The global advanced packaging market is anticipated to exhibit considerable growth at a CAGR of 7.2% in the forecast period between 2023 and 2033. The market is set to be valued at USD 30.5 billion in 2023. A valuation of USD 61.3 billion is expected for the global market by 2033.
Due to high demand from a variety of industries within the semiconductor sector, integrated circuit packaging has undergone continual change in terms of product attributes, integration, and energy efficiency.
Flip-chip and wafer-level packaging technologies have seen steady expansion over the years. This growth is attributed to their widespread use, particularly in high-end smartphones and tablets that must adhere to strict space and power management specifications.
Main purpose of the redistribution method was to enable fan-in area array packaging when just a small number of chips were required for the array. Since then, various innovative packaging technologies such as through-silicon via (TSV)-based interposers, wafer-level packaging, chip stacks, and fan-out packaging have all benefited greatly from this methodology.
Fan-out wafer-level packaging (FOWLP), which aims to fulfill the escalating demand for consumer electronics devices, has become a promising technology. Specific features of this type of packaging such as substrate-less packaging and low thermal resistance have made it immensely popular worldwide.
Importantly, it enables incredible performance thanks to its thin-film metallization-based direct integrated circuit connection and short interconnects. It does not make use of standard wire bonding or flip-chip bumps. It also has mild parasitic effects.
Fan-out wafer-level packaging is one of the most prominent packaging innovations in the microelectronics sector. Large substrate formats are being addressed with multiple technological developments for heterogeneous integration with the aid of this packaging.
It incorporates multiple die packaging, package-on-package approaches, passive component integration in packages & redistribution layers. As a result, it is ideal for squeezing in a super capacitor for energy storage along with a piezo-based harvester and power control unit to create a highly miniaturized energy harvester system.
| Attributes | Key Insights |
|---|---|
| Advanced Packaging Market Estimated Size (2023E) | USD 30.5 billion |
| Projected Market Valuation (2033F) | USD 61.3 billion |
| Value-based CAGR (2023 to 2033) | 7.2% |
| CAGR of the USA Market (2023 to 2033) | 6.6% |
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As per Future Market Insights, a renowned market research firm, from 2018 to 2022, the advanced packaging market surged at around 8.1% CAGR. The market is likely to be valued at USD 61.3 billion by 2033 and create an absolute dollar opportunity of USD 30.8 billion.
In order to reduce associated costs and improve the overall throughput and performance of integrated circuits, advanced packaging technology has developed. Demand for sophisticated packaging has elevated significantly in recent years due to rising deployment of semiconductor integrated circuits in automobiles.
An improvement in the functional density of large system-on-chip solutions is tied to improvements in packaging technologies. The chip industry has hence created a new set of solutions called advanced packaging in response to the emphasis on heterogeneous integrations and wafer-level packages.
The market for advanced packaging is being significantly impacted by growth in silicon size from 100 mm to 300 mm. Extended diameter wafers have lowered manufacturing costs by 20% to 25%, which is anticipated to spur investment in innovative packaging technologies.
| Attributes | Key Insights |
|---|---|
| Historical CAGR | 8.1% |
| Historical Market Value (2022) | USD 28.3 billion |
| Forecast CAGR | 7.2% |
Miniaturization of Electronics Devices to Augur Well by 2033
As compared to traditional semiconductor packaging, advanced packaging is gaining immense popularity across the globe. Miniaturization of electronics devices is helping advanced packaging sales to escalate worldwide.
High adoption of micro-electromechanical systems (MEMS) is further set to push sales of embedded die packaging solutions. Although the technology is not new, it has been specialized for niche uses owing to its high cost and limited yield. But, it has enormous potential for growth in the forecast period. Investments in the technology may increase as a result of developments in Bluetooth and radio frequency modules, as well as emergence of WiFi-6.
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Key Players in the USA to Expand their Advanced Packaging Solutions Manufacturing Capacities
The USA advanced packaging market is expected to reach a valuation of USD 9.9 billion by 2033. It is anticipated to exhibit 6.6% CAGR from 2023 to 2033. Key players in the USA are setting up fabrication facilities in the country for research and development activities.
They are striving to come up with advanced packaging technologies such as flip chip scale package, flip chip ball grid array, and fan-out wafer-level packaging. For instance, in May 2021, Intel Corporation announced that it invested USD 3.5 billion in New Mexico in order to work on advanced packaging technologies and advanced packaging.
Intel also developed Foveros, which is its breakthrough 3D technology. This technology will provide the company with increased computing performance. Such advancements in the USA are projected to create new growth opportunities for advanced packaging manufacturers.
Demand for Advanced Box and Packaging Solutions to Boom in the United Kingdom with Presence of Key Companies
The United Kingdom advanced packaging market is expected to be valued at USD 1.7 billion by 2033. Between 2023 and 2033, the country is set to showcase a CAGR of 5.6%, says Future Market Insights. It is likely to create an incremental opportunity of about USD 712.8 million throughout the assessment period.
Key companies based in the United Kingdom are estimated to develop new technologies to attract a large client base. In June 2019, for instance, WHP Engineering was given the task of building cleanrooms in Oxfordshire (United Kingdom) by Satellite Applications Catapult. WHP will work on the contract to expand a top-notch satellite manufacturing facility that aids the country’s space sector.
WHP's solution entails the delivery of an ISO Class 7 compliant cleanroom. It was developed by using 3D Building Information Modeling (BIM) modeling techniques to help finalize DISC’s need for a wide range of facilities. It will be utilized to finalize process & key utilities systems, machinery components, and architecture.
Semiconductor Manufacturers in China to Look for Advanced Flexible Packaging
China advanced packaging industry is expected to be worth USD 15.5 billion by 2033. It is estimated to witness a significant CAGR of around 8.7% between 2023 and 2033. As per Future Market Insights, the country exhibited a CAGR of 10.3% from 2018 to 2022.
