konishi Co, LTD.; TERAOKA SEISAKUSHO CO., LTD.; TOMOEGAWA; YAMATO Co., Ltd |
Report Coverage | Market Forecast, Brand Share Analysis, Competition Intelligence, DROT analysis, Market Dynamics and Challenges, and Strategic Growth Initiatives |
Customization & Pricing | Available upon Request |
Mobile & telecommunications sector holds high revenue potential.
The United States, India, and China dominate the global market.
The market is forecast to register a CAGR of 9% through 2033.
During 2018 to 2022, the market registered a CAGR of 6.5%.
The popularity of wireless devices are the current market trends.
1. Executive Summary
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Background
3.1. Market Dynamics
3.1.1. Drivers
3.1.2. Restraints
3.1.3. Opportunity
3.1.4. Trends
3.2. Scenario Forecast
3.2.1. Demand in Optimistic Scenario
3.2.2. Demand in Likely Scenario
3.2.3. Demand in Conservative Scenario
3.3. Opportunity Map Analysis
3.4. Investment Feasibility Matrix
3.5. PESTLE and Porter’s Analysis
3.6. Regulatory Landscape
3.6.1. By Key Regions
3.6.2. By Key Countries
3.7. Regional Parent Market Outlook
4. Global Market Analysis 2018 to 2022 and Forecast, 2023 to 2033
4.1. Historical Market Size Value (US$ Million) Analysis, 2018 to 2022
4.2. Current and Future Market Size Value (US$ Million) Projections, 2023 to 2033
4.2.1. Y-o-Y Growth Trend Analysis
4.2.2. Absolute $ Opportunity Analysis
5. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Material Type
5.1. Introduction / Key Findings
5.2. Historical Market Size Value (US$ Million) Analysis By Material Type, 2018 to 2022
5.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Material Type, 2023 to 2033
5.3.1. Polyurethane
5.3.2. Acrylics
5.3.3. Silicones
5.3.4. Epoxy
5.4. Y-o-Y Growth Trend Analysis By Material Type, 2018 to 2022
5.5. Absolute $ Opportunity Analysis By Material Type, 2023 to 2033
6. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Application
6.1. Introduction / Key Findings
6.2. Historical Market Size Value (US$ Million) Analysis By Application, 2018 to 2022
6.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By Application, 2023 to 2033
