The future of the automatic dicing saw market is looking bright, according to Future Market Insights. With a predicted value pool of US$ 1 billion by the end of 2023, this market is set to soar to new heights. But that's not all - the global demand for Automatic Dicing Saw is expected to rise at a CAGR of 7.2% to reach US$ 2 billion by 2033.
| Data Points | Key Statistics |
|---|---|
| Expected Market Value in 2023 | US$ 1 billion |
| Projected Market Value in 2033 | US$ 2 billion |
| Growth Rate (2023 to 2033) | 7.2% CAGR |
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Among the primary drivers of the automatic dicing saw market is the increasing demand for smartphones and other mobile devices. With the proliferation of mobile technology, there is a growing need for high-performance, low-power, and small-size semiconductors. The use of automatic dicing saws in the semiconductor manufacturing process allows for the efficient and precise cutting of wafers into individual chips, making it possible to produce smaller, more powerful chips for mobile devices.
The automatic dicing saw market is being driven by the growing demand for electric vehicles (EVs). EVs rely on a variety of semiconductor technologies, from power electronics and sensors to battery management systems and advanced driver assistance systems (ADAS). The use of automatic dicing saws in the manufacturing process enables the production of high-quality, reliable semiconductors, which are essential for the safe and efficient operation of EVs.
The automatic dicing saw market is also being driven by the increasing demand for precision manufacturing. With the growth of advanced technologies such as 5G, artificial intelligence (AI), and the internet of things (IoT), there is a growing need for high-precision, high-performance semiconductors. The use of automatic dicing saws in the manufacturing process enables manufacturers to produce chips with greater accuracy and precision, ensuring that they meet the demanding requirements of these advanced technologies.
The growing trend towards automation and Industry 4.0 is also driving the automatic dicing saw market. As manufacturers seek to improve efficiency and reduce costs, they are increasingly turning to automation and advanced manufacturing technologies. The use of automatic dicing saws is an essential part of this trend, as they allow for the efficient and precise cutting of wafers, making it possible to produce high-quality, reliable semiconductors at scale.
The demand will witness steady recovery in short-term, with optimistic growth outlook in the long-run. Growing semiconductor industry will amplify the opportunities in near future, and the application of automatic dicing saw in military & defense sector will provide momentum.
Principal Consultant
Automatic dicing saws are involved in cutting process controlled automatically through software programming. Various applications of the product include cutting semiconductor and ceramic materials into almost any shapes with straight edges.
The significant demand for dicing saw comes from electronics and semiconductor industry where gradual increase in mass production and sales of various wafer dicing saw products and chiller for semiconductor production per year across the world.
In addition to traditional applications in semiconductor industry, the adoption is growing in the automotive and defense sector. The product has significant application in power modules, MEMS & Sensors for the automotive, industrial, mobile and medical market.
Rising demand for number of semiconductor devices required for data centers and IoT and along with increasing self-driving cars, component manufacturing sector are some of the major factors to drive the automatic dicing saws sales.
With penetration of semiconductors in almost all industry verticals the market is anticipated to witness growth. Manufacturers are focused on reducing footprints while improving production capacities at the same time, hence sales are likely to improve over the course of the assessment period.
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Asia-Pacific being the major semiconductor components production hub in the world and is anticipated to remain so for the coming years. Growing initiatives by the Chinese government such as Vision 2020 have strongly drawn attention from the international players to set up local production establishments. China remains worlds’ leading semiconductor manufacturer and hence significant demand for dicing saws.
Another emerging country in the region, Vietnam, has witnessed the recent rise in customs duties on imported electronics is creating a critical role in attracting tier one players like Apple to set up local plants. Again, study by SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, suggested that more than 90% of the foundries constructed in the world during 2017 were situated in the Asia Pacific.
It is anticipated that most of these foundries are focused in Japan & China which is expected to open up better opportunities for the automatic dicing equipment in the long term.
Some of the leading product manufacturers in Europe are focused on supplying the smallest fully automatic Blade Dicers in the world, setting new standards with their small footprint and high-efficiency which is further creating opportunities for growth in the region.
Some of the leading manufacturers and suppliers of Automatic Dicing Saw include
Major OEM companies dealing in automatic dicing saw business are providing semi as well as fully automatic dicing saws to suit a wide range of application requirements, from semiconductor research and development, through to medium and high volume production applications. Suppliers offers the equipment with a variety of capabilities, configurations as well as levels of automation, as well as peripheral accessories and instrumentation, to cater to an ever-growing range of buyer requirements.
The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments.
The report also maps the qualitative impact of various market factors on market segments and geographies.
1. Executive Summary
2. Industry Introduction, including Taxonomy and Market Definition
3. Market Trends and Success Factors, including Macro-economic Factors, Market Dynamics, and Recent Industry Developments
4. Global Market Demand Analysis and Forecast, including Historical Analysis and Future Projections
5. Pricing Analysis
6. Global Market Analysis and Forecast
6.1. Type
6.2. Application
6.3. Dicing Blade
6.4. End-Use Industry
7. Global Market Analysis and Forecast, By Type
7.1. Semi - Automatic
7.2. Full - Automatic
8. Global Market Analysis and Forecast, By Application
8.1. Silicon wafers Dicing
8.2. Semiconductors Dicing
8.3. Glass sheets Dicing
8.4. Ceramic Dicing
8.5. Others
9. Global Market Analysis and Forecast, By Dicing Blade
9.1. Nickel-Bond Dicing Blades
9.2. Resin-Bond Dicing Blades
9.3. Metal Sintered Dicing Blades
10. Global Market Analysis and Forecast, By End-Use Industry
10.1. Electronics & Semiconductor
10.2. Military & Aerospace
10.3. Telecommunications
10.4. Universities
10.5. Passive Component Manufacturing
11. Global Market Analysis and Forecast, By Region
11.1. North America
11.2. Latin America
11.3. Europe
11.4. South Asia & Pacific
11.5. East Asia
11.6. Middle East & Africa
12. North America Sales Analysis and Forecast, by Key Segments and Countries
13. Latin America Sales Analysis and Forecast, by Key Segments and Countries
14. Europe Sales Analysis and Forecast, by Key Segments and Countries
15. South Asia & Pacific Sales Analysis and Forecast, by Key Segments and Countries
16. East Asia Sales Analysis and Forecast, by Key Segments and Countries
17. Middle East & Africa Sales Analysis and Forecast, by Key Segments and Countries
18. Sales Forecast by Type, Application, Dicing Blade, and End-Use Industry for 30 Countries
19. Competition Outlook, including Market Structure Analysis, Company Share Analysis by Key Players, and Competition Dashboard
20. Company Profile
20.1. DISCO Corporation
20.2. Dynatex International
20.3. TOKYO SEIMITSU
20.4. Loadpoint Micross Components
20.5. SR Co., Ltd
20.6. Advanced Dicing Technologies Ltd. (ADT)
20.7. Shenyang Heyan Technology Co., Ltd.
20.8. Accretech
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Automatic Dicing Saw Market