Given the rising demand from data centers and artificial intelligence, manufacturers in China are concentrating on expanding their clientele across North America. Presence of various semiconductor manufacturers in the country is another crucial factor that would augment advanced packaging demand. To meet the high demand from fabless vendors, the country’s pure-play manufacturers are expanding their production capacity.
High Demand for Fast-charging Integrated Circuits in South Korea to Push Sales of Electronic Chips
In 2033, South Korea advanced packaging market is expected to be worth USD 3.7 billion. The country is set to create an incremental opportunity of around USD 1.9 billion in the next ten years, finds Future Market Insights.
South Korea-based companies are expected to draw a large client base by developing new technologies. In February 2020, for instance, HANA Micron, a semiconductor company headquartered in South Korea, used the wafer-level packaging process to expand the thickness of wiring by four times in a chip. The company aims to use this process to make fast-charging integrated circuits.
Advanced Packaging Technologies to Gain Impetus amid High Demand for Consumer Electronics
Based on end user, the consumer electronics segment is anticipated to dominate the global advanced packaging market in the next ten years. As per Future Market Insights, the segment is anticipated to exhibit a CAGR of around 7.0% from 2023 to 2033. It had witnessed a considerable CAGR of 7.7% during the historical period between 2018 and 2022.
Surging trend for advanced connected homes is projected to boost sales of consumer electronics. Various appliances equipped with new features such as Wi-Fi connectivity, Bluetooth, and voice assistance are set to be highly popular among millennials. With rising level of income worldwide, need to equip one’s home with latest technology-based products is surging. These factors would positively influence sales of advanced packaging for consumer electronics.
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Ten to fifteen big firms presently controlling the global advanced packaging market include Intel Corporation, ASE Technology Holding Co. Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., Amkor Technology Inc., Nepes Corporation, ChipMOS Technologies, Inc., Powertech Technology Inc., China Wafer Level CSP Co., Ltd., King Yuan Electronics Corp., HANA Micron Inc., and FlipChip International LLC among others.
The market is predominantly driven by half way point revenue due to the requirement for cutting-edge technology and quick-responding devices. Given the increasing need for unique solutions for numerous applications, these companies have a persistent competitive edge in this market. The industry is expected to benefit from ongoing advancements in tablets, smartphones, wireless communications, and other technologies.
Few of the recent developments in the advanced packaging market are
| Attribute | Details |
|---|---|
| Estimated Market Size (2023) | USD 30.5 billion |
| Projected Market Valuation (2033) | USD 61.3 billion |
| Value-based CAGR (2023 to 2033) | 7.2% |
| Forecast Period | 2023 to 2033 |
| Historical Data Available for | 2018 to 2022 |
| Market Analysis | Value (USD billion) |
| Key Regions Covered | North America; Latin America; Europe; East Asia; South Asia; and the Middle East & Africa |
| Key Countries Covered | USA, Canada, Brazil, Mexico, Germany, United Kingdom, France, Italy, Spain, Nordic, Russia, Poland, China, India, Thailand, Indonesia, Australia and New Zealand, Japan, Gulf Cooperation Council countries, North Africa, South Africa, others. |
| Key Segments Covered | Type, End User, Region |
| Key Companies Profiled | Amkor Technology Inc.; ASE Technology Holding Co. Ltd.; China Wafer Level CSP Co. Ltd.; ChipMOS Technologies Inc.; FlipChip International LLC; HANA Micron Inc.; Jiangsu Changjiang Electronics Technology Co. Ltd.; King Yuan Electronics Corp.; Nepes Corporation; Powertech Technology Inc. |
| Report Coverage | Market Forecast, Company Share Analysis, Competitive Landscape, Market Dynamics and Challenges, and Strategic Growth Initiatives |
The advanced packaging market is worth USD 30.5 billion in 2023.
The advanced packaging market is expected to thrive at a 7.2% CAGR through 2033.
The consumer electronics segment is leading the market with a 7.0% CAGR through 2033.
South Korea’s advanced packaging market size is poised to reach USD 3.7 billion by 2033.
Japan’s advanced packaging market may rise at a 10.3% CAGR through 2033.
1. Executive Summary | Advanced Packaging Market 2. Market Overview 3. Market Background 4. Global Market Analysis 2018 to 2022 and Forecast, 2023 to 2033 5. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Type 5.1. Flip Chip Scale Package 5.2. Flip-Chip Ball Grid Array 5.3. Wafer Level Chip Scale Package 5.4. 5D/3D 5.5. Fan Out Wafer-level Packaging 5.6. Others 6. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By End User 6.1. Consumer Electronics 6.2. Automotive 6.3. Industrial 6.4. Healthcare 6.5. Aerospace & Defense 6.6. Others 7. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Region 7.1. North America 7.2. Latin America 7.3. Europe 7.4. Asia Pacific 7.5. Middle East and Africa 8. North America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 9. Latin America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 10. Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 11. Asia Pacific Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 12. Middle East and Africa Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country 13. Key Countries Market Analysis 14. Market Structure Analysis 15. Competition Analysis 15.1. Amkor Technology Inc. 15.2. ASE Technology Holding Co. Ltd. 15.3. China Wafer Level CSP Co., Ltd. 15.4. ChipMOS Technologies, Inc. 15.5. FlipChip International LLC 15.6. HANA Micron Inc. 15.7. Jiangsu Changjiang Electronics Technology Co., Ltd. 15.8. King Yuan Electronics Corp. 15.9. Nepes Corporation 15.10. Powertech Technology, Inc. 16. Assumptions & Acronyms Used 17. Research Methodology
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Advanced Packaging Market