6.3.1. Thermal Management
6.3.1.1. Gap Fillers
6.3.1.2. Thermal Conductivity Solutions
6.3.1.3. Thermal Conductivity Insulators
6.3.1.4. Gap Pads
6.3.2. Conformal Coatings
6.3.3. Encapsulation
6.3.4. Surface Mounting
6.3.5. Wire Tacking
6.3.6. Soldering
6.3.7. Underfills
6.3.8. Sealing
6.3.9. Constructional
6.4. Y-o-Y Growth Trend Analysis By Application, 2018 to 2022
6.5. Absolute $ Opportunity Analysis By Application, 2023 to 2033
7. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By End Use
7.1. Introduction / Key Findings
7.2. Historical Market Size Value (US$ Million) Analysis By End Use, 2018 to 2022
7.3. Current and Future Market Size Value (US$ Million) Analysis and Forecast By End Use, 2023 to 2033
7.3.1. Mobiles and Telecommunication Devices
7.3.2. Desktops and Networks
7.3.3. Televisions
7.3.4. Home Appliances
7.3.5. Automotive Electronics
7.3.6. Aerospace Electronics
7.3.7. Analytical & Measurement Instruments
7.3.8. Other Industrial
7.4. Y-o-Y Growth Trend Analysis By End Use, 2018 to 2022
7.5. Absolute $ Opportunity Analysis By End Use, 2023 to 2033
8. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Region
8.1. Introduction
8.2. Historical Market Size Value (US$ Million) Analysis By Region, 2018 to 2022
8.3. Current Market Size Value (US$ Million) Analysis and Forecast By Region, 2023 to 2033
8.3.1. North America
8.3.2. Latin America
8.3.3. Western Europe
8.3.4. Eastern Europe
8.3.5. South Asia and Pacific
8.3.6. East Asia
8.3.7. Middle East and Africa
8.4. Market Attractiveness Analysis By Region
9. North America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
9.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
9.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
9.2.1. By Country
9.2.1.1. U.S.
9.2.1.2. Canada
9.2.2. By Material Type
9.2.3. By Application
9.2.4. By End Use
9.3. Market Attractiveness Analysis
9.3.1. By Country
9.3.2. By Material Type
9.3.3. By Application
9.3.4. By End Use
9.4. Key Takeaways
10. Latin America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
10.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
10.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
10.2.1. By Country
10.2.1.1. Brazil
10.2.1.2. Mexico
10.2.1.3. Rest of Latin America
10.2.2. By Material Type
10.2.3. By Application
10.2.4. By End Use
10.3. Market Attractiveness Analysis
10.3.1. By Country
10.3.2. By Material Type
10.3.3. By Application
10.3.4. By End Use
10.4. Key Takeaways
11. Western Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
11.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
11.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
11.2.1. By Country
11.2.1.1. Germany
11.2.1.2. U.K.
11.2.1.3. France
11.2.1.4. Spain
11.2.1.5. Italy
11.2.1.6. Rest of Western Europe
11.2.2. By Material Type
11.2.3. By Application
11.2.4. By End Use
11.3. Market Attractiveness Analysis
11.3.1. By Country
11.3.2. By Material Type
11.3.3. By Application
11.3.4. By End Use
11.4. Key Takeaways
12. Eastern Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
12.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
12.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
12.2.1. By Country
12.2.1.1. Poland
12.2.1.2. Russia
12.2.1.3. Czech Republic
12.2.1.4. Romania
12.2.1.5. Rest of Eastern Europe
12.2.2. By Material Type
12.2.3. By Application
12.2.4. By End Use
12.3. Market Attractiveness Analysis
12.3.1. By Country
12.3.2. By Material Type
12.3.3. By Application
12.3.4. By End Use
12.4. Key Takeaways
13. South Asia and Pacific Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
13.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
13.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
13.2.1. By Country
13.2.1.1. India
13.2.1.2. Bangladesh
13.2.1.3. Australia
13.2.1.4. New Zealand
13.2.1.5. Rest of South Asia and Pacific
13.2.2. By Material Type
13.2.3. By Application
13.2.4. By End Use
13.3. Market Attractiveness Analysis
13.3.1. By Country
13.3.2. By Material Type
13.3.3. By Application
13.3.4. By End Use
13.4. Key Takeaways
14. East Asia Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
14.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
14.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
14.2.1. By Country
14.2.1.1. China
14.2.1.2. Japan
14.2.1.3. South Korea
14.2.2. By Material Type
14.2.3. By Application
14.2.4. By End Use
14.3. Market Attractiveness Analysis
14.3.1. By Country
14.3.2. By Material Type
14.3.3. By Application
14.3.4. By End Use
14.4. Key Takeaways
15. Middle East and Africa Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country
15.1. Historical Market Size Value (US$ Million) Trend Analysis By Market Taxonomy, 2018 to 2022
15.2. Market Size Value (US$ Million) Forecast By Market Taxonomy, 2023 to 2033
15.2.1. By Country
15.2.1.1. GCC Countries
15.2.1.2. South Africa
15.2.1.3. Israel
15.2.1.4. Rest of MEA
15.2.2. By Material Type
15.2.3. By Application
15.2.4. By End Use
15.3. Market Attractiveness Analysis
15.3.1. By Country
15.3.2. By Material Type
15.3.3. By Application
15.3.4. By End Use
15.4. Key Takeaways
16. Key Countries Market Analysis
16.1. U.S.
16.1.1. Pricing Analysis
16.1.2. Market Share Analysis, 2022
16.1.2.1. By Material Type
16.1.2.2. By Application
16.1.2.3. By End Use
16.2. Canada
16.2.1. Pricing Analysis
16.2.2. Market Share Analysis, 2022
16.2.2.1. By Material Type
16.2.2.2. By Application
16.2.2.3. By End Use
16.3. Brazil
16.3.1. Pricing Analysis
16.3.2. Market Share Analysis, 2022
16.3.2.1. By Material Type
16.3.2.2. By Application
16.3.2.3. By End Use
16.4. Mexico
16.4.1. Pricing Analysis
16.4.2. Market Share Analysis, 2022
16.4.2.1. By Material Type
16.4.2.2. By Application
16.4.2.3. By End Use
16.5. Germany
16.5.1. Pricing Analysis
16.5.2. Market Share Analysis, 2022
16.5.2.1. By Material Type
16.5.2.2. By Application
16.5.2.3. By End Use
16.6. U.K.
16.6.1. Pricing Analysis
16.6.2. Market Share Analysis, 2022
16.6.2.1. By Material Type
16.6.2.2. By Application
16.6.2.3. By End Use
16.7. France
16.7.1. Pricing Analysis
16.7.2. Market Share Analysis, 2022
16.7.2.1. By Material Type
16.7.2.2. By Application
16.7.2.3. By End Use
16.8. Spain
16.8.1. Pricing Analysis
16.8.2. Market Share Analysis, 2022
16.8.2.1. By Material Type
16.8.2.2. By Application
16.8.2.3. By End Use
16.9. Italy
16.9.1. Pricing Analysis
16.9.2. Market Share Analysis, 2022
16.9.2.1. By Material Type
16.9.2.2. By Application
16.9.2.3. By End Use
16.10. Poland
16.10.1. Pricing Analysis
16.10.2. Market Share Analysis, 2022
16.10.2.1. By Material Type
16.10.2.2. By Application
16.10.2.3. By End Use
16.11. Russia
16.11.1. Pricing Analysis
16.11.2. Market Share Analysis, 2022
16.11.2.1. By Material Type
16.11.2.2. By Application
16.11.2.3. By End Use
16.12. Czech Republic
16.12.1. Pricing Analysis
16.12.2. Market Share Analysis, 2022
16.12.2.1. By Material Type
16.12.2.2. By Application
16.12.2.3. By End Use
16.13. Romania
16.13.1. Pricing Analysis
16.13.2. Market Share Analysis, 2022
16.13.2.1. By Material Type
16.13.2.2. By Application
16.13.2.3. By End Use
16.14. India
16.14.1. Pricing Analysis
16.14.2. Market Share Analysis, 2022
16.14.2.1. By Material Type
16.14.2.2. By Application
16.14.2.3. By End Use
16.15. Bangladesh
16.15.1. Pricing Analysis
16.15.2. Market Share Analysis, 2022
16.15.2.1. By Material Type
16.15.2.2. By Application
16.15.2.3. By End Use
16.16. Australia
16.16.1. Pricing Analysis
16.16.2. Market Share Analysis, 2022
16.16.2.1. By Material Type
16.16.2.2. By Application
16.16.2.3. By End Use
16.17. New Zealand
16.17.1. Pricing Analysis
16.17.2. Market Share Analysis, 2022
16.17.2.1. By Material Type
16.17.2.2. By Application
16.17.2.3. By End Use
16.18. China
16.18.1. Pricing Analysis
16.18.2. Market Share Analysis, 2022
16.18.2.1. By Material Type
16.18.2.2. By Application
16.18.2.3. By End Use
16.19. Japan
16.19.1. Pricing Analysis
16.19.2. Market Share Analysis, 2022
16.19.2.1. By Material Type
16.19.2.2. By Application
16.19.2.3. By End Use
16.20. South Korea
16.20.1. Pricing Analysis
16.20.2. Market Share Analysis, 2022
16.20.2.1. By Material Type
16.20.2.2. By Application
16.20.2.3. By End Use
16.21. GCC Countries
16.21.1. Pricing Analysis
16.21.2. Market Share Analysis, 2022
16.21.2.1. By Material Type
16.21.2.2. By Application
16.21.2.3. By End Use
16.22. South Africa
16.22.1. Pricing Analysis
16.22.2. Market Share Analysis, 2022
16.22.2.1. By Material Type
16.22.2.2. By Application
16.22.2.3. By End Use
16.23. Israel
16.23.1. Pricing Analysis
16.23.2. Market Share Analysis, 2022
16.23.2.1. By Material Type
16.23.2.2. By Application
16.23.2.3. By End Use
17. Market Structure Analysis
17.1. Competition Dashboard
17.2. Competition Benchmarking
17.3. Market Share Analysis of Top Players
17.3.1. By Regional
17.3.2. By Material Type
17.3.3. By Application
17.3.4. By End Use
18. Competition Analysis
18.1. Competition Deep Dive
18.1.1. 3M
18.1.1.1. Overview
18.1.1.2. Product Portfolio
18.1.1.3. Profitability by Market Segments
18.1.1.4. Sales Footprint
18.1.1.5. Strategy Overview
18.1.1.5.1. Marketing Strategy
18.1.2. Dymax Corporation
18.1.2.1. Overview
18.1.2.2. Product Portfolio
18.1.2.3. Profitability by Market Segments
18.1.2.4. Sales Footprint
18.1.2.5. Strategy Overview
18.1.2.5.1. Marketing Strategy
18.1.3. DOW Chemical Company
18.1.3.1. Overview
18.1.3.2. Product Portfolio
18.1.3.3. Profitability by Market Segments
18.1.3.4. Sales Footprint
18.1.3.5. Strategy Overview
18.1.3.5.1. Marketing Strategy
18.1.4. Henkel AG & Co. KGaA
18.1.4.1. Overview
18.1.4.2. Product Portfolio
18.1.4.3. Profitability by Market Segments
18.1.4.4. Sales Footprint
18.1.4.5. Strategy Overview
18.1.4.5.1. Marketing Strategy
18.1.5. H.B. Fuller Company (Royal Adhesives & Sealants LLC)
18.1.5.1. Overview
18.1.5.2. Product Portfolio
18.1.5.3. Profitability by Market Segments
18.1.5.4. Sales Footprint
18.1.5.5. Strategy Overview
18.1.5.5.1. Marketing Strategy
18.1.6. Evonik Industries AG
18.1.6.1. Overview
18.1.6.2. Product Portfolio
18.1.6.3. Profitability by Market Segments
18.1.6.4. Sales Footprint
18.1.6.5. Strategy Overview
18.1.6.5.1. Marketing Strategy
18.1.7. Sika AG
18.1.7.1. Overview
18.1.7.2. Product Portfolio
18.1.7.3. Profitability by Market Segments
18.1.7.4. Sales Footprint
18.1.7.5. Strategy Overview
18.1.7.5.1. Marketing Strategy
18.1.8. Bostik AG
18.1.8.1. Overview
18.1.8.2. Product Portfolio
18.1.8.3. Profitability by Market Segments
18.1.8.4. Sales Footprint
18.1.8.5. Strategy Overview
18.1.8.5.1. Marketing Strategy
18.1.9. ThreeBond
18.1.9.1. Overview
18.1.9.2. Product Portfolio
18.1.9.3. Profitability by Market Segments
18.1.9.4. Sales Footprint
18.1.9.5. Strategy Overview
18.1.9.5.1. Marketing Strategy
18.1.10. Shin Etsu Silicones
18.1.10.1. Overview
18.1.10.2. Product Portfolio
18.1.10.3. Profitability by Market Segments
18.1.10.4. Sales Footprint
18.1.10.5. Strategy Overview
18.1.10.5.1. Marketing Strategy
18.1.11. Konishi Co, LTD.
18.1.11.1. Overview
18.1.11.2. Product Portfolio
18.1.11.3. Profitability by Market Segments
18.1.11.4. Sales Footprint
18.1.11.5. Strategy Overview
18.1.11.5.1. Marketing Strategy
18.1.12. TERAOKA SEISAKUSHO CO., LTD.
18.1.12.1. Overview
18.1.12.2. Product Portfolio
18.1.12.3. Profitability by Market Segments
18.1.12.4. Sales Footprint
18.1.12.5. Strategy Overview
18.1.12.5.1. Marketing Strategy
18.1.13. TOMOEGAWA
18.1.13.1. Overview
18.1.13.2. Product Portfolio
18.1.13.3. Profitability by Market Segments
18.1.13.4. Sales Footprint
18.1.13.5. Strategy Overview
18.1.13.5.1. Marketing Strategy
18.1.14. YAMATO Co., Ltd
18.1.14.1. Overview
18.1.14.2. Product Portfolio
18.1.14.3. Profitability by Market Segments
18.1.14.4. Sales Footprint
18.1.14.5. Strategy Overview
18.1.14.5.1. Marketing Strategy
19. Assumptions & Acronyms Used
20. Research Methodology
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